Patents by Inventor Wei Yu

Wei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240053587
    Abstract: An imaging optical system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with refractive power has an object-side surface being convex in a paraxial region and an image-side surface being concave in a paraxial region. The second lens element with positive refractive power has an image-side surface being convex in a paraxial region. The third lens element with negative refractive power has an image-side surface being concave in a paraxial region. The fourth lens element with positive refractive power has an image-side surface being convex in a paraxial region. The fifth lens element with negative refractive power has an image-side surface being concave in a paraxial region and having a convex shape in an off-axial region thereof.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 15, 2024
    Inventors: Dung-Yi HSIEH, Chun-Che HSUEH, Wei-Yu CHEN
  • Publication number: 20240055468
    Abstract: A method of forming an inductor including forming a first redistribution structure on a substrate, forming a first conductive via over and electrically connected to the first redistribution structure, depositing a first magnetic material over a top surface and sidewalls of the first conductive via, coupling a first die and a second die to the first redistribution structure, encapsulating the first die, the second die, and the first conductive via in an encapsulant, and planarizing the encapsulant and the first magnetic material to expose the top surface of the first conductive via while a remaining portion of the first magnetic material remains on sidewalls of the first conductive via, where the first conductive via and the remaining portion of the first magnetic material provide an inductor.
    Type: Application
    Filed: January 23, 2023
    Publication date: February 15, 2024
    Inventors: Wei-Yu Chen, Chung-Hui Chen, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee, Shang-Yun Hou
  • Patent number: 11900502
    Abstract: Examples described herein relate to a software and hardware optimization that manages scenarios where a write operation to a register is less than an entirety of the register. A compiler detects instructions that make partial writes to the same register, groups such instructions, and provides hints to hardware of the partial write. The execution unit combines the output data for grouped instructions and updates the destination register as single write instead of multiple separate partial writes.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Chandra S. Gurram, Gang Y. Chen, Subramaniam Maiyuran, Supratim Pal, Ashutosh Garg, Jorge E. Parra, Darin M. Starkey, Guei-Yuan Lueh, Wei-Yu Chen
  • Patent number: 11901196
    Abstract: A method includes placing an electronic die and a photonic die over a carrier, with a back surface of the electronic die and a front surface of the photonic die facing the carrier. The method further includes encapsulating the electronic die and the photonic die in an encapsulant, planarizing the encapsulant until an electrical connector of the electronic die and a conductive feature of the photonic die are revealed, and forming redistribution lines over the encapsulant. The redistribution lines electrically connect the electronic die to the photonic die. An optical coupler is attached to the photonic die. An optical fiber attached to the optical coupler is configured to optically couple to the photonic die.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen
  • Patent number: 11899185
    Abstract: The present disclosure provides an image capturing optical system comprising: a positive first lens element having a convex object-side surface; a negative second lens element having a concave object-side surface; a third lens element; a fourth lens element having a convex object-side surface and a concave image-side surface, the object-side surface and the image-side surface thereof being aspheric; a fifth lens element having a concave image-side surface concave, both of the object-side surface and the image-side surface being aspheric, at least one of the object-side surface and the image-side surface having at least one convex shape in an off-axis region thereof.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: February 13, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Kuan-Ming Chen, Wei-Yu Chen
  • Patent number: 11901258
    Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang, Chih-Wei Lin, Hsiu-Jen Lin, Ching-Hua Hsieh, Chung-Shi Liu
  • Patent number: 11901442
    Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan, Zheng-Yang Pan, Cheng-Po Chau, Pin-Chu Liang, Hung-Yao Chen, De-Wei Yu, Yi-Cheng Li
  • Patent number: 11899184
    Abstract: An image capturing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. The first lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The second and third lens elements have refractive power. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof. The sixth lens element with refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image capturing lens assembly has a total of six lens elements with refractive power.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: February 13, 2024
    Assignee: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Chen Lin, Wei-Yu Chen
  • Publication number: 20240045180
    Abstract: An image lens assembly includes five lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The third lens element has negative refractive power. The fourth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The fifth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the fifth lens element includes at least one convex critical point in an off-axis region thereof.
    Type: Application
    Filed: October 16, 2023
    Publication date: February 8, 2024
    Inventors: Chung-Yu WEI, Hung-Shuo CHEN, Kuan-Chun WANG, Wei-Yu CHEN
  • Publication number: 20240044700
    Abstract: An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.
    Type: Application
    Filed: October 13, 2023
    Publication date: February 8, 2024
    Inventors: CHIH-MING SUN, PO-WEI YU
  • Publication number: 20240048254
    Abstract: Examples pertaining to determining transmission configuration indicator (TCI) for received signal strength indicator (RSSI) measurement in mobile communications are described. A user equipment (UE) determines a quasi-co-location (QCL) assumption with respect to a received signal strength indicator (RSSI) responsive to not receiving a TCI from a network. The UE also performs an RSSI measurement based on the determined QCL assumption in an expanded Frequency Range 2 (FR2-2) band according to a 3rd Generation Partnership Project (3GPP) specification.
    Type: Application
    Filed: July 19, 2023
    Publication date: February 8, 2024
    Inventors: Hsuan-Li Lin, Tsang-Wei Yu
  • Publication number: 20240047285
    Abstract: A semiconductor device assembly includes a semiconductor die, a substrate, and a spacer directly coupled to the substrate. The spacer includes a flexible main body and a support structure embedded in the flexible main body, wherein the support structure has a higher stiffness than the flexible main body. The spacer carries the semiconductor die. The flexible main body of the spacer mitigates the effects of thermomechanical stress, for example caused by a mismatch between the coefficient of thermal expansion of the semiconductor die and the substrate. The embedded support structure provides strength needed to support the semiconductor die during assembly.
    Type: Application
    Filed: August 8, 2022
    Publication date: February 8, 2024
    Inventors: Faxing Che, Wei Yu, Yeow Chon Ong, Shin Yueh Yang, Hong Wan Ng
  • Publication number: 20240048960
    Abstract: Examples pertaining to handling of multi-Universal Subscriber Identity Module (MUSIM) gaps collision in mobile communications are described. A multiple-Universal Subscriber Identity Modules (MUSIM) user equipment (UE) applies different priorities with respect to MUSIM gaps and legacy measurement gaps (MGs). The UE performs wireless communications such that a collision between MUSIM gaps and legacy MGs is handled.
    Type: Application
    Filed: June 29, 2023
    Publication date: February 8, 2024
    Inventors: Ogeen Hanna Toma, Tsang-Wei Yu
  • Patent number: 11894312
    Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu
  • Patent number: 11890902
    Abstract: A duplex Bluetooth transmission tire pressure system and a method thereof are provided. The system includes a Bluetooth tire pressure detector and a transceiver host, and the two can duplex Bluetooth transmit to each other, so that to complete locating and tire condition detecting. The transceiver host controls a locating program that controls the Bluetooth tire pressure detector to start or stop and limit the transmitting packet of the tire condition program of the Bluetooth tire pressure detector.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: February 6, 2024
    Assignee: SYSGRATION LTD.
    Inventors: Chih-Wei Yu, Shih-Yao Lin
  • Patent number: 11892802
    Abstract: A lensless holographic imaging system having a holographic optical element includes: a coherent light source for outputting a first light beam and a second light beam, wherein the first light beam irradiates a first inspection plane to form first object-diffracted light; a light modulator for modulating the second light beam into reading light having a specific wavefront; a multiplexed holographic optical element, wherein the first object-diffracted light passes through the multiplexed holographic optical element, and the reading light is input into the multiplexed holographic optical element to generate a diffracted light beam as system reference light; and an image capture device for reading at least one interference signal generated by interference between the first object-diffracted light and the system reference light. The lensless holographic imaging system has a relatively small volume and relatively high diffraction efficiency.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: February 6, 2024
    Assignee: NATIONAL CENTRAL UNIVERSITY
    Inventors: Yeh-Wei Yu, Ching-Cherng Sun
  • Patent number: 11895516
    Abstract: Techniques and examples of determination of receiver (RX) beam for radio link monitoring (RLM) based on available spatial quasi-co-location (QCL) information in New Radio (NR) mobile communications are described. An apparatus receives downlink (DL) signaling from a network. The apparatus determines whether to extend an evaluation period of RLM based on a quasi-co-location (QCL) association provided in at least the DL signaling. The apparatus then executes extension of the evaluation period of the RLM, or not, based on a result of the determining.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: February 6, 2024
    Assignee: MediaTek Inc.
    Inventors: Hsuan-Li Lin, Kuhn-Chang Lin, Tsang-Wei Yu
  • Patent number: 11895772
    Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: February 6, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chi-Min Chang, Ching-Sheng Chen, Jun-Rui Huang, Wei-Yu Liao, Yi-Pin Lin
  • Publication number: 20240038440
    Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.
    Type: Application
    Filed: October 5, 2023
    Publication date: February 1, 2024
    Inventors: Feng-Lung CHIEN, Tsang-Feng WU, Yuan HAN, Tzu-Chieh KAO, Chien-Hung LIN, Kuang-Lun LEE, Hsiang-Hui HSU, Shu-Yi TSUI, Kuo-Jui LEE, Kun-Ying LEE, Mao-Chun CHEN, Tai-Hsien YU, Wei-Yu CHEN, Yi-Ju LI, Kuei-Yuan CHANG, Wei-Chun LI, Ni-Ni LAI, Sheng-Hao LUO, Heng-Sheng PENG, Yueh-Hui KUAN, Hsiu-Chen LIN, Yan-Bing ZHOU, Chris T. Burket
  • Publication number: 20240039185
    Abstract: Methods, systems, and devices for connection designs for memory systems are described. A memory system may include a package and a printed circuit board (PCB). An interface of the package may be coupled with the PCB via a set of springs, where each spring may include a material configured to deform based at least in part on a shape of the package, a shape of the PCB, or both. The memory system may also include a set of latches that may secure the package in a fixed position relative to the PCB. That is, the set of springs may provide an electrical connection between the package and the PCB, and the set of latches may provide a mechanical connection between the package and the PCB. In some examples, the package, the PCB, or both, may include one or more connection structures configured to receive the latches.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 1, 2024
    Inventors: Wei Yu, Ling Pan