Abstract: A gas detecting module is disclosed. A gas-inlet concave and a gas-outlet concave are formed on a sidewall of a base. A gas-inlet-groove region and a gas-outlet-groove region are formed on a surface of the base. The gas-inlet concave is in fluid communication with a gas-inlet groove of the gas-inlet-groove region, and the gas-outlet concave is in fluid communication a gas-outlet groove of the gas-outlet-groove region. The gas-inlet-groove region and the gas-outlet-groove region are covered by a thin film to achieve the effectiveness of laterally inhaling and discharging out gas relative to the gas detecting module.

Abstract: A gas-detectable casing of a portable device is disclosed and includes a main body, a gas detection module, a driving and controlling board, and a microprocessor. The main body includes a ventilation opening, a connection port and an accommodation chamber. The ventilation opening is in communication with the accommodation chamber. The gas detection module and the driving and controlling board are disposed within the accommodation chamber. The gas detection module is fixed on and electrically connected to the driving and controlling board. The driving and controlling board is connected to a mobile device through a connection port. The microprocessor is fixed on and electrically connected to the driving and controlling board, and enables the gas detection module to detect and operate. The microprocessor converts a detection raw datum of the gas detection module into a detection datum, which is stored and transmitted to the mobile device or an external device.

Abstract: A silicon photonic package structure including a substrate, a conductive bump, an obstacle structure, a laser diode, a mode converter, and a ball lens is provided. The conductive bump is disposed on the substrate. The obstacle structure is formed on the substrate. The laser diode is disposed above the substrate and electrically bonded to the conductive bump. A surface of the laser diode facing the substrate has a ridge. An end of the ridge has a light-emitting surface. The obstacle structure is located between the conductive bump and the ridge. A thickness of the obstacle structure in a direction perpendicular to the surface of the substrate is greater than a thickness of the ridge in the direction perpendicular to the surface of the substrate. The mode converter is formed on the substrate. The ball lens is formed on the substrate and located between the light-emitting surface and a light input end of the mode converter.

Abstract: A chip package includes a lower substrate, a first silicon nitride substrate, a bonding layer, an upper substrate, a first functional layer, a transparent conductive layer, an isolation layer, and a first conductive pad. The supporting layer is located between the lower substrate and the first silicon nitride substrate, and is made of a material including Benzocyclobutene (BCB). The upper substrate is located on the first silicon nitride substrate. The first functional layer is located between the upper substrate and the first silicon nitride substrate. The transparent conductive layer is located on the upper substrate. The isolation layer covers the upper substrate and the transparent conductive layer. The first conductive pad is located in the isolation layer and in electrical contact with the transparent conductive layer.

Abstract: A display device is provided. The display device has a display side and includes: a first substrate and a second substrate. The first substrate has a first surface and a second surface, wherein the first surface is closer to the display side than the second surface. The second substrate is disposed opposite the first substrate. The second surface is located between the first surface and the second substrate, and the area of the first substrate is greater than the area of the second substrate in a top view direction. The first substrate has a side surface, and the side surface includes a chamfered structure.

Abstract: A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.

Abstract: An organic light emitting diode display panel, a manufacturing method thereof, and a display device are disclosed. The organic light emitting diode display panel includes: a base substrate; a light emitting layer on the base substrate, a spectral width at 10%-15% of a maximum spectral intensity of an emission spectrum of the light emitting layer is not less than 200 nm, and a yellow-green wave band of the emission spectrum includes at least one peak located between 550 nm-562 nm.

Abstract: A gas detecting module is provided. The gas detecting module includes a base, a piezoelectric actuator, a driving circuit board, a laser component, a particulate sensor and an outer cover. A gas-guiding-component loading regain and a laser loading region are separated by the base. By the design of the gas flowing path, the driving circuit board covering the bottom surface of the base, and the outer cover covering the surfaces of the base, an inlet path is collaboratively defined by the gas inlet groove of the base and the driving circuit board, and an outlet path is collaboratively defined by a gas outlet groove of the base, the outer cover and the driving circuit board. Consequently, the thickness of the gas detecting module is drastically reduced.

Abstract: An air quality system handled by artificial intelligence internet of things is provided and includes a gas detection device, an artificial intelligent internet of things handling device, and a user demand platform. In the system, the user demand platform transmits an instruction to the artificial intelligent internet of things handling device. By using self deep-learning analysis of data computing and algorithms of the AI device, second digital data is generated. The second digital data is fed back to the gas detection device through the network. Accordingly, the actuating actions of the micro pumps and the detecting actions of the sensors can be generated. Hence, the actuation and the detection of air quality can be achieved more effectively.

Abstract: A device is manufactured by providing a semiconductor fin protruding from a major surface of a silicon substrate comprising silicon. A liner and a shallow trench isolation (STI) region are formed adjacent the semiconductor fin. A silicon cap is deposited over the semiconductor fin. The resulting cap consists of crystalline silicon in the portion over the semiconductor fin and consists of amorphous silicon in the portions over the liner and STI region. An HCl etch bake process is performed to remove the portions of amorphous silicon over the liner and the STI region.

Abstract: A particle detecting module is provided and includes a base, a piezoelectric actuator, a driving circuit board, a laser component, a particulate sensor and an outer cover. A gas-guiding-component loading region and a laser loading region are separated by the base. By the design of the gas flowing path, the driving circuit board covering the bottom surface of the base, and the outer cover covering the surfaces of the base, an inlet path is defined by the gas inlet groove of the base, and an outlet path is defined by a gas outlet groove of the base. Consequently, the thickness of the particle detecting module is drastically reduced.

Abstract: An actuating and sensing apparatus includes a circuit board, a housing, an actuating device and a sensor. The housing is disposed on the circuit board and includes an entrance opening, an exit opening and a compartment. The compartment is in communication with an external environment of the housing through the entrance opening and the exit opening. The actuating device is disposed within the compartment and closing the exit opening. The sensor is disposed within the compartment and corresponding to the entrance opening. When the actuating device is enabled, a gas within the compartment is guided to the external environment outside the housing, and a pressure gradient is generated in the compartment so as to introduce a gas from the external environment outside the housing into the compartment through the entrance opening to make the gas detected by the sensor.

Abstract: A wafer drying method to detect airborne molecular contaminants in a drying gas as a feedback parameter for a single wafer or multi-wafer drying process is provided. For example, the method includes dispensing in a wafer drying station a drying gas over one or more wafers; collecting the drying gas from an exhaust of the wafer drying station; determining the concentration of contaminants in the drying gas; re-dispensing the drying gas over the one or more wafers if the concentration of contaminants is higher than a baseline value; and transferring the one or more wafers out of the wafer drying station if the concentration is equal to or less than the baseline value.

Abstract: The present disclosure provides a decoding device. The decoding device includes an iteration number computing unit and a recursive decoder. The iteration number computing unit receives multiple packet parameters corresponding to a packet and computes a codeword-number-per-symbol according to packet parameters, in which the packet includes multiple symbols. The iteration number computing unit computes an iteration number according to the codeword-number-per-symbol. The recursive decoder is coupled to the iteration number computing unit, and performs a decoding operation on a codeword within a data field of the packet according to the iteration number.

Abstract: A chip package includes a semiconductor substrate, a supporting element, an antenna layer, and a redistribution layer. The semiconductor substrate has an inclined sidewall and a conductive pad that protrudes from the inclined sidewall. The supporting element is located on the semiconductor substrate, and has a top surface facing away from the semiconductor substrate, and has an inclined sidewall adjoining the top surface. The antenna layer is located on the top surface of the supporting element. The redistribution layer is located on the inclined sidewall of the supporting element, and is in contact with a sidewall of the conductive pad and an end of the antenna.

Abstract: Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

Abstract: A fluid molecule system handled by artificial intelligence internet of things is provided. In the system, a requiring instruction of the digital data of the fluid molecule is transmitted to the artificial intelligence internet of things handling device by the user demand platform. By using self deep-learning analysis of data computing and algorithms of the AI device, an updated digital data is generated. The updated digital data is fed back to the micro pumps of the fluid detection device through the network. Accordingly, the actuating actions of the plurality of micro pumps and the detecting actions of the plurality of sensors can be generated. Hence, the actuation and the detection of the fluid molecule can be achieved more effectively.

Abstract: A method includes forming a semiconductor fin, performing a first passivation step on a top surface of the semiconductor fin using a first passivation species, and performing a second passivation step on sidewalls of the semiconductor fin using a second passivation species different from the first passivation species. A gate stack is formed on a middle portion of the semiconductor fin. A source or a drain region is formed on a side of the gate stack, wherein the source or drain region and the gate stack form a Fin Field-Effect Transistor (FinFET).

Abstract: A single-ended inductor comprises a first partial coil wound in a first direction; and a second partial coil wound in a second direction and adjoined the first partial coil; wherein, the second direction is opposite to the first direction to reduce the coupling of single-ended inductors and peripheral lines and reduce signal interference.

Abstract: A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.