Abstract: A method to form a first diamond composite wafer, a second diamond composite wafer or a third diamond composite wafer with a predetermined diameter includes the following steps: preparing a plurality of diamond blocks, wherein each diamond block has a dimension smaller than the predetermined diameter; attaching the plurality of diamond blocks to a first semiconductor substrate with the predetermined diameter to form a first temporary composite wafer, wherein a thermal conductivity of the first semiconductor substrate is smaller than that of the diamond block; and filling gaps among the plurality of diamond blocks of the first temporary composite wafer to form the first diamond composite wafer; or attaching the first diamond composite wafer to a second semiconductor substrate with the predetermined diameter to form the second diamond composite wafer, or removing the first semiconductor substrate from the first diamond composite wafer to form the third diamond composite wafer.

Abstract: A 3D integrated circuit package is provided. The 3D integrated circuit package includes a substrate structure, a first interposer, a second interposer, a first semiconductor die, and a second semiconductor die. The substrate structure has a first surface and a second surface opposite to the first surface. The first interposer is disposed over the first surface of the substrate structure. The second interposer is disposed over the first interposer. The first and the second semiconductor dies are disposed over the first surface of the substrate structure, and the first and the second semiconductor dies are bonded to two opposite sides of the second interposer, respectively. The substrate structure includes a thermal enhancement portion, and at least one of a thermal conductivity or a geometry of the thermal enhancement portion is different from that of other portions of the substrate structure.

Abstract: A panel-level semiconductor package structure is provided. The panel-level semiconductor package structure includes a panel-level substrate structure and at least one wafer-level package structure. The panel-level substrate structure has a first side and a second side opposite to the first side. The wafer-level package structure is bonded over the panel-level substrate structure. Each of the wafer-level package structures includes a first redistribution layer (RDL) over the elastomeric connector and a plurality of first semiconductor devices laterally disposed over the first RDL. A method for manufacturing a panel-level substrate structure is also provided.

Abstract: A 3D integrated circuit package is provided. The 3D integrated circuit package includes a substrate structure having a first surface and a second surface opposite to the first surface, a high-power die over the substrate structure, a lower-power die over the high-power die, a first interposer between the first surface of the substrate structure and the high-power die, and a second interposer between the high-power die and the lower-power die. The substrate structure includes a thermal enhancement portion located under the high-power die, and at least one of a thermal conductivity or a geometry of the thermal enhancement portion is different from other portions of the substrate structure. A substrate structure of the 3D integrated circuit package is also provided.

Abstract: A semiconductor package is provided. The semiconductor package includes a first die having a plurality of first metal pads at a first bonding side and a second die over the first die, having a plurality of second metal pads at a second bonding side facing the first bonding side. Each of the first metal pads corresponds to each of the second metal pads with a pitch no greater than about 10 ?m. The semiconductor package further includes a first dielectric layer surrounding and in contact with a sidewall of the first metal pads and a second dielectric layer surrounding and in contact with a sidewall of the second metal pads. A method for manufacturing a semiconductor package is also provided.

Abstract: A method to form a first diamond composite wafer, a second diamond composite wafer or a third diamond composite wafer with a predetermined diameter includes the following steps: preparing a plurality of diamond blocks, wherein each diamond block has a dimension smaller than the predetermined diameter; attaching the plurality of diamond blocks to a first semiconductor substrate with the predetermined diameter to form a first temporary composite wafer, wherein a thermal conductivity of the first semiconductor substrate is smaller than that of the diamond block; and filling gaps among the plurality of diamond blocks of the first temporary composite wafer to form the first diamond composite wafer; or attaching the first diamond composite wafer to a second semiconductor substrate with the predetermined diameter to form the second diamond composite wafer, or removing the first semiconductor substrate from the first diamond composite wafer to form the third diamond composite wafer.

Abstract: A method to process a diamond composite wafer includes the following steps: (a). forming a plurality of through vias in the diamond composite wafer and a first re-distribution layer on a firs side of the diamond composite wafer; (b). attaching a temporary carrier to the first re-distribution layer, and forming a second re-distribution layer on a second side of the diamond composite wafer; and (c). releasing the temporary carrier to form a circuit containing diamond composite wafer.

Abstract: A semiconductor structure includes a substrate and a first circuit containing composite block over the substrate. The first circuit containing composite block includes a through via therein and a re-distribution layer thereon. The first circuit containing composite block includes a semiconductor block and a diamond block.

Abstract: The present invention discloses a method to form a composite semiconductor wafer with a first dimension. The method comprises: attaching a set of thermal dissipation layers to a temporary carrier; bonding the temporary carrier with the set of thermal dissipation layers to a semiconductor substrate with the first dimension, such that the set of thermal dissipation layers are bonded to the semiconductor substrate; and removing the temporary carrier to form composite semiconductor wafer with the first dimension.

Abstract: A “SOUND ID SYSTEM” comprise a Device with a microphone that continuously monitors the surrounding environment. Pre-recorded personalized or unique sound patterns, signatures, and/or key words, and/or their derivatives, are stored in the Device. When such a pre-determined pre-recorded sound pattern, signature, or key words, or their derivatives, are recognized by the Device, a corresponding pre-determined action or action sequence will be sent to the Cloud, or other devices, to execute. Such other devices can attach, co-habitat, and wired/wirelessly connect to the Device, or share some components with the Device. If the Device does not recognize any particular pre-recorded sound pattern, signature or key words, or their derivatives, then the Device will not transmit to disclose to any outside device or other entity, any monitored sound information.

Abstract: Methods to build an open smart speaker to orchestrate voice services from multiple providers, and open smart speakers that orchestrate voice services from multiple providers.

Abstract: A game identifier of an encrypted streaming electronic game to be streamed to a playback device may be received. The game identifier may comprise a title of the encrypted streaming electronic game. An electronic ticket for access by the playback device to a secured portion of the encrypted streaming electronic game may be gathered. The electronic ticket may specify a first gameplay state. The electronic ticket may be used to access the secured portion of the encrypted streaming electronic game at the first gameplay state. One or more gameplay actions to transform the encrypted streaming electronic game to a second gameplay state may be received. The second gameplay state may be provided to a state server, where the state server configured to instruct a license server to modify the electronic ticket to specify the second gameplay state for the encrypted streaming electronic game.

Abstract: A dark fiber dense wavelength division multiplexing service path design microservice (ddSPDmS) can provide a scalable self-contained meta-data driven approach for a flexible implementation of a dark fiber dense wavelength division multiplexing (DWDM) service path design solution. The service plan design solution can be used as a standalone solution or integrated with a network management application. In order to manage a large volume of circuit designs, multiple microservices can accept application program interface (API) requests in a cloud environment. Permission can then be given to any application to use the API to make a call to the design and inventory. Additionally, metadata templates can be designed to support a node, a link, and/or a topology for the microservices.

Abstract: A dark fiber dense wavelength division multiplexing service path design microservice (ddSPDmS) can provide a scalable self-contained meta-data driven approach for a flexible implementation of a dark fiber dense wavelength division multiplexing (DWDM) service path design solution. The service plan design solution can be used as a standalone solution or integrated with a network management application. In order to manage a large volume of circuit designs, multiple microservices can accept application program interface (API) requests in a cloud environment. Permission can then be given to any application to use the API to make a call to the design and inventory. Additionally, metadata templates can be designed to support a node, a link, and/or a topology for the microservices.

Abstract: A method for searching for information in a relational database includes: identifying a subset of attributes from attributes for each record in the relational database, the subset of attributes including a plurality of search attributes and a plurality of search summary attributes; extracting, via a processor, the subset of identified attributes from each record; creating in a cloud-based non-relational database platform an index instance corresponding to each record in the relational database, wherein each index instance in the cloud-based non-relational database includes the subset of identified attributes indexed to a corresponding record in the relational database; and in response to receiving a search request that includes one or more search attributes, searching the index instances in the cloud-based non-relational database for corresponding records in the relational database; and providing search results that include information from the corresponding records in the relational database, wherein the inf

Abstract: A method for searching for information in a relational database includes: identifying a subset of attributes from attributes for each record in the relational database, the subset of attributes including a plurality of search attributes and a plurality of search summary attributes; extracting the subset of identified attributes from each record; creating in a cloud-based non-relational database platform an index instance corresponding to each record in the relational database, wherein each index instance in the cloud-based non-relational database includes the subset of identified attributes indexed to a corresponding record in the relational database; and in response to receiving a search request that includes one or more search attributes, searching the index instances in the cloud-based non-relational database for corresponding records in the relational database; and providing search results that include information from corresponding records in the relational database, wherein the information is associated

Abstract: An Intelligent Platform (“IP”) comprises a Platform that employs an instance of a Software Defined Device (I-SDD) such that the Values of a set of Variables in an I-SDD shall reflect the Device State of interest at any given time. Whenever the Value of a Variable in I-SDD is changed, it could cause the Device to change to a different Device State.

Abstract: An Intelligent Platform (“IP”) comprises a Platform that employs an instance of a Software Defined Device (I-SDD) such that the Values of a set of Variables in an I-SDD shall reflect the Device State of interest at any given time. Whenever the Value of a Variable in I-SDD is changed, it could cause the Device to change to a different Device State.

Abstract: Methods to build an open smart speaker to orchestrate voice services from multiple providers, and open smart speakers that orchestrate voice services from multiple providers.

Abstract: A dark fiber dense wavelength division multiplexing service path design microservice (ddSPDmS) can provide a scalable self-contained meta-data driven approach for a flexible implementation of a dark fiber dense wavelength division multiplexing (DWDM) service path design solution. The service plan design solution can be used as a standalone solution or integrated with a network management application. In order to manage a large volume of circuit designs, multiple microservices can accept application program interface (API) requests in a cloud environment. Permission can then be given to any application to use the API to make a call to the design and inventory. Additionally, metadata templates can be designed to support a node, a link, and/or a topology for the microservices.