Abstract: This invention provides a scan method, scan system and radiation scan controller, and relates to the field of radiation. Wherein, the scan method of this invention comprises: obtaining detection data of an object to be inspected under radiation scanning using a detector; adjusting an accelerator output beam dose rate and/or an output electron beam energy level of a radiation emission device according to the detection data. With this method, working conditions of the accelerator of the radiation emission device may be adjusted according to the detection data detected by the detector, so that for a region having a larger mass thickness, a higher output beam dose rate or a higher electron beam output energy level is adopted to guarantee satisfied imaging technical indexes, for a region having a smaller mass thickness, a lower output beam dose rate or a lower electron beam output energy level is adopted to reduce the environmental dose level while guaranteeing satisfied imaging technical indexes.

Abstract: The disclosure provides a multi-power multi-dosage accelerator. The multi-power multi-dosage accelerator comprises an electron gun configured to provide a first voltage of the electron gun and a second voltage of the electron gun, and an accelerating tube configured to generate a first X-ray having a first dosage and first power according to the first voltage of the electron gun and generate a second X-ray having a second dosage and second power according to the second voltage of the electron gun, wherein the first dosage is a dosage which can be accepted by human bodies and is much less than the second dosage, the first X-ray is used for inspecting a first area where a person is located, and the second X-ray is used for inspecting a second area where goods are located.

Abstract: A method for forming the semiconductor device structure is provided. The method includes forming a metal layer in a first dielectric layer over a substrate and forming an etch stop layer over the metal layer. The etch stop layer is made of metal-containing material. The method also includes forming a second dielectric layer over the etch stop layer and removing a portion of the second dielectric layer to expose the etch stop layer and to form a via by an etching process. The method further includes performing a plasma cleaning process on the via and the second dielectric layer, and the plasma cleaning process is performed by using a plasma including nitrogen gas (N2) and hydrogen gas (H2).

Abstract: The present disclosure includes a system, method, and article of manufacture for generating an entity graph. The method may comprise determining a relationship between a first entity and a second entity based upon internal data, external data, and/or online data associated with the first entity, and generating the entity graph comprising at least two nodes and an edge connecting the at least two nodes. The method may further comprise, in various embodiments, tailoring marketing to the first entity based upon the entity graph, detecting fraud against the first entity based upon the entity graph, periodically updating the entity graph based upon new internal data and new online data, and/or adjusting the edge based upon a change in the relationship between the first entity and the second entity.

Abstract: An unlocking method and an electronic device are provided. The method is suitable for the electronic device having a touch screen and being in a screen lock mode. The method includes: displaying a first region and a second region on the touch screen; adjusting the first region and the second region according to a tilting state of the electronic device; receiving a touch operation performed on the touch screen; and switching the electronic device to an unlock mode when the touch operation starts in the first region and ends in the second region.

Abstract: An electrical connector includes an insulative housing defining a top surface and a bottom surface opposite to each other and a plurality of electrical contacts received in the insulative housing. Each electrical contact is formed by stamping a metal plate and includes a contacting portion exposed to the top surface, a mounting portion extending out of the bottom surface and an elastic portion disposed between the contacting portion and the mounting portion and in the insulative housing, wherein the elastic portion includes a first elastic portion and a second elastic portion disposed on two opposite sides of the contacting portion.

Abstract: A method for forming the semiconductor device structure is provided. The method includes forming a first metal layer over a substrate and forming a dielectric layer over the first metal layer. The method includes forming an antireflection layer over the dielectric layer, forming a hard mask layer over the antireflection layer and forming a patterned photoresist layer over the hard mask layer. The method includes etching a portion of the antireflection layer by performing a first etching process and etching through the antireflection layer and etching a portion of the dielectric layer by performing a second etching process. The method includes etching through the dielectric layer by performing a third etching process to form a via portion on the first metal layer. The via portion includes a first sidewall and a second sidewall, and the slope of the first sidewall is different from that of the second sidewall.

Abstract: The present disclosure provides a ray calibration device and a working method thereof, and a radiation imaging system and a working method thereof, and belongs to the field of radiation imaging technology. The present disclosure can solve the problems that the existing calibration devices have low calibration efficiency and require relatively large spaces. The ray calibration device of the present disclosure includes a driving part, a cam part and a calibration part, wherein the calibration part is located below the cam part; the driving part is adapted to drive the cam part to rotate; and the cam part is adapted to exert a force on the calibration part to enable the calibration part to move into a ray area downwards.

Abstract: The present disclosure includes a system, method, and article of manufacture for generating an entity graph. The method may comprise determining a relationship between a first entity and a second entity based upon internal data, external data, and/or online data associated with the first entity, and generating the entity graph comprising at least two nodes and an edge connecting the at least two nodes. The method may further comprise, in various embodiments, tailoring marketing to the first entity based upon the entity graph, detecting fraud against the first entity based upon the entity graph, periodically updating the entity graph based upon new internal data and new online data, and/or adjusting the edge based upon a change in the relationship between the first entity and the second entity.

Abstract: Use of 5?-androstane-3?,5,6?-triol and analogs thereof in the preparation of a drug for the prophylaxis or treatment of an altitude sickness caused by hypobaric hypoxia is provided, so as to provide a new drug for the prophylaxis or treatment of an altitude sickness. Researches revealed that 5?-androstane-3?,5,6?-triol treatment can effectively reduce vasogenic edema of brain tissue of Macaca fascicularis caused by hypobaric hypoxia, reduce the increased cerebral water content, and protect from neuronal vacuolar degeneration caused by hypobaric hypoxia, therefore it can improve neurological dysfunctions caused by hypobaric hypoxia and is useful in prophylaxis or treatment of an altitude sickness.

Abstract: A computer implemented method, computer program product, and system for providing, via a storage provisioning engine, a scalable objects store enabled to store objects across multiple heterogeneous file arrays; wherein file arrays are enabled to be actively added to the object store without pausing the file arrays; and wherein data representing the objects enabled to be balanced across the heterogeneous file arrays based.

Abstract: A method for forming the semiconductor device structure is provided. The method includes forming a metal layer in a first dielectric layer over a substrate and forming an etch stop layer over the metal layer. The etch stop layer is made of metal-containing material. The method also includes forming a second dielectric layer over the etch stop layer and removing a portion of the second dielectric layer to expose the etch stop layer and to form a via by an etching process. The method further includes performing a plasma cleaning process on the via and the second dielectric layer, and the plasma cleaning process is performed by using a plasma including nitrogen gas (N2) and hydrogen gas (H2).

Abstract: A method for forming the semiconductor device structure is provided. The method includes forming a first metal layer over a substrate and forming a dielectric layer over the first metal layer. The method includes forming an antireflection layer over the dielectric layer, forming a hard mask layer over the antireflection layer and forming a patterned photoresist layer over the hard mask layer. The method includes etching a portion of the antireflection layer by performing a first etching process and etching through the antireflection layer and etching a portion of the dielectric layer by performing a second etching process. The method includes etching through the dielectric layer by performing a third etching process to form a via portion on the first metal layer. The via portion includes a first sidewall and a second sidewall, and the slope of the first sidewall is different from that of the second sidewall.

Abstract: A method for forming the semiconductor device structure is provided. The method includes forming a first metal layer over a substrate and forming a dielectric layer over the first metal layer. The method includes forming an antireflection layer over the dielectric layer, forming a hard mask layer over the antireflection layer and forming a patterned photoresist layer over the hard mask layer. The method includes etching a portion of the antireflection layer by performing a first etching process and etching through the antireflection layer and etching a portion of the dielectric layer by performing a second etching process. The method includes etching through the dielectric layer by performing a third etching process to form a via portion on the first metal layer. The via portion includes a first sidewall and a second sidewall, and the slope of the first sidewall is different from that of the second sidewall.

Abstract: The present invention provides a switching circuit and an electronic device, which relate to the field of electronic technologies, so as to improve reliability of image processing. The switching circuit includes a comparator circuit, a first switch circuit, a second switch circuit, a first drive voltage source, and a second drive voltage source. Two input ends of the comparator circuit respectively receive an input voltage and a reference voltage, an output end is separately connected to an input end of the first switch circuit and an input end of the second switch circuit; The comparator circuit determines whether the input voltage is greater than the reference voltage, outputs a high level when determining that the input voltage is greater than the reference voltage, and outputs a low level when determining that the input voltage is not greater than the reference voltage.

Abstract: A solid-filling coal mining feeding and conveying monitoring system, suitable for monitoring of a vertical feeding and conveying system in underground mine solid-filling mining. The monitoring system mainly consists of an industrial control computer, a PLC control box, an operating platform, a liquid crystal display, a color four-picture divider, two video optical receivers and loudspeakers, four cameras, uphole electronic belt scales, downhole electronic belt scales, a radar level meter, a coal level sensor, a vibration sensor, and various matching junction boxes and cables, the components being installed in positions such as a material field, a control room, upper and lower openings of a storage silo, and a gangue transportation lane. The system implements four main functions of a solid-filling material transportation and feeding process, the four main functions being status monitoring, a full silo alarm, centralized control, and recording and querying.

Abstract: In one aspect, a method includes using a file system layer configured to interact with a plurality of volumes and enabling an application to interact with any of the plurality of volumes using a single file system format provided by the file system layer. At least two of the plurality of volumes have different file system formats.

Abstract: A touch panel includes a substrate, a touch sensing electrode, and an optical compensation layer. The touch sensing electrode is disposed on the substrate. The optical compensation layer is disposed on the substrate and covers the touch sensing electrode. A refraction index of the optical compensation layer is smaller than or equal to a refraction index of the touch sensing electrode.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a semiconductor substrate. The method includes forming a mask layer over the dielectric layer. The mask layer has an opening exposing a portion of the dielectric layer. The method includes removing the portion of the dielectric layer through the opening to form a recess in the dielectric layer. The method includes removing the mask layer. The method includes performing a plasma cleaning process over the dielectric layer. The plasma cleaning process uses a carbon dioxide-containing gas.

Abstract: This Invention is with respect to a kind of bacteriostatic mold-proof antiseptic paster, which is mainly composed of forming a graphic layer on a base material after printing, and the upward side of the graphic layer fitting for a lustering film polyester layer, which is a implastic viscose with a lustering layer, and there is a lower PE lamination layer below the base material, and a release lamination layer below the lower PE lamination layer. In this way, it forms a sheet, and then put the sheet in the fumigating tank with special raw materials to extract the edible mold-proof bacteriostatic material, to constitute a bacteriostatic mold-proof antiseptic paster.