Patents by Inventor Wei Zhang

Wei Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240032815
    Abstract: The present disclosure provides a target identification method, a target identification device, an electronic apparatus, a storage medium and a neuromodulation apparatus. The target identification method includes: acquiring scan data of a subject, the scan data including data obtained from magnetic resonance imaging of the subject's brain; determining the corresponding relationship of regions of interest of a disease type of the subject according to the disease type of the subject; determining at least one disease region of interest and at least one target region of interest of the subject in the scan data according to the corresponding relationship of the regions of interest; determining connectivity between each of voxels in the target region of interest and each disease region of interest in the at least one disease region of interest; and determining the positions of the voxels with the connectivity meeting a preset target connectivity condition in the target region of interest as the targets.
    Type: Application
    Filed: June 27, 2022
    Publication date: February 1, 2024
    Inventors: Kecheng Wei, Wei Zhang, Qiong Zhang
  • Publication number: 20240037796
    Abstract: A method for coding includes: obtaining original point cloud data; creating an adaptive prediction list of the attribute information of the point cloud; selecting a prediction mode from the adaptive prediction list and predicting the attribute information of the point cloud, to obtain a predicted residual; and coding the prediction mode and the predicted residual, to obtain codestream information.
    Type: Application
    Filed: May 18, 2022
    Publication date: February 1, 2024
    Inventors: Wei Zhang, Fuzheng Yang, Zexing Sun, Junyan Huo
  • Publication number: 20240035343
    Abstract: A centralizer for a downhole probe disposed within an eccentric pipe, the centralizer having an elongated, primary tubular member with three or more elongated centralizer strip assemblies extending along the primary tubular member. Each strip assembly has inner and outer portions opposing one another on the wall of the primary tubular member and spaced apart from one another about the circumference of the wall. The inner portions of the strip assemblies engage the outer diameter of a probe and are all sized and shaped to have the same inner radial length. The outer portions of the strip assemblies have at least two different outer radial lengths, where one of the outer portions has an outer radial length longer than any other outer radial portions. The outer radial lengths are selected so that the sonde can be coaxially positioned within the eccentric pipe relative to the outer diameter of eccentric pipe.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 1, 2024
    Inventors: Lizheng Zhang, Wei Zhang
  • Patent number: 11883482
    Abstract: The disclosure provides a recombinant nucleic acid of Seneca valley virus, a recombinant vaccine strain and preparation method and use thereof, and relates to the technical field of genetic engineering. The disclosure provides the recombinant nucleic acid of Seneca valley virus, recombinant Seneca valley virus comprising the recombinant nucleic acid, recombinant Seneca valley virus encoded by the recombinant nucleic acid, recombinant Seneca valley virus vaccine strain comprising the recombinant Seneca valley virus and preparation method and use thereof. According to the disclosure, a vaccine strain characterized by high antigen production capacity, remarkably reduced pathogenicity (even having no pathogenicity to pigs), strong antibody induction activity, high immune protection rate is prepared. The vaccine strain remarkably improves the biological safety and can be used for preventing and controlling Seneca valley virus in China and the neighboring countries.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: January 30, 2024
    Inventors: Haixue Zheng, Fan Yang, Zixiang Zhu, Weijun Cao, Hong Tian, Keshan Zhang, Ting Wei, Min Zheng, Wei Zhang, Wen Dang, Xusheng Ma, Dan Li, Yi Ru, Jijun He, Jianhong Guo, Xiangtao Liu
  • Patent number: 11886969
    Abstract: Embodiments of a method are disclosed. The method includes performing distributed deep learning training on a batch of training data. The method also includes determining training times representing an amount of time between a beginning batch time and an end batch time. Further, the method includes modifying a communication aspect of the communication straggler to reduce a future network communication time for the communication straggler to send a future result of the distributed deep learning training on a new batch of training data in response to the centralized parameter server determining that the learner is the communication straggler.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: January 30, 2024
    Assignee: International Business Machines Corporation
    Inventors: Wei Zhang, Xiaodong Cui, Abdullah Kayi, Alper Buyuktosunoglu
  • Patent number: 11888417
    Abstract: An energy conversion apparatus, a motor, a power system, and a vehicle are provided. The energy conversion apparatus may integrate a motor drive function by using a three-phase bridge arm converter and a motor winding, and integrate an alternating current charging function by using a two-phase two-bridge-arm converter and a transformer. In this way, the energy conversion apparatus can integrate the charging function and the motor drive function. When the energy conversion apparatus is installed on an electric vehicle, a vehicle integration level can be increased, a structure layout of the electric vehicle can be simplified, and costs and a volume of the electric vehicle can be reduced.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: January 30, 2024
    Assignee: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Zhaoxue Cui, Wei Zhang, Ningbo Feng
  • Patent number: 11887912
    Abstract: The present disclosure belongs to the technical field of integrated circuit packaging, and specifically relates to a through silicon via structure for three-dimensional integrated circuit packaging and a manufacturing method thereof.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: January 30, 2024
    Assignees: Fudan University, Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
    Inventors: Bao Zhu, Lin Chen, Qingqing Sun, Wei Zhang
  • Publication number: 20240027269
    Abstract: A reconstruction method for spectral image includes: obtaining a measurement image of an imaging object, and reconstructing and obtaining a spectral image of the imaging object according to the measurement image and a pre-calibrated sensing matrix. The spectral image includes spectral information at different position points of the imaging object. Through the method, defects of the time-consuming spectral image reconstruction method and the low resolution of the obtained spectral image in the related art can be overcame and the spectral image of the target imaging object can be obtained by reconstructing quickly and the obtained spectral image has high spatial resolution and no mosaic.
    Type: Application
    Filed: November 17, 2022
    Publication date: January 25, 2024
    Inventors: Kaiyu CUI, Jiawei YANG, Yidong HUANG, Wei ZHANG, Xue FENG, Fang LIU
  • Publication number: 20240032375
    Abstract: A display substrate and a method for manufacturing the same, and a display device are provided. The display substrate includes a base substrate, a plurality of sub-pixels and an isolation structure. A light-emitting element of each sub-pixel includes a light emitting functional layer, and a first electrode and a second electrode which are located on two sides of the light emitting functional layer, the first electrode being located between the light emitting functional layer and the base substrate, and the light emitting functional layer including a conductive sub-layer. The isolation structure is located between adjacent sub-pixels, and the conductive sub-layer in the light emitting functional layer is disconnected at the position of the isolation structure. The isolation structure includes a plurality of ring-shaped isolation parts, each of which surrounds one sub-pixel.
    Type: Application
    Filed: July 12, 2022
    Publication date: January 25, 2024
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Tinghua SHANG, Wei ZHANG, Yi ZHANG, Weiyun HUANG, Ang XIAO, Tingliang LIU
  • Publication number: 20240030034
    Abstract: A method includes forming a 2-D material semiconductor layer over a substrate; forming source/drain electrodes covering opposite sides of the 2-D material semiconductor layer, while leaving a portion of the 2-D material semiconductor layer exposed by the source/drain electrodes; forming a first gate dielectric layer over the portion of the 2-D material semiconductor layer by using a physical deposition process; forming a second gate dielectric layer over the first gate dielectric layer by using a chemical deposition process, in which a thickness of the first gate dielectric layer is less than a thickness of the second gate dielectric layer; and forming a gate electrode over the second gate dielectric layer.
    Type: Application
    Filed: October 4, 2023
    Publication date: January 25, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Shih-Yen LIN, Po-Cheng TSAI, Yu-Wei ZHANG
  • Publication number: 20240032376
    Abstract: A pixel array includes a plurality of sub-pixels, which include first to third sub-pixels. The first and third sub-pixels are alternately arranged along a row direction and form first pixel rows. The first and third sub-pixels, which are in a same column, in the first pixel rows are alternately arranged, and the second sub-pixels are arranged side by side along the row direction and form second pixel rows. Lines sequentially connecting centers of two of the first sub-pixels and two of the third sub-pixels, which are arranged in an array, together form a first virtual quadrilateral, and one of the second sub-pixels is in each first virtual quadrilateral. A straight line in the row direction or in a column direction, which passes through a center of each sub-pixel of at least one of the plurality of sub-pixels, divides the sub-pixel into two parts having areas different from each other.
    Type: Application
    Filed: September 29, 2023
    Publication date: January 25, 2024
    Inventors: Ming HU, Yan HUANG, Chang LUO, Jianpeng WU, Benlian WANG, Peng XU, Wei ZHANG, Qian XU
  • Publication number: 20240028141
    Abstract: Embodiments of this application provide a wireless charging system, a chip, and a wireless charging circuit. The wireless charging system includes an electronic device and a stylus, where the electronic device is configured to wirelessly charge the stylus; and the stylus includes a wireless charging circuit. The wireless charging circuit includes a first coil, a chip, and a first battery, the chip includes a rectifier, a charger unit, a micro-control unit, and a protocol encoding/decoding unit. The charger unit includes a voltage-stabilizing charging circuit, a boost charging circuit, or a switched capacitor charging circuit; and the charger unit is configured to charge the first battery by using the direct current signal from the rectifier. For the stylus, energy is coupled from the coil, passes through the chip, and then is directly output to a battery of the stylus.
    Type: Application
    Filed: January 27, 2022
    Publication date: January 25, 2024
    Inventors: Feng Wang, Yuan Wu, Wei Zhang, Chao Wang, Lilie Zhao
  • Patent number: 11881896
    Abstract: An image collection chip, an object imaging recognition device and an object imaging recognition method are provided. The image collection chip comprises an optical modulation layer and an image sensing layer. The optical modulation layer is located on the image sensing layer. The optical modulation layer is provided with at least two modulation units and the image sensing layer is provided with sensing units corresponding to the at least two modulation units in a form of up and down. Each of the at least two modulation units is provided with at least one modulation subunit. Two or more modulation units among the at least two modulation units have different graphic structures, and the two or more modulation units having different graphic structures have different modulation roles on spectrum.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: January 23, 2024
    Assignee: TSINGHUA UNIVERSITY
    Inventors: Kaiyu Cui, Xusheng Cai, Hongbo Zhu, Yidong Huang, Wei Zhang, Xue Feng, Fang Liu
  • Patent number: 11882304
    Abstract: Provided are a picture encoding and decoding method, an encoder, a decoder and a storage medium. The decoder decodes a bitstream to obtain a size, a coding mode, and residuals of a current block; when the coding mode of the current block is an MIP mode, calculates a second offset based on the size of the current block, a first offset and reconstructed values of adjacent pixels corresponding to the current block; determines a first prediction value of the current block according to the second offset; and determines a reconstructed value of the current block based on the first prediction value.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: January 23, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Junyan Huo, Yanzhuo Ma, Shuai Wan, Wei Zhang, Fuzheng Yang, Haixin Wang, Yu Sun
  • Patent number: 11879834
    Abstract: A method includes identifying, by pre-set criteria, a first plurality of optical channels and a second plurality of optical channels using optical data generated from a plurality of optical filters of a tester tool. The method also includes determining, from the optical data, a first plurality of fluid types detected by each channel in the first plurality of optical channels using a bootstrap fluid identification technique and determining, from the optical data and the first plurality of fluid types, a second plurality of fluid types detected by each channel in the second plurality of optical channels using a guided fluid identification technique. Further, the method includes generating a spectral signature indicating fluid types for each channel within the tester tool based on the first plurality of fluid types and second plurality of fluid types.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: January 23, 2024
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Zhonghuan Chen, Bin Dai, Wei Zhang
  • Patent number: 11881942
    Abstract: A network device (e.g., a user equipment (UE), a new radio NB (gNB), or other network component) can process or generate a physical shared channel based on a number of resource blocks determined by one or more formulas for a transport block size (TBS). In response to determining a result of the one or more formulas based on one or more received parameters a configured action for the physical shared channel can be determined based on the number of resource elements (REs). A radio frequency (RF) interface, is configured to provide, to RF circuitry, data for transmitting a new radio (NR) communication based on the configured action.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: January 23, 2024
    Assignee: Apple Inc.
    Inventors: Yushu Zhang, Weidong Yang, Haitong Sun, Chunhai Yao, Ruoheng Liu, Jia Tang, Kaushik Josiam, Wei Zhang, Hong He, Chunxuan Ye, Wei Zeng, Dawei Zhang, Oghenekome Oteri
  • Patent number: 11881442
    Abstract: Disclosed is an SOI active interposer for three-dimensional packaging and a fabrication method thereof. An SOI substrate is used as the substrate, and a CMOS inverter is formed on the top silicon of the SOI by using standard integrated circuit manufacturing processes, so that short channel effect and latch-up effect can be suppressed. A via hole structure is etched on the SOI substrate between the PMOS and NMOS transistors of the CMOS inverter, which on the one hand can be used as a conductive channel between the chips in a vertical direction, and on the other hand, can be used as an electrical isolation layer between the PMOS and NMOS transistors.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: January 23, 2024
    Assignee: Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
    Inventors: Bao Zhu, Lin Chen, Qingqing Sun, Wei Zhang
  • Publication number: 20240022631
    Abstract: A method of recording a target transaction in a blockchain, comprising: obtaining an updated version of the target transaction, being updated relative to a pre-existing first version; and instead of the first version, sending the updated version to be propagated through a network of nodes to be recorded in the blockchain. The target transaction comprises an input comprising an unlocking script and a pointer to an output of a first transaction, the output of the first transaction comprising a locking script specifying a plurality of alternative conditions for unlocking that output. The unlocking script of the first version of the target transaction is configured to unlock the first output of the first transaction based on a first of said alternative conditions, and the unlocking script of the updated version is configured to unlock it based on a second one of said alternative conditions.
    Type: Application
    Filed: September 20, 2023
    Publication date: January 18, 2024
    Inventors: Wei ZHANG, Craig Wright, Jack Davies
  • Publication number: 20240023100
    Abstract: Supporting transmission of multiple hybrid automatic repeat request acknowledgments (HARQ-ACKS) within a single slot may include encoding a first HARQ-ACK and a second HARQ-ACK within the single slot for transmission to a base station. The first HARQ-ACK may be transmitted via a first physical uplink control channel (PUCCH) and the second HARQ-ACK may be transmitted via a second PUCCH. Based on encoding the first HARQ-ACK and the second HARQ-ACK within the single slot, one or more additional uplink (UL) signals colliding with at least one of the first HARQ-ACK and the second HARQ-ACK within the single slot may be responded to based on a configuration of the UE.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Haitong SUN, Chunhai YAO, Chunxuan YE, Dawei ZHANG, Hong HE, Jia TANG, Jie CUI, Oghenekome OTERI, Sigen YE, Wei ZENG, Wei ZHANG, Weidong YANG, Yang TANG, Yushu ZHANG
  • Publication number: 20240022926
    Abstract: This disclosure relates to methods and devices for mitigating overheating in a user equipment device (UE). The UE is configured to communicate over each of LTE and 5G NR and may be configured to communicate through 5G NR over each of a Sub-6 GHz and a millimeter Wave (mmW) frequency band. The UE is configured to establish an ENDC connection with an enB and one or more gNBs. The UE implements intelligent transmission modification and cell measurement adjustments to mitigate overheating and reduce battery drain.
    Type: Application
    Filed: July 24, 2023
    Publication date: January 18, 2024
    Inventors: Alosious Pradeep Prabhakar, Wen Zhao, Lakshmi N. Kavuri, Li Su, Sagar B. Shah, Sriram Subramanian, Vijay Venkataraman, Vishwanth Kamala Govindaraju, Shiva Krishna Nana, Sanjeevi Balasubramanian, Wei Zhang, Madhukar D. Shanbhag, Sandeep K. Sunkesala, Srinivasan Nimmala, Muthukumaran Dhanapal, Tarakkumar G. Dhanani, Sree Ram Kodali, Ioannis Pefkianakis, Dhruv Khati, Franco Travostino, Thanigaivelu Elangovan, Madhusudan Chaudhary, Geoffrey R. Hall