Abstract: Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.

Abstract: Aspects of the disclosure provide a method, an apparatus, and a non-transitory computer-readable storage medium for video decoding. The apparatus can include processing circuitry. The processing circuitry is configured to decode neural network update information in a coded bitstream for a neural network in a video decoder. The neural network is configured with pretrained parameters. The neural network update information corresponds to an encoded image to be reconstructed and indicates a replacement parameter corresponding to a pretrained parameter in the pretrained parameters. The processing circuitry is configured to update the neural network in the video decoder based on the replacement parameter. The processing circuitry is configured to decode the encoded image based on the updated neural network for the encoded image.

Abstract: Methods are provided for the production of photoreceptor cells and photoreceptor progenitor cells from pluripotent stem cells. Additionally provided are compositions of photoreceptor cells and photoreceptor cells, as well as methods for the therapeutic use thereof. Exemplary methods may produce substantially pure cultures of photoreceptor cells and/or photoreceptor cells.

Abstract: A method for controlling an autonomous vehicle including: obtaining trip information of a current trip of a user of the autonomous vehicle and historical traffic information related to the current trip; selecting an autonomous driving (AD) mode that is suitable for the current trip from a plurality of pre-defined AD modes; comparing time required for the autonomous vehicle to complete a portion of the current trip in the selected AD mode with historical average time to complete the portion of the current trip, the historical average time being acquired based on the historical traffic information; and dynamically adjusting driving of the autonomous vehicle based on the comparison to minimize the difference between the time required for the autonomous vehicle to complete the portion of the current trip in the selected AD mode and the historical average time.

Abstract: A projection apparatus with an automatic adjustment function and an automatic projection adjustment method thereof are provided. The projection apparatus includes a control device, a projection device and a ranging device. The projection device is coupled to the control device. The ranging device is coupled to the control device. The control device operates the ranging device to perform multi-point ranging within a projection range of the projection device and on a projection surface. The control device determines whether a position of the projection range is suitable for projection according to a plurality of first distance values of a plurality of detection points provided by the ranging device, so as to adjust the projection range. The projection apparatus has an effect of accurate and automatic projection adjustment.

Abstract: Aspects of the disclosure provide a method and an apparatus for video encoding. The apparatus includes processing circuitry configured to generate an initial feature representation from an input image to be encoded and perform an iterative update of values of a plurality of elements in the initial feature representation. The iterative update includes generate a coded representation corresponding to a final feature representation based on the final feature representation that has been updated from the initial feature representation by a number of iterations of the iterative update. A reconstructed image corresponding to the final feature representation is generated based on the coded representation. An encoded image corresponding to the final feature representation having updated values of the plurality of elements is generated. One of (i) a rate-distortion loss corresponding to the final feature representation or (ii) the number of iterations of the iterative update satisfies a pre-determined condition.

Abstract: The disclosure provides a pattern collapse free wet clean process for fabricating semiconductor devices. By performing post reactive ion etching (RIE) using a fluorine-containing gas such as C2F6, followed by cleaning in a single wafer cleaner (SWC) with diluted hydrofluoric acid (HF) or in a solution of ammonia and HF, a substrate with multiple pattern collapse free high aspect ratio shallow trench isolation (STI) features can be obtained.

Abstract: Aspects of the disclosure provide a method, an apparatus, and a non-transitory computer-readable storage medium for video decoding. The apparatus can include processing circuitry. The processing circuitry is configured to decode first neural network update information in a coded bitstream for a first neural network in the video decoder. The first neural network is configured with first pretrained parameters. The first neural network update information corresponds to a first block in an image to be reconstructed and indicates a first replacement parameter corresponding to a first pretrained parameter in the first pretrained parameters. The processing circuitry is configured to update the first neural network in the video decoder based on the first replacement parameter. The processing circuitry can decode the first block based on the updated first neural network for the first block.

Abstract: Implementations of a semiconductor device may include a semiconductor die including a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of a permanent die support structure, a temporary die support structure, or any combination thereof coupled to one of the first largest planar surface, the second largest planar surface, the thickness, or any combination thereof where the semiconductor die may be coupled with one of a substrate, a leadframe, an interposer, a package, a bonding surface, or a mounting surface. The thickness may be between 0.1 microns and 125 microns.

Abstract: A method of forming a semiconductor structure includes forming a fin structure having a stack of alternating first semiconductor layers and second semiconductor layers over a substrate, forming cladding layers along sidewalls of the fin structure, forming a dummy gate stack over the cladding layers, and forming source/drain (S/D) features in the fin structure and adjacent to the dummy gate stack. The method further includes removing the dummy gate stack to form a gate trench adjacent to the S/D features, removing the cladding layers to form first openings along the sidewalls of the fin structure, where the first openings extend to below the stack, removing the first semiconductor layers to form second openings between the second semiconductor layers and adjacent to the first openings, and subsequently forming a metal gate stack in the gate trench, the first openings, and the second openings.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: Semiconductor structures and methods of the forming the same are provided. A semiconductor structure according to the present disclosure includes a source feature and a drain feature, an active region between the source feature and the drain feature, a gate structure over the active region, a frontside interconnect structure disposed over the source feature, the drain feature, and the gate structure, a backside interconnect structure disposed below the source feature, the drain feature, and the gate structure, and a storage element disposed in the backside interconnect structure.

Abstract: A touch control structure is provided. The touch control structure includes a plurality of touch electrodes in a touch control area and a plurality of touch signal lines in a peripheral area. A respective one of the plurality of touch signal lines comprises a double-layer structure in a double-layer region and a single-layer structure in a single-layer region. The double-layer region and the single-layer region are in a first sub-area of the peripheral area where the plurality of touch signal lines connect to an integrated circuit. A plurality of adjacent double-laver structures in the double-layer region are respectively connected to a plurality of adjacent single-layer structures in the single-layer region. At least two of the plurality of adjacent single-layer structures are respectively in a first layer and a second layer. The touch control structure further comprises a touch insulating layer between the first layer and the second layer.

Abstract: An electrode-modified heavy metal ion microfluidic detection chip, comprising a microfluidic module (1) and a three-electrode sensor (2), wherein the microfluidic module (1) is integrally molded by 3D printing, and the interior thereof has a microchannel (10) and a sensor slot (11); and the three-electrode sensor (2) comprises three electrodes (21, 22, 23) printed on a card-shaped bottom plate (20), among which the working electrode (21) is a porous nano-NiMn2O4 modified bare carbon electrode, and the three-electrode sensor (2) is inserted into the sensor slot (11) that matches same to form the microfluidic detection chip.

Abstract: An optical substrate and a display device are provided. The optical substrate includes a light guide plate and a plurality of light selection units, wherein, the light guide plate includes a light-incident surface and a light-exiting surface, and the light-exiting surface includes a plurality of light-exiting regions; each light selection unit is configured to select light incident from the light-incident surface and propagating in the light guide plate, such that monochromatic light of different colors are emitted from multiple light-exiting regions corresponding to the each light selection unit, and each of the multiple light-exiting regions emits monochromatic light of a single color.

Abstract: The present disclosure falls within the field of biomedical technology, and in particular relates to modified oligonucleotides and a compound that can be used for synthesizing same and a method for modifying oligonucleotides. The present disclosure also relates to the use of the modified oligonucleotides for preventing and/or treating diseases associated with the liver in a subject.

Abstract: A distributed industrial energy operation optimization platform which is capable of automatically constructing intelligent models and algorithms, is divided into three parts: a modeling terminal, a background service and a human-computer interface. The models like data pre-processing, energy generation-consumption-storage trend forecasting and optimal scheduling decision models are encapsulated in the modeling terminal as different visualization modules facing with multiple categories production scenarios, by dragging which the complex functional models can be realized conveniently. The background service is capable of automatically constructing the training samples and the production plans/manufacturing signals series according to the device model requirements of each edge side, interacts with the trained intelligent models through corresponding interfaces, and the computing results are saved in the specified relational database.

Abstract: A digital sensor for pre-warning of multistage breakage-triggered deformation threshold includes first tension rods, second tension rods, an RFID chip, and a brittle fracture module; the brittle fracture module includes a bottom plate and a plurality of resistors, where two ends of the bottom plate are fixed to the first and second tension rods, and the plurality of resistors forming a lumped parallel circuit are parallelly arranged on the bottom plate; the RFID chip is connected to two ends of the lumped parallel circuit. Strength of the middle cross section of the bottom plate is reduced in the way. The bottom plate will be fractured by being tensioned when the first tension rods and the second tension rods move away from each other with the deformation of the tension members. The resistors are connected into the lumped parallel circuit through brittle wires with different preset slack amounts.

Abstract: In this work, we investigated the blood platelet adhesion and activation of truly superhemophobic surfaces and compared them with that of hemophobic surfaces and hemophilic surfaces. Our analysis indicates that only those superhemophobic surfaces with a robust Cassie-Baxter state display significantly lower platelet adhesion and activation. The understanding gained through this work will lead to the fabrication of improved hemocompatible, superhemophobic medical implants.