Abstract: An imaging optical system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with refractive power has an object-side surface being convex in a paraxial region and an image-side surface being concave in a paraxial region. The second lens element with positive refractive power has an image-side surface being convex in a paraxial region. The third lens element with negative refractive power has an image-side surface being concave in a paraxial region. The fourth lens element with positive refractive power has an image-side surface being convex in a paraxial region. The fifth lens element with negative refractive power has an image-side surface being concave in a paraxial region and having a convex shape in an off-axial region thereof.

Abstract: A chip package structure is provided. The chip package structure includes a redistribution structure and a first chip structure over the redistribution structure. The chip package structure also includes a first solder bump between the redistribution structure and the first chip structure and a first molding layer surrounding the first chip structure. The chip package structure further includes a second chip structure over the first chip structure and a second molding layer surrounding the second chip structure. In addition, the chip package structure includes a third molding layer surrounding the first molding layer, the second molding layer, and the first solder bump. A portion of the third molding layer is between the first molding layer and the redistribution structure.

Abstract: A method of manufacturing a semiconductor structure includes receiving a die comprising a top surface and a sacrificial layer covering the top surface; disposing a molding surrounding the die; removing the sacrificial layer from the die; disposing a polymer over the die and the molding, wherein the polymer has a first bottom surface contacting the die and a second bottom surface contacting the molding, and the first bottom surface is at a level substantially same as the second bottom surface.

Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a first under-bump metallization (UBM) pattern, a first conductive via, and a first dielectric layer laterally covering the first UBM pattern and the first conductive via. Entireties of a top surface and a bottom surface of the first UBM pattern are substantially planar. The first conductive via landing on the top surface of the first UBM pattern includes a vertical sidewall and a top surface connected to the vertical sidewall, and a planarized mark is on the top surface of the first conductive via. A bottom surface of the first dielectric layer is substantially flush with the bottom surface of the first UBM, and a top surface of the first dielectric layer is substantially flush with the top surface of the first conductive via.

Abstract: An image capturing lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The fifth lens element with positive refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The sixth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The seventh lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, and the image-side surface thereof includes at least one convex shape in an off-axis region thereof.

Abstract: An image capturing optical lens system includes four lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an object-side surface being convex in a paraxial region thereof. The third lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The fourth lens element has negative refractive power.

Abstract: A photographing lens assembly includes, in order from an object side to an image side: a first, a second, a third, a fourth, a fifth and a sixth lens elements. The first lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, wherein the object-side surface has at least one convex critical point in an off-axis region thereof. The third lens element has an image-side surface being convex in a paraxial region thereof. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, and an image-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface has at least one convex critical point in an off-axis region thereof.

Abstract: An optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has refractive power. The third lens element has refractive power. The fourth lens element has refractive power. The fifth lens element with refractive power has an image-side surface being concave in a paraxial region thereof. The sixth lens element with refractive power has an object-side surface being concave in a paraxial region thereof. The seventh lens element with refractive power has an image-side surface being concave in a paraxial region thereof.

Abstract: An optical photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has refractive power. The third lens element has refractive power. The fourth lens element has refractive power. The fifth lens element with refractive power has an image-side surface being convex in a paraxial region thereof, wherein an object-side surface and the image-side surface of the fifth lens element are both aspheric. The sixth lens element with refractive power has an object-side surface and an image-side surface being both aspheric. The optical photographing lens assembly has a total of six lens elements with refractive power.

Abstract: An imaging lens assembly includes a total of six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The fifth lens element has negative refractive power. The sixth lens element has an image-side surface being concave in a paraxial region thereof.

Abstract: A method and apparatus are disclosed. In an example, a first user equipment (UE) may be configured with a first number of carriers corresponding to a maximum number of carriers that the first UE is able to use concurrently and/or transmit on concurrently. The first UE may receive a plurality of sidelink transmissions on a plurality of carriers. The first UE may derive a plurality of slots for transmitting Physical Sidelink Feedback Channels (PSFCHs) based upon resources associated with the plurality of sidelink transmissions. Responsive to determining that a number of carriers of a second plurality of carriers associated with derived transmissions of the PSFCHs exceeds the first number of carriers, the first UE may prioritize one or more PSFCHs of the PSFCHs based upon a rule. The plurality of slots for transmitting the PSFCHs may be at least partially overlapped in the time domain.

Abstract: A semiconductor package includes a first semiconductor die, a molded die, a third encapsulant, and a redistribution structure. The molded die includes a chip, a first encapsulant, and a second encapsulant. The first encapsulant laterally wraps the chip. The second encapsulant laterally wraps the first encapsulant. The third encapsulant laterally wraps the first semiconductor die and the molded die. The redistribution structure extends on the second encapsulant, the third encapsulant, and the first semiconductor die. The redistribution structure is electrically connected to the first semiconductor die and the molded die. The second encapsulant separates the first encapsulant from the third encapsulant.

Abstract: A method includes forming regions of solder paste on a redistribution structure, wherein the solder paste has a first melting temperature; forming solder bumps on an interconnect structure, wherein the solder bumps have a second melting temperature that is greater than the first melting temperature; placing the solder bumps on the regions of solder paste; performing a first reflow process at a first reflow temperature for a first duration of time, wherein the first reflow temperature is less than the second melting temperature; and after performing the first reflow process, performing a second reflow process at a second reflow temperature for a second duration of time, wherein the second reflow temperature is greater than the second melting temperature.

Abstract: Methods and apparatuses for improving retransmission scheduling of sidelink communications are disclosed herein. In one method, a first device monitors a down control signal for scheduling sidelink resource. The first device performs a sidelink transmission for a second device based on a first sidelink grant allocated by a base station. The first device determines a retransmission need of the sidelink transmission based on a Hybrid Automatic Repeat Request (HARQ) feedback of the sidelink transmission from the second device. The first device transmits a retransmission indication for the retransmission need to the base station. The first device starts or restarts a timer upon the transmission of the retransmission indication, wherein the timer is used for controlling a period of monitoring a downlink control resource set.

Abstract: An imaging optical lens assembly includes six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof.

Abstract: A method includes attaching interconnect structures to a carrier substrate, wherein each interconnect structure includes a redistribution structure; a first encapsulant on the redistribution structure; and a via extending through the encapsulant to physically and electrically connect to the redistribution structure; depositing a second encapsulant on the interconnect structures, wherein adjacent interconnect structures are laterally separated by the second encapsulant; after depositing the second encapsulant, attaching a first core substrate to the redistribution structure of at least one interconnect structure, wherein the core substrate is electrically connected to the redistribution structure; and attaching semiconductor devices to the interconnect structures, wherein the semiconductor devices are electrically connected to the vias of the interconnect structures.

Abstract: An imaging optical lens system includes eleven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element, a ninth lens element, a tenth lens element and an eleventh lens element. There is an air gap in a paraxial region between each of all adjacent lens elements of the imaging optical lens system. At least one of an object-side surface and an image-side surface of each of at least two lens elements located between an aperture stop and an image surface of the imaging optical lens system is concave in a paraxial region thereof and has at least one convex critical point in an off-axis region thereof.

Abstract: Mechanisms for reducing register bank conflicts based on software hint and hardware thread switch are disclosed. In some embodiments, an apparatus for thread switching includes a graphics processing unit (GPU) that includes a plurality of register banks to store operands that are assigned at least partially to avoid register bank conflicts. A decoding circuitry checks a thread switching field of a first instruction to be executed by a first thread. The GPU performs a thread switch mechanism to cause a second instruction to be executed by a second thread when the thread switching field of the first instruction is set.

Abstract: A method and apparatus are disclosed, from the perspective of the UE, for performing random access procedure. In one embodiment, the method includes the UE receiving a message from a network. The message includes a TTI information of Msg3. In addition, the method includes the UE transmitting a preamble to the network. The method also includes the UE receiving a Msg2 from the network for responding the preamble. The method further includes the UE performing a Msg3 transmission to the network according to the TTI information of Msg3.

Abstract: An image lens assembly includes, in order from an object side to an image side along an optical path, a first lens group, a second lens group, a third lens group and a fourth lens group. A total number of lens elements in the image lens assembly is seven. The first lens group includes a first lens element with positive refractive power and a second lens element with negative refractive power. Each of the second lens group and the third lens group includes at least one lens element. The fourth lens group includes a seventh lens element. When the image lens assembly is focusing or zooming, a relative position between the first lens group and an image surface is fixed, a relative position between the fourth lens group and the image surface is fixed, and the second lens group and the third lens group move along the optical axis.