Patents by Inventor Wei Tsai

Wei Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080107080
    Abstract: A communication system is provided. The system comprises: a set of access points (APs) under tracking; and a table comprising a set of pairs comprising AP_ID, and channel frequency. The channel frequency is associated with an AP among the set of APs identified by AP_ID and the AP is tracked. The set of APs is in a physical neighborhood proximate to a mobile terminal. The mobile terminal is equipped with means to scan channels to discover a specific AP with the best signal quality for communicating between the mobile terminal and the specific AP.
    Type: Application
    Filed: October 11, 2007
    Publication date: May 8, 2008
    Inventor: Wei Tsai
  • Publication number: 20060012040
    Abstract: A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the substrate. The nonconductive adhesive is disposed on the upper surface of the first chip. The second chip has an upper surface and a lower surface opposite to the upper surface, wherein the lower surface is mounted on the upper surface of the first chip by means of the nonconductive adhesive, and the adherent area between the nonconductive adhesive and the second chip is larger than 90% of the area of the lower surface of the second chip. The supporting balls are disposed in the nonconductive adhesive for supporting the second chip.
    Type: Application
    Filed: February 9, 2005
    Publication date: January 19, 2006
    Applicant: ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
    Inventors: Kuo Sun, Chia Yang, Hung Yu, Wei Tsai, Yi Lin
  • Patent number: 4479100
    Abstract: A customizable impedance matching network for coupling a microwave transmission line to an FET. The network includes a plurality of conductive pads formed on the first surface of a dielectric substrate each pad providing in combination with the substrate and a conductor formed on an opposite surface of the substrate, a predetermined capacitance. Selective ones of such conductive pads are interconnected in parallel to form a capacitor having a capacitance related to the total surface area of such interconnected conductive pads, to provide the requisite capacitive reactance for the network. The network further includes a strip conductor formed on such first surface having a predetermined inductance per unit length and having a first end electrically connected to the network.
    Type: Grant
    Filed: May 27, 1982
    Date of Patent: October 23, 1984
    Assignee: Raytheon Company
    Inventors: Sanjay B. Moghe, Roger E. Gray, Wei Tsai