Patents by Inventor Wei-Yu Chen

Wei-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11206596
    Abstract: A method and apparatus are disclosed from the perspective of a UE (User Equipment). In one embodiment, the method includes triggering a beam recovery procedure. The method further includes using a first resource on a PUCCH (Physical Uplink Control Channel) channel to transmit a beam failure recovery request to a network. The method also includes receiving a response for the first beam failure recovery request, wherein the response is received within a first measurement gap.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: December 21, 2021
    Assignee: ASUSTek Computer Inc.
    Inventors: Wei-Yu Chen, Jia-Hong Liou
  • Publication number: 20210392542
    Abstract: A method and apparatus are disclosed from the perspective of a UE, wherein the UE is allocated with multiple SR configurations by a network node. In one embodiment, the method includes the UE triggering a MAC control element if a timer expires. The method also includes the UE triggering a SR for the MAC control element. The method also includes the UE transmitting the SR based on a first SR configuration of the multiple SR configurations, wherein the first SR configuration is associated with a highest priority logical channel having data available for transmission when the MAC control element is triggered.
    Type: Application
    Filed: August 18, 2021
    Publication date: December 16, 2021
    Inventors: Wei-Yu Chen, Richard Lee-Chee Kuo, Li-Chih Tseng
  • Patent number: 11194127
    Abstract: A photographing optical lens assembly includes six lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fifth lens element and a sixth lens element. The first lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof and includes at least one convex shape in an off-axis region thereof.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: December 7, 2021
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Yen Chen, Wei-Yu Chen
  • Patent number: 11194128
    Abstract: A photographing optical lens assembly includes seven lens elements, the seven lens elements being, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The third lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The fourth lens element has an image-side surface being concave in a paraxial region thereof. The sixth lens element with positive refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The seventh lens element has an image-side surface being concave in a paraxial region thereof and having at least one critical point in an off-axis region thereof.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: December 7, 2021
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Chun-Che Hsueh, Wei-Yu Chen
  • Patent number: 11194132
    Abstract: A photographing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with refractive power has an object-side surface being convex in a paraxial region thereof. Each second, third, fourth and fifth lens element has refractive power. The sixth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof, and both of the surfaces of the sixth lens element are aspheric. The seventh lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface has at least one convex shape in an off-axis region thereof.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: December 7, 2021
    Assignee: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu Chen
  • Publication number: 20210373298
    Abstract: An optical lens assembly includes seven lens elements which are, in order from object side to image side: first lens element, second lens element, third lens element, fourth lens element, fifth lens element, sixth lens element and seventh lens element. The first lens element has object-side surface having at least one convex shape in off-axis region thereof. The second lens element with positive refractive power has object-side surface being convex in paraxial region thereof. The third lens element has image-side surface being convex in paraxial region thereof. The sixth lens element with positive refractive power has object-side surface being convex in paraxial region thereof. The seventh lens element has image-side surface being concave in paraxial region thereof, and the image-side surface of the seventh lens element has at least one convex critical point in off-axis region thereof. The optical lens assembly has a total of seven lens elements.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Applicant: LARGAN PRECISION CO.,LTD.
    Inventors: Yu-Tai TSENG, Chun-Che HSUEH, Hung-Shuo CHEN, Wei-Yu CHEN
  • Publication number: 20210364746
    Abstract: An imaging optical lens assembly includes nine lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element. The first lens element has positive refractive power. The eighth lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The ninth lens element has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the ninth lens element has at least one convex critical point in an off-axis region thereof.
    Type: Application
    Filed: August 12, 2020
    Publication date: November 25, 2021
    Applicant: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu CHEN
  • Publication number: 20210364739
    Abstract: An optical imaging lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The seventh lens element has an image-side surface being concave in a paraxial region thereof. At least one of an object-side surface and the image-side surface of the seventh lens element has at least one critical point in an off-axis region thereof. The object-side surface and the image-side surface of the seventh lens element are both aspheric.
    Type: Application
    Filed: August 2, 2021
    Publication date: November 25, 2021
    Applicant: LARGAN PRECISION CO., LTD.
    Inventor: Wei-Yu CHEN
  • Patent number: 11184916
    Abstract: A method and apparatus are disclosed from the perspective of a communication device. In one embodiment, the method includes the device being configured with a plurality of resource pools by a base station for a cell. The method further includes the device receiving a grant from the base station, wherein the grant indicates a resource associated with a resource pool of the plurality of resource pools through a resource pool index in the grant. The method also includes the device using the resource to perform a transmission on a device-to-device interface.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: November 23, 2021
    Assignee: ASUSTek Computer Inc.
    Inventors: Wei-Yu Chen, Li-Chih Tseng, Li-Te Pan, Ming-Che Li
  • Publication number: 20210356699
    Abstract: A photographing lens assembly includes eight lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof. The seventh lens element has an image-side surface being concave in a paraxial region thereof. The eighth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof, and the image-side surface of the eighth lens element has at least one critical point in an off-axis region thereof.
    Type: Application
    Filed: July 29, 2021
    Publication date: November 18, 2021
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Chen LIN, Yu-Tai TSENG, Wei-Yu CHEN
  • Publication number: 20210351172
    Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.
    Type: Application
    Filed: July 19, 2021
    Publication date: November 11, 2021
    Inventors: Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20210341707
    Abstract: An imaging optical lens assembly includes five optical elements with refractive power. The five optical elements, in order from an object side to an image side along an optical path, are a first optical element, a second optical element, a third optical element, a fourth optical element, and a fifth optical element. The first optical element has an object-side surface being concave in a paraxial region thereof. The third optical element has negative refractive power.
    Type: Application
    Filed: September 3, 2020
    Publication date: November 4, 2021
    Inventors: SHAO-YU CHANG, WEI-YU CHEN
  • Publication number: 20210343626
    Abstract: In an embodiment, a device includes: an integrated circuit die; a first dielectric layer over the integrated circuit die; a first metallization pattern extending through the first dielectric layer to electrically connect to the integrated circuit die; a second dielectric layer over the first metallization pattern; an under bump metallurgy extending through the second dielectric layer; a third dielectric layer over the second dielectric layer and portions of the under bump metallurgy; a conductive ring sealing an interface of the third dielectric layer and the under bump metallurgy; and a conductive connector extending through the center of the conductive ring, the conductive connector electrically connected to the under bump metallurgy.
    Type: Application
    Filed: July 12, 2021
    Publication date: November 4, 2021
    Inventors: Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming Shih Yeh
  • Patent number: 11166292
    Abstract: Methods and apparatuses for handling collision between sidelink feedback and sidelink data in a wireless communication system are disclosed herein. In one method, a User Equipment (UE) is (pre-)configured to perform one or more sidelink transmissions on multiple carriers, wherein the UE is able to transmit a first number of carriers among the multiple carriers at the same time. The UE selects a first resource for transmitting a first sidelink transmission in a first slot on a first carrier. The UE derives a second resource for transmitting a PSFCH delivering a feedback in a second slot on a second carrier, wherein the second slot is at least partly overlapping with the first slot in a time domain. The UE determines whether to prioritize either the PSFCH or the first sidelink transmission based on a rule when the number of carriers which the UE identifies to transmit in the overlapped slot exceeds the first number of carriers.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 2, 2021
    Assignee: ASUSTek Computer Inc.
    Inventors: Chun-Wei Huang, Ming-Che Li, Wei-Yu Chen
  • Patent number: 11163578
    Abstract: Mechanisms for reducing register bank conflicts based on software hint and hardware thread switch are disclosed. In some embodiments, an apparatus for thread switching includes a graphics processing unit (GPU) that includes a plurality of register banks to store operands that are assigned at least partially to avoid register bank conflicts. Decoding circuitry checks a thread switching field of a first instruction to be executed by a first thread. The GPU performs a thread switch mechanism to cause a second instruction to be executed by a second thread when the thread switching field of the first instruction is set.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: November 2, 2021
    Assignee: Intel Corporation
    Inventors: Buqi Cheng, Wei-Yu Chen, Guei-Yuan Lueh, Chandra Gurram, Subramaniam Maiyuran
  • Patent number: 11159979
    Abstract: A method and apparatus are disclosed from the perspective of a UE, wherein the UE is allocated with multiple SR configurations by a network node. In one embodiment, the method includes the UE triggering a MAC control element if a timer expires. The method also includes the UE triggering a SR for the MAC control element. The method also includes the UE transmitting the SR based on a first SR configuration of the multiple SR configurations, wherein the first SR configuration is associated with a highest priority logical channel having data available for transmission when the MAC control element is triggered.
    Type: Grant
    Filed: April 26, 2018
    Date of Patent: October 26, 2021
    Assignee: ASUSTek Computer Inc.
    Inventors: Wei-Yu Chen, Richard Lee-Chee Kuo, Li-Chih Tseng
  • Publication number: 20210327840
    Abstract: A package structure is provided. The package structure includes a semiconductor die and a molding compound layer surrounding the semiconductor die. The package structure also includes a conductive bump over the molding compound layer and a first polymer-containing layer surrounding and in contact with the conductive bump. The package structure further includes a second polymer-containing layer disposed over the first polymer-containing layer. A bottom surface of the conductive bump is below a bottom surface of the second polymer-containing layer.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan PEI, Chih-Chiang TSAO, Wei-Yu CHEN, Hsiu-Jen LIN, Ming-Da CHENG, Ching-Hua HSIEH, Chung-Shi LIU
  • Patent number: 11145633
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a semiconductor die an insulating encapsulation laterally covering the semiconductor die. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads distributed over the semiconductor substrate, a plurality of conductive vias disposed on and electrically connected to the conductive pads, and a dielectric layer disposed over the semiconductor substrate and spaced the conductive vias apart from one another. A sidewall of the dielectric layer extends along sidewalls of the conductive vias, the conductive vias are recessed from a top surface of the dielectric layer, and a sloped surface of the dielectric layer is connected to the top surface of the dielectric layer and the sidewall of the dielectric layer.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 12, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Tien-Chung Yang, Ming-Shih Yeh
  • Patent number: 11133197
    Abstract: A structure and method of forming are provided. The structure includes a dielectric layer disposed on a substrate. The structure includes a cavity in the dielectric layer, and a plurality of contacts positioned in the cavity and bonded to the substrate. A component is bonded to the plurality of contacts. Underfill is disposed in the cavity between the dielectric layer and the component. A plurality of connectors is on the dielectric layer, the connectors being connected through the dielectric layer to a conductor that is at a same level of metallization as the plurality of contacts.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: September 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen
  • Publication number: 20210297572
    Abstract: A motor controller used for driving a motor is provided. The motor includes a motor coil and a maximum rated current. The motor controller comprises a driving circuit, a control unit, a digital-to-analog converter, an operational amplifier, a switch circuit, and a resistor. When it is needed to decrease a settling time for the motor to reach a target position, or a vibration is detected within a camera module so as to enable an image stabilization mechanism, it is capable of temporarily supplying a driving current greater than the maximum rated current to the motor coil.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 23, 2021
    Inventors: Wei-Yu Chen, Ching-Lung Tsai