Abstract: The present disclosure relates to a rear sub-frame assembly, applied to an electric vehicle main body, and rear sub-frame assembly comprises a rear sub-frame main body and positioning supports, rear sub-frame main body is bilateral symmetry structure; vehicle body connecting parts connected with rear sub-frame main body on upper portion of rear sub-frame main body, and battery pack guard plate connecting parts connected with rear sub-frame main body on lower portion of rear sub-frame main body are constructed on rear sub-frame main body, stabilizing rod mounting parts, upper control arm mounting parts and lower control arm mounting parts are further arranged on rear sub-frame main body respectively; the quantity of positioning supports respectively arranged close to left end and right end of rear sub-frame main body is two, and positioning parts matched with external positioning members to position rear sub-frame main body are constructed on two positioning supports respectively.

Abstract: The present disclosure relates to a semiconductor device and a fabrication method thereof. The semiconductor device includes a substrate, a first nitride semiconductor layer disposed on the substrate, a second nitride semiconductor layer disposed on the first nitride semiconductor layer and having a bandgap greater than that of the first nitride semiconductor layer. The semiconductor device further includes a first gate conductor disposed on a first region of the second nitride semiconductor layer, a passivation layer covering the first gate conductor, and a second gate conductor disposed on the passivation layer and on a second region of the second nitride semiconductor layer, wherein the first region is laterally spaced apart from the second region.

Abstract: The present disclosure relates to a semiconductor device and a fabrication method thereof. The semiconductor device includes a substrate, a first nitride semiconductor layer disposed on the substrate, a second nitride semiconductor layer disposed on the first nitride semiconductor layer and having a bandgap greater than that of the first nitride semiconductor layer. The semiconductor device further includes a first gate conductor disposed on a first region of the second nitride semiconductor layer, a first source electrode disposed on a first side of the first gate conductor, a first field plate disposed on a second side of the first gate conductor; and a capacitor having a first conductive layer and a second conductive layer and disposed on a second region of the second nitride semiconductor layer. Wherein the first conductive layer of the capacitor and the first source electrode have a first material, and the second conductive layer of the capacitor and the first field plate have a second material.

Abstract: A method includes forming a bottom layer over a semiconductor substrate, where the bottom layer includes a polymer bonded to a first cross-linker and a second cross-linker, the first cross-linker being configured to be activated by ultraviolet (UV) radiation and the second cross-linker being configured to be activated by heat at a first temperature. The method then proceeds to exposing the bottom layer to a UV source to activate the first cross-linker, resulting in an exposed bottom layer, where the exposing activates the first cross-linker. The method further includes baking the exposed bottom layer, where the baking activates the second cross-linker.

Abstract: A recombinant protein and a vaccine composition for porcine epidemic diarrhea (PED) are provided. The recombinant protein is a fusion protein formed by connecting the truncated segment of S protein (Spike protein) from porcine epidemic diarrhea virus (PEDV) in tandem with the Fc fragment of porcine IgG, and the truncated fragment of S protein is preferably selected from N-terminal domain (NTD) with sialic acid binding activity in S1 subunit of S protein, neutralizing epitope domain (COE) and multiple B-cell epitopes in S2 subunit; the vaccine composition contains recombinant protein and adjuvants. The recombinant protein of the application can produce IgG antibody and neutralizing antibody titers of rather high level after immunizing mice, and the proportions of CD3+CD4+, CD3+CD8+ lymphocytes and the concentrations of IFN-? and IL-4 in lymphocytes are significantly increased.

Abstract: Method and apparatus embodiments can generate a volume fluorescence image of a tooth. Method and apparatus embodiments can project structured light patterns onto a tooth and generate a contour (volume) image of the tooth surface from acquired corresponding structured light projection images; then acquire one or more fluorescence images of the tooth generated under blue-UV illumination. A composite image that shows fluorescence image content mapped to the generated contour image can be transmitted, stored, modified and/or displayed.

Abstract: A method for fabricating a chip scale package, comprising: providing a wafer; applying a polymer resin on at least part of a first surface of the wafer and to one or more sides of the wafer; and applying a compression mold on at least part of a second surface of the wafer and to one or more sides of the wafer, said first and second surfaces opposing each other.

Abstract: A touch response method of a touch display device is provided. The touch display device includes a data buffer. The method includes: acquiring touch data generated based on a touch operation of a user on the touch display device; controlling the data buffer to buffer the touch data according to a target mode; the target mode including a single-frame first-in first-out mode or a line buffer mode; and converting a frame rate of the touch data in the data buffer based on a target frame-rate processing format.

Abstract: A signal transmission method, a signal transmission apparatus and a display device are provided which belonging to the field of display technology. The signal transmission method is applied to a signal sender, the signal sender includes a first interface, a point-to-point connection is established between the first interface and a second interface of a signal receiver, the signal transmission method includes: sending a non-periodic training signal to the second interface via the first interface in an interval of transmission of pixel data. EMI generated during data transmission is reduced by using a technical solution of the present disclosure.

Abstract: A focusing device includes a fixing base, a screw rod, a focusing gear, a height adjusting ring, and a focusing ring. A first through hole is defined in the fixing base, the screw rod with a first thread is movably mounted on the fixing base. The focusing gear is also mounted on the fixing base and defines a third through hole corresponding to the first through hole. An outer wall of the focusing gear has an engaging portion meshing with the first thread. The focusing ring is movably received in the third through hole and located on a side of the height adjusting ring away from the fixing base. The height adjusting ring can adjust a distance between the focusing ring and a lens module to avoid distortion of an optical lens in any circumstances during focusing.

Abstract: A conductive structure, includes: a plurality of conductive layers; a plurality of conductive pillars being formed on the plurality of conductive layers, respectively; and a molding compound laterally coating the plurality of conductive pillars. Each of the plurality of conductive pillars is a taper-shaped conductive pillar, and is tapered from the conductive layers.

Abstract: An air disinfection device includes a shell having entry and exhaust ports, a power supply installed above the shell, and a dust collecting cylinder installed on the shell, connected to a negative electrode of the power supply, and having air inlet and outlet. The air inlet and the air outlet are communicated with the entry port and the exhaust port, respectively. The conductive rod has one end installed above the shell and connected to a positive electrode of the power supply, and the other end located in the dust collecting cylinder and close to the air inlet. An arrangement direction of the conductive rod is consistent with an axis direction of the dust collecting cylinder. The power supply provides high-voltage current to the conductive rod to form a symmetrically distributed high-voltage electrostatic field inside the dust collecting cylinder to sterilize and disinfect air passing through the dust collecting cylinder.

Abstract: A semiconductor device according to the present disclosure includes a first source/drain feature, a second source/drain feature, a third source/drain feature, a first dummy fin disposed between the first source/drain feature and the second source/drain feature along a direction to isolate the first source/drain feature from the second source/drain feature, and a second dummy fin disposed between the second source/drain feature and the third source/drain feature along the direction to isolate the second source/drain feature from the third source/drain feature. The first dummy fin includes an outer dielectric layer, an inner dielectric layer over the outer dielectric layer, and a first capping layer disposed over the outer dielectric layer and the inner dielectric layer. The second dummy fin includes a base portion and a second capping layer disposed over the base portion.

Abstract: Systems and methods for routing communication among a plurality of devices are described. In an example, a controller can detect a communication initiated from a first device to a target device among a second device and a third device. The controller can identify the second device as the target device. The controller can, in response to identifying the second device as the target device, activate a direct communication path between the first device and the second device to allow the first device to communicate with the second device using direct communication mode. The controller can, in response to identifying the second device as the target device, activate redriver path between the first device and the third device to allow the first device to communicate with the third device using redriver mode.

Abstract: A semiconductor device includes a program word line and a read word line over an active region. Each of the program word line and the read word line extends along a line direction. Moreover, the program word line engages a first transistor channel and the read word line engages a second transistor channel. The semiconductor device also includes a first metal line over and electrically connected to the program word line and a second metal line over and electrically connected to the read word line. The semiconductor device further includes a bit line over and electrically connected to the first active region. Additionally, the program word line has a first width along a channel direction perpendicular to the line direction; the read word line has a second width along the channel direction; and the first width is less than the second width.

Abstract: A method of forming a redistribution structure includes providing a dielectric layer. The dielectric layer is patterned to form a plurality of via openings. A seed layer is formed on the dielectric layer and filling in the plurality of via openings. A patterned conductive layer is formed a on the seed layer, wherein a portion of the seed layer is exposed by the patterned conductive layer. The portion of the seed layer is removed by using an etching solution, thereby forming a plurality of conductive lines and a plurality of vias. During the removing the portion of the seed layer, an etch rate of the patterned conductive layer is less than an etch rate of the seed layer.

Abstract: Semiconductor devices having improved source/drain features and methods for fabricating such are disclosed herein. An exemplary device includes a semiconductor layer stack disposed over a mesa structure of a substrate. The device further includes a metal gate disposed over the semiconductor layer stack and an inner spacer disposed on the mesa structure of the substrate. The device further includes a first epitaxial source/drain feature and a second epitaxial source/drain feature where the semiconductor layer stack is disposed between the first epitaxial source/drain feature and the second epitaxial source/drain feature. The device further includes a void disposed between the inner spacer and the first epitaxial source/drain feature.

Abstract: Aspects of the disclosure provide a method and an apparatus for video encoding. The apparatus includes processing circuitry configured to perform an iterative update of sample values of a plurality of samples in an initial input image. The iterative update includes generating a coded representation of a final input image based on the final input image by an encoding neural network (NN) and at least one training module. The final input image has been updated from the initial input image by a number of iterations of the iterative update. The iterative update includes generating a reconstructed image of the final input image based on the coded representation of the final input image by a decoding NN. One of a rate-distortion loss for the final input image or the number of iterations of the iterative update satisfies a pre-determined condition. An encoded image corresponding to the final input image is generated.

Abstract: A semiconductor device and method of fabricating thereof where the device includes a fin structure between a first isolation region and a second isolation region. A first source/drain feature is formed over a recessed portion of the first fin structure. The first source/drain feature interfaces a top surface of the first isolation region for a first distance and interfaces the top surface of the second isolation region for a second distance. The first distance is different than the second distance. The source/drain feature is offset in a direction.

Abstract: The disclosure relates to a detection method and a detection apparatus, the method including: calculating, when a location base station in an ultra-wideband location system receives a pulse response, values of a plurality of specified pulse response characteristics using the received pulse response, and using the calculated values as values of the plurality of specified pulse response characteristics of the location base station; calculating differences between the values of the plurality of specified pulse response characteristics of the location base station and values of the plurality of specified pulse response characteristics of the location base station at a previous time, and using the calculated differences as variations of the plurality of specified pulse response characteristics of the location base station; determining, based on at least the variations of the plurality of specified pulse response characteristics of the location base station and by means of a trained classifier, whether signal propa