Patents by Inventor Wei Yu
Wei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150002727Abstract: An imaging lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element and a third lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element with refractive power has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The third lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface of the third lens element has at least one convex shape in an off-axis region thereof, and both of an object-side surface and the image-side surface are aspheric. The imaging lens assembly has a total of three lens elements with refractive power.Type: ApplicationFiled: July 3, 2013Publication date: January 1, 2015Inventor: Wei-Yu CHEN
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Patent number: 8923772Abstract: A method and apparatus for controlling transmission power in a wireless network area is provided. A target base station may control transmission power in cooperation with a neighboring base station and, thus, a satisfaction with a Quality of Service (QoS) of target terminals may be improved. Additionally, the target base station may determine whether to control the transmission power in cooperation with the neighboring base station, based on a possible improvement in satisfaction with the QoS of the target terminals.Type: GrantFiled: April 18, 2011Date of Patent: December 30, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Wei Yu, Tae Soo Kwon, Chang Yong Shin, Kyung Hun Jang, Jong Bu Lim
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Patent number: 8922914Abstract: An image capturing lens system includes four lens elements with refractive power, in order from an object side to an image side, a first lens element, a second lens element, a third lens element and a fourth lens element. The positive first lens element has a convex object-side surface at a paraxial region. The negative second lens element has a concave object-side surface at a paraxial region and an image-side surface changing from concave at a paraxial region to convex at a peripheral region, wherein the surfaces of the second lens element are aspheric. The positive third lens element has a concave object-side surface at a paraxial region and a convex image-side surface at a paraxial region. The negative fourth lens element has an image-side surface changing from concave at a paraxial region to convex at a peripheral region, and the surfaces of the fourth lens element are aspheric.Type: GrantFiled: February 8, 2013Date of Patent: December 30, 2014Assignee: Largan Precision Co., Ltd.Inventors: Chun-Shan Chen, Dung-Yi Hsieh, Lin-Yao Liao, Wei-Yu Chen
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Patent number: 8922632Abstract: The present invention is directed to a guide system having a function of a real-time voice response for the visually impaired and a method thereof. The guide system responds road conditions in real time using two processing modules performing image processing and voice responses, respectively. The guide system includes an visual sensing module sensing an image, a memory storing multiple training samples and multiple pieces of audio response information, an image processing module performing an image detection process to the image so as to create at least a segmented image, performing an object detection process to the segmented image, and performing an object recognition process so as to create a recognition signal, a system processing module creating an audio signal based on the recognition signal such that a speech voice is hearable by a user.Type: GrantFiled: August 6, 2012Date of Patent: December 30, 2014Assignee: National Taipei University of TechnologyInventors: Yen-Lin Chen, Chao-Wei Yu, Chuan-Yen Chiang
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Publication number: 20140374909Abstract: A method for filling a trench with a metal layer is disclosed. A deposition apparatus having a plurality of supporting pins is provided. A substrate and a dielectric layer disposed thereon are provided. The dielectric layer has a trench. A first deposition process is performed immediately after the substrate is placed on the supporting pins to form a metal layer in the trench, wherein during the first deposition process a temperature of the substrate is gradually increased to reach a predetermined temperature. When the temperature of the substrate reaches the predetermined temperature, a second deposition process is performed to completely fill the trench with the metal layer. The present invention further provides a semiconductor device having an aluminum layer with a reflectivity greater than 1, wherein the semiconductor device is formed by using the method.Type: ApplicationFiled: September 9, 2014Publication date: December 25, 2014Inventors: Chi-Mao Hsu, Hsin-Fu Huang, Min-Chuan Tsai, Chien-Hao Chen, Wei-Yu Chen, Chin-Fu Lin, JING-GANG LI, Min-Hsien Chen, JIAN-HONG SU
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Patent number: 8916884Abstract: Disclosed is a light-emitting device comprising: a light-emitting stack with a length and a width comprising: a first conductivity type semiconductor layer; an active layer on the first conductivity type semiconductor layer; and a second conductivity type semiconductor layer on the active layer; a conductive layer with a width greater than the width of the first conductivity type semiconductor layer and under the first conductivity type semiconductor layer, the conductive layer comprising a first overlapping portion which overlaps the first conductivity type semiconductor layer and a first extending portion which does not overlap the first conductivity type semiconductor layer; a transparent conductive layer with a width greater than the width of the second conductivity type semiconductor layer over the second conductivity type semiconductor layer, the transparent conductive layer comprising a second overlapping portion which overlaps the second conductivity type semiconductor layer and a second extending porType: GrantFiled: March 28, 2013Date of Patent: December 23, 2014Assignee: Epistar CorporationInventors: Shih-I Chen, Wei-Yu Chen, Yi-Ming Chen, Ching-Pei Lin, Tsung-Xian Lee
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Publication number: 20140368722Abstract: An image lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial. The second lens element with refractive power has an object-side surface being concave in a paraxial region. The third lens element with negative refractive power has an object-side surface being convex in a paraxial region and an image-side surface being concave in a paraxial region. The fourth lens element with positive refractive power has an object-side surface being concave in a paraxial region and an image-side surface being convex in a paraxial region. The fifth lens element with negative refractive power has an image-side surface being concave in a paraxial region.Type: ApplicationFiled: June 30, 2013Publication date: December 18, 2014Inventors: Dung-Yi HSIEH, Tsung-Han TSAI, Wei-Yu CHEN
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Publication number: 20140367867Abstract: An embodiment is a method including forming a first package and a second package. The first package includes packaging a first die, forming a plurality of solder balls on the first die, and coating the plurality of solder balls with an epoxy flux. The second package includes forming a first electrical connector, attaching a second die adjacent the first electrical connector, forming a interconnect structure over the first die and the first electrical connector, the interconnect structure being a frontside of the second package, forming a second electrical connector over the interconnect structure, and the second electrical connector being coupled to both the first die and the first electrical connector. The method further includes bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux.Type: ApplicationFiled: August 29, 2014Publication date: December 18, 2014Inventors: Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Hsiu-Jen Lin, Kuei-Wei Huang
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Publication number: 20140367726Abstract: A semiconductor light-emitting device including an epitaxial structure, a first electrode structure, a second electrode structure, a light reflective metal layer, a resistivity-enhancing structure and a protection ring is provided. The light-emitting epitaxial structure has a first surface and a second surface. The light-emitting epitaxial structure has a first zone and a second zone. The first electrode structure is disposed within the first zone. The second electrode structure is disposed within the second zone. The light reflective metal layer is disposed adjacent to the second surface. The resistivity-enhancing structure is disposed in contact with a surface of the light reflective metal layer and corresponding to a position of the first electrode structure. The protection ring has a first portion and a second portion. The first portion surrounds a sidewall of the light reflective metal layer. The second portion corresponds to the second electrode structure.Type: ApplicationFiled: August 29, 2014Publication date: December 18, 2014Inventors: Wei-Yu Yen, Li-Ping Chou, Fu-Bang Chen, Chih-Sung Chang
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Patent number: 8913329Abstract: An image lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial. The second lens element with refractive power has an object-side surface being concave in a paraxial region. The third lens element with negative refractive power has an object-side surface being convex in a paraxial region and an image-side surface being concave in a paraxial region. The fourth lens element with positive refractive power has an object-side surface being concave in a paraxial region and an image-side surface being convex in a paraxial region. The fifth lens element with negative refractive power has an image-side surface being concave in a paraxial region.Type: GrantFiled: June 30, 2013Date of Patent: December 16, 2014Assignee: Largan Precision Co., Ltd.Inventors: Dung-Yi Hsieh, Tsung-Han Tsai, Wei-Yu Chen
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Publication number: 20140361970Abstract: A reflective display device includes a drive array substrate, an electrophoretic display film, a reflective optical film and a light source module. The electrophoretic display film is disposed on the drive array substrate and includes a plurality of display mediums. The reflective optical film is disposed on the electrophoretic display film. The light source module is disposed beside the reflective optical film. A light emitting from the light source module is reflected to the electrophoretic display film by the reflective optical film. The light source module includes a plurality of first-color light sources, a plurality of second-color light sources and a plurality of third-color light sources which are switched on in sequence. The reflective display device is in a color display mode when the light source module is turned on. The reflective display device is in a monochrome display mode when the light source module is turned off.Type: ApplicationFiled: February 19, 2014Publication date: December 11, 2014Applicant: E Ink Holdings Inc.Inventors: Cheng-Hang Hsu, Tzung-Wei Yu, Kuan-Yi Lin, Ted-Hong Shinn
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Patent number: 8908288Abstract: An image capturing optical lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has positive refractive power. The third lens element has negative refractive power. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power is made of plastic material, and has an image-side surface being concave at a paraxial region and being convex at a peripheral region, wherein at least one of an object-side surface and the image-side surface of the fifth lens element is aspheric.Type: GrantFiled: October 26, 2012Date of Patent: December 9, 2014Assignee: Largan Precision Co., Ltd.Inventors: Chih-Wen Hsu, Tsung-Han Tsai, Wei-Yu Chen
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Patent number: 8908370Abstract: An electronic device includes a body, a cover coupled to the body, and a sliding mechanism. The sliding mechanism includes a rotating component, a first locking component, and a second locking component. When the second locking component moves to a locked position, the second locking component engages with the first locking component to lock the cover to the body. When the second locking component moves to an unlocked position, the first locking component disengages from the second locking component, to allow the rotating component to rotatably drive the cover to be opened.Type: GrantFiled: September 29, 2012Date of Patent: December 9, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Che-Yu Chou, Qun Huang, Tai-Shan Zhu, Wen-Chih Lan, Tao Jiang, Hai-Qian Ge, Jun-Liang Zhang, Wei-Wei Yu, Hua-Yong Wang, Ji-Bing Guo, Zhou Chen, Zhi-Jun Shi
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Patent number: 8908295Abstract: An optical image capturing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region. The second lens element with negative refractive power has an object-side surface being concave in a paraxial region and an image-side surface being convex in a paraxial region. The third lens element has refractive power. The fourth lens element with refractive power has an object-side surface being convex in a paraxial region. The fifth lens element with positive refractive power has an image-side surface being convex in a paraxial region. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region.Type: GrantFiled: July 10, 2013Date of Patent: December 9, 2014Assignee: Largan Precision Co., Ltd.Inventors: Tsung-Han Tsai, Wei-Yu Chen
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Publication number: 20140354872Abstract: An imaging lens system includes six non-cemented lens elements with refractive power, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has positive refractive power. The second lens element has refractive power. The third lens element has positive refractive power. The fourth lens element has refractive power. The fifth lens element has refractive power, wherein both of the surfaces thereof are aspheric. The sixth lens element with refractive power has a concave image-side surface in a paraxial region thereof, wherein the image-side surface has at least one convex shape in an off-axis region thereof, and both of the surfaces thereof are aspheric. The imaging lens system has a total of six lens elements with refractive power.Type: ApplicationFiled: June 13, 2013Publication date: December 4, 2014Inventors: Kuan-Ming CHEN, Wei-Yu CHEN
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Patent number: 8901726Abstract: A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.Type: GrantFiled: December 7, 2012Date of Patent: December 2, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu
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Patent number: 8902808Abstract: Systems, methods and apparatuses are provided for mitigating interference in wireless networks, and particularly in an advanced backhaul wireless network comprising several hubs, each hub serving its own remote backhaul modules (RBMs). Preferred embodiments provide practical power spectrum adaptation methods for the management of interhub interference. These methods are shown to improve the overall network throughput significantly compared to a conventional network with fixed transmit power spectrum. Optionally, joint scheduling and power control are used to optimize the network utility. Also provided are methods which evoke the channel average gains generated by measurements for managed adaptive resource allocation (MARA). The proposed methods are computationally feasible and fast in convergence. They can be implemented in a distributed fashion across all hubs. Some of the proposed methods can be implemented asynchronously at each hub.Type: GrantFiled: May 3, 2012Date of Patent: December 2, 2014Assignee: BLINQ Wireless Inc.Inventors: Hayssam Dahrouj, Wei Yu, Taiwen Tang, Steve Andre Beaudin
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Patent number: 8902572Abstract: An electronic device includes a first body having a top surface, a second body slidably covering on the first body, and at least one connecting member for connecting the first body with the second body. The second body is capable of sliding from a first position covering the top surface to a second position uncovering the top surface. When the second body is in the first position, the first body hides the top surface to allow the electronic device being used in a first state, and when the second body is in the second position, the second body is operable to be coplanar with the first body to allow the electronic device being used in a second state.Type: GrantFiled: June 1, 2012Date of Patent: December 2, 2014Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Wei-Wei Yu, Che-Yu Chou, Qun Huang, Tai-Shan Zhu, Tao Jiang, Wen-Chih Lan, Hai-Qian Ge, Jun-Liang Zhang, Zhi-Jun Shi, Ji-Bing Guo, Hua-Yong Wang
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Patent number: 8899787Abstract: The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.Type: GrantFiled: November 2, 2011Date of Patent: December 2, 2014Assignee: TSMC Solid State Lighting Ltd.Inventor: Wei-Yu Yeh
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Publication number: 20140346544Abstract: A light-emitting element includes a reflective layer; a first transparent layer on the reflective layer; a light-emitting stack having an active layer on the first transparent layer; and a cavity formed in the first transparent layer.Type: ApplicationFiled: May 23, 2014Publication date: November 27, 2014Applicant: EPISTAR CORPORATIONInventors: Wen-Luh LIAO, Shao-Ping LU, Hung-Ta CHEN, Shih-I CHEN, Chia-Liang HSU, Shou-Chin WEI, Ching-Pei LIN, Yu-Ren PENG, Chien-Fu HUANG, Wei-Yu CHEN, Chun-Hsien CHANG