Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A foot sensor and analysis device, which includes a pressure sensing layer arranged inside the insole and a sensing module installed inside the insole. The sensing module is electrically coupled with the pressure sensing layer for receiving and processing detected electronic signals, where sensing module includes an inductance coil to perform wireless charging to the battery. The pressure sensing layer and the sensing module are integrally formed inside the insole.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: An electronic cigarette atomizer and an electronic cigarette are disclosed. The electronic cigarette atomizer comprises an air inlet (1), an air inlet passage (2), an atomization cavity (3), an air outlet passage (4), an air outlet (5), and a suction nozzle (6) that are communicated in sequence. The electronic cigarette atomizer further comprises a housing (8) and an adjustment mechanism (7) for adjusting the air input of the air inlet (1). The air inlet passage (2), the atomization cavity (3), and the air outlet passage (4) are all arranged in the housing (8), and a top of the housing (8) is provided with a top cover (9). The adjustment mechanism (7) comprises a movable member (10) located in the top cover (9) and movable axially along the top cover (9).

Abstract: A copolymer, a film composition and a composite material employing the same are provided. The copolymer is a copolymerization product of a composition, wherein the composition includes a monomer (a), a monomer (b) and a monomer (c). The monomer (a) is a compound having a structure represented by Formula (I), the monomer (b) is a compound having a structure represented by Formula (II), and the monomer (c) is a compound having a structure represented by Formula (III) wherein R1, R2, R3, R4, R5 and R6 are as defined in specification.

Abstract: An electronic gaming system is capable of forming a multi-player group to play a game; receiving, from a first gaming device, first game play information for a first game played by a first player member of the multi-player group on the first gaming device; determining that the first game play information comprises a first winning outcome corresponding to a first winning outcome; in response, allocating the first winning outcome among the first and second player members; and notifying a second gaming device of the second player member that the second player member has received the second portion of the first winning outcome.

Abstract: An optical proximity correction (OPC) device and method is provided. The OPC device includes an analysis unit, a reverse pattern addition unit, a first OPC unit, a second OPC unit and an output unit. The analysis unit is configured to analyze a defect pattern from a photomask layout. The reverse pattern addition unit is configured to provide a reverse pattern within the defect pattern. The first OPC unit is configured to perform a first OPC procedure on whole of the photomask layout. The second OPC unit is configured to perform a second OPC procedure on the defect pattern of the photomask layout to enhance an exposure tolerance window. The output unit is configured to output the photomask layout which is corrected.

Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Abstract: A compound comprising a first ligand LA of Formula I, is provided. In Formula I, K is a direct bond, O, S, N(R?), P(R?), B(R?), C(R?)(R?), or Si(R?)(R?); each of X1 to X8 is C or N; Y is a linking group; each R?, R?, R, R?, R?, R1, RA, RB, and RC is hydrogen or a General Substituent; at least one RC is R*; R* has a structure of Cy-R**, where Cy is a monocyclic ring or a polycyclic fused ring system, which can be further substituted, and R** comprises (i) at least one electron-withdrawing group, (ii) a monocyclic ring or a polycyclic fused ring system, where the monocyclic ring and each ring of the polycyclic fused ring system is independently a 5-membered or 6-membered carbocyclic or heterocyclic ring, or (iii) both (i) and (ii); and LA is coordinated to a metal. Formulations, OLEDs, and consumer products containing the compound are also provided.

Abstract: A multifunctional table includes a table body, a carrier member, and a holder. The table body includes a board and a support member connected to each other. The board has a table top and a groove. The carrier member is connected to the table body and includes a first slideway. The holder includes a slidable attaching portion and a holding portion connected to each other. The holding portion includes a first holding surface. The first holding surface corresponds to the groove when the slidable attaching portion is slidably attached to the first slideway in a first attached state. A holder includes a slidable attaching portion and a holding portion connected to each other. The holding portion includes a first holding surface and a second holding surface opposite to each other. The first holding surface and the second holding surface are asymmetrical about a central x axis of the holder.

Abstract: A compound comprising a first ligand LA of Formula I, is provided. In Formula I, moiety A is a 5-membered or 6-membered ring; moiety B is a fused ring structure comprising at least four rings; K is a direct bond, O, or S; each of Z1 and Z2 is independently C or N; each RA and RB is independently hydrogen or a General Substituent; at least one RB comprises a cyclic group or an electron-withdrawing group; LA is coordinated to a metal M that has an atomic mass of at least 40 and is optionally coordinated to other ligands; and the ligand LA is optionally linked with other ligands. Formulations, OLEDs, and consumer products including the compound are also provided.

Abstract: The present disclosure discloses a high-voltage light string controller, including a first power supply module, a main control module, and a protection module. The first power supply module is suitable for being connected to a mains supply to supply power to the main control module; the main control module is suitable for sending a control signal to a light string to turn on or turn off the light string or to switch a color; the protection module is suitable for identifying a magnitude of a current in the first power supply module, converting the current into a detection signal, and then sending the detection signal to the main control module; the main control module is suitable for receiving and judging the detection signal; and when the detection signal exceeds a preset value, the main control module is suitable for sending a control signal to turn off the light string.

Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: A visual inspection method of a curved object executed by a visual inspection system. The visual inspection system includes a robotic arm, a camera mounted at a tail end of the robotic arm, a fixing unit mounted under the camera, and a control unit electrically connected to the robotic arm and the camera. Specific steps of the visual inspection method of the curved object are described hereinafter. Fix a curved object which is to be inspected by the fixing unit. Capture the object which is to be inspected with a plurality of groups of preset parameters by the camera. Use the control unit to calculate a better shooting parameter. Use the better shooting parameter by the camera to proceed with visual inspections of the curved objects which are to be inspected in batches.

Abstract: A susceptor assembly for supporting a crucible during a crystal growth process includes a susceptor base, a tubular sidewall connected to the susceptor base, and a removable sacrifice ring interposed between the susceptor base and the sidewall. Each of the susceptor base and the sidewall is formed of a carbon-containing material. The susceptor base has an annular wall and a shoulder extending radially outward from an outer surface of the annular wall. The sidewall has a first end that receives the annular wall to connect the sidewall to the susceptor base. The sacrifice ring has a first surface that faces the outer surface of the annular wall, a second surface that faces an interior surface of the sidewall, and a ledge extending outward from the second surface that engages the first end of the sidewall.

Abstract: Improved control of via anchor profiles in metals at a contact layer can be achieved by slowing down an anchor etching process and by introducing a passivation operation. By first passivating a metallic surface, etchants can be prevented from dispersing along grain boundaries, thereby distorting the shape of the via anchor. An iterative scheme that involves multiple cycles of alternating passivation and etching operations can control the formation of optimal via anchor profiles. When a desirable anchor shape is achieved, the anchor maintains structural integrity of the vias, thereby improving reliability of the interconnect structure.