Abstract: A protective film thickness measuring method includes a step of applying light to a top surface of a wafer in a state in which no protective film is formed and measuring a first reflection intensity of the light reflected from the top surface, a step of forming the protective film including a light absorbing material, a step of irradiating the protective film with exciting light of a wavelength at which the light absorbing material fluoresces and measuring a second reflection intensity including fluorescence of the protective film and the light reflected from the top surface, and a step of excluding reflection intensity of patterns formed on the top surface, by subtracting the measured first reflection intensity from the measured second reflection intensity, and calculating fluorescence intensity of the protective film.

Abstract: An operational amplifier includes a first amplifying unit, a second amplifying unit, a current source, a first compensation capacitor, and a second compensation capacitor. The first amplifying unit includes a first input transistor, a second input transistor, a third input transistor, and a fourth input transistor. The second amplifying unit includes a fifth input transistor, a sixth input transistor, a seventh input transistor, and an eighth input transistor. One end of the first compensation capacitor is coupled to a drain of the seventh input transistor, and the other end of the first compensation capacitor is coupled to a gate of the eighth input transistor. One end of the second compensation capacitor is coupled to a drain of the eighth input transistor, and the other end of the second compensation capacitor is coupled to a gate of the seventh input transistor.

Abstract: Aspects of the invention disclose an external and an add-on anamorphic lens, which comprises a focus group and an anamorphic group disposed in sequence from an object side to an image side along the optical axis. The focus group comprises a first lens and a second lens. The first lens and the second lens are spherical lenses. The anamorphic group includes a third lens, a fourth lens, and a fifth lens. These lenses are cylindrical lenses. The position of the first lens is adjustable and therefore solve the problem of requiring secondary focusing of the prior art.

Abstract: A transmitter device adapted to be coupled to an image providing device and a receiver device includes first and second conversion units, a wireless module, and a processing unit. The first conversion unit and the second conversion unit are configured to be coupled to the image providing device through an HDMI transmission cable and a Type-C transmission cable, respectively, so as to respectively receive a first video and audio stream and a second video and audio stream provided by the image providing device. The wireless module is connected to the receiver device through wireless communication. The processing unit preferentially selects the first conversion unit to receive a first video and audio signal output by converting the first video and audio stream by the first conversion unit and transmits the first video and audio signal to the receiver device through the wireless module.

Abstract: Disclosed are a semiconductor package and a manufacturing method of a semiconductor package. In one embodiment, the semiconductor package includes an interposer substrate, a plurality of semiconductor dies, a first encapsulant, at least one heat dissipation element and a second encapsulant. The plurality of semiconductor dies are disposed on the interposer substrate. The first encapsulant is disposed on the interposer substrate and surrounds the plurality of semiconductor dies. The at least one heat dissipation element is disposed on the plurality of semiconductor dies. The second encapsulant is disposed on the first encapsulant and surrounds the at least one heat dissipation element.

Abstract: A method of forming an SSZ-13 zeolite in a hydrothermal synthesis yields an SSZ-13 zeolite that exhibits a silica to alumina (SiO2:Al2O3) molar ratio (SAR) that is less than 16:1; has a morphology that includes one or more of cubic, spheroidal, or rhombic particles with a crystal size that is in the range of about 0.1 micrometer (?m) to 10 ?m. This SSZ-13 also exhibits a Brönsted acidity that is in the range of 2.0 mmol/g to 3.4 mmol/g as measured by ammonia temperature programmed desorption. A catalyst formed by substituting a metal into the framework of the zeolite provides for low temperature light-off of the NOx conversion reactions, while maintaining substantial performance at higher temperatures demonstrating hydrothermal stability.

Abstract: A method, system, and computer program product to manage a network comprising a plurality of interconnected components are described. The method includes obtaining a set of all the components that are part of the network over time, and identifying one or more repeating patterns of components among the set of all the components as corresponding lower-level definitions to generate a hierarchical set of all the components. The method also includes obtaining time-varying information regarding topology and operational values within the network, and creating a representation of the network at a set of times based on the hierarchical set of all the components and the time-varying information.

Abstract: A method for expanding functions of a conference system includes providing a first circuit board and a second circuit board disposed in the receiver, receiving a first wireless packet transmitted from the first transmitter merely through a second communication module of the second circuit board, controlling the second communication module for performing an unpacking process of the first wireless packet by a second processor of the second circuit board to generate first compressed media data, generating a first command signal by the second processor of the second circuit board for controlling a first processor of the first circuit board to receive the first compressed media data through a data channel, and decompressing the first compressed media data by the first processor for acquiring first media contents of the first transmitter.

Abstract: In a method of patterning an integrated circuit, test layer thickness variation data is received when a test layer with a known thickness disposed over a test substrate undergoes tilted angle plasma etching. Overlay offset data per substrate locations caused by the tilted angle plasma etching is determined. The overlay offset data is determined based on the received thickness variation data. The overlay offset data is associated with an overlay between first circuit patterns of a first layer on the semiconductor substrate and corresponding second circuit patterns of a second layer disposed over the first layer on the substrate. A location of the substrate is adjusted based on the overlay offset data during a lithography operation to pattern a resist layer over the second layer. The second layer is patterned based on the projected layout patterns of the reticle and using the tilted angle plasma etching.

Abstract: Methods, apparatuses, and systems for establishing various network configurations within a gas detection system. The method includes initializing, by a computing device associated with a gateway, a root node of a tree network, monitoring for a beacon request broadcast, wherein the beacon request broadcast is detected by the computing device from a given one of the one or more broadcasting devices, the given broadcasting device switching over from a parallel network configuration to join the tree network, determining available capability to support a connection with the broadcasting device, generating a beacon response based on the determination of available capability, transmitting the beacon response to the broadcasting device, establishing the broadcasting device as a child node device based upon a receipt of a joining request, and transmitting a join confirmation to the broadcasting device based on the establishment of the broadcasting device as a child node device.

Abstract: A memory device includes a semiconductor substrate. The memory device includes a stack of channel layers over the semiconductor substrate, each channel layer including an oxide material. The memory device includes a word line structure interleaved with the stack of channel layers. The memory device includes a source feature and a drain feature on both sides of the stack of channel layers.

Abstract: A memory array is provided that includes a plurality of word lines and a plurality of bit lines, and a plurality of memory cells each including a corresponding magnetic memory element coupled in series with a corresponding selector element. Each memory cell is coupled between one of the word lines and one of the bit lines. Each memory cell has a half-pitch F, and comprises an area between 2F2 and 4F2.

Abstract: Circuitry for a compute-in-memory (CiM) circuit or structure arranged to detect bit errors in a group of memory cells based on a summation of binary 1's included in at least one weight matrix stored to the group of memory cells, a parity value stored to another group of memory cells and a comparison of the summation or the parity value to an expected value.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A method of forming a memory structure includes the following steps. A CMOS circuitry is formed over a semiconductor substrate. A bit line array is formed to be electrically connected to the CMOS circuitry. A memory array is formed over the bit line array. The memory array is formed by forming a word line stack, and forming first and second sets of stacked memory cells. The word line stack is formed on the bit line array and has a first side surface and a second side surface. The first sets of stacked memory cells are formed along the first side surface. The second sets of stacked memory cells are formed along the second side surface, wherein the second sets of stacked memory cells are staggered from the first sets of stacked memory cells. A source line array is formed over the memory array and electrically connected to the CMOS circuitry.

Abstract: A display panel and a manufacturing method thereof are provided. The display panel at least includes a metal layer, a pixel electrode arranged on a same layer as the metal layer, a protective layer covering the metal layer and the pixel electrode, and a common electrode disposed on the protective layer. A thickness of the protective layer on the metal layer is greater than a thickness of the protective layer on the pixel electrode.

Abstract: A convertible head wearable audio device is provided that may include a headband having a first earpiece at a first end and a receptacle at a second end. The convertible head wearable audio device may also include a wireless interface. The wireless interface may be configured to communicatively couple the convertible head wearable audio device to a remote device. The convertible head wearable audio device may further include an active noise cancellation module. The active noise cancellation module may be configured to reduce ambient noise from an audio output of the convertible head wearable audio device.

Abstract: Described herein are technologies relating to assigning wireless beacons to positions within a building, wherein the wireless beacons are included in an indoor positioning system. A computer-implemented floorplan representation is generated, wherein the representation includes a layout of the building and materials of structures of the building. Coverages of wireless beacons are simulated, and multiple objectives are balanced to identify a number of wireless beacons to deploy in the building and positions in the building where the wireless beacons are to be deployed.

Abstract: A method for updating a confidence of a high-precision map includes: acquiring confidence updating data packets corresponding to target vehicles, wherein the confidence updating data packets include target road element images corresponding to each of the target road elements, shooting position information corresponding to each target road element image and a camera calibration file, or include pieces of first comparison result information corresponding to each of the target road elements; updating an original confidence value corresponding to the target road section in the high-precision map according to the target road element images corresponding to each of the target vehicles, the shooting position information corresponding to each of the target road element images and the camera calibration file; or updating the original confidence value corresponding to the target road section in the high-precision map according to the pieces of first comparison result information corresponding to each of the target vehi