Abstract: A non-volatile memory having many memory cell columns is provided. Each memory cell column includes a plurality of memory cells formed on a substrate. A deep p-type well is disposed in the substrate and an n-type well is disposed on the deep p-type well. A shallow p-type well isolated by device isolation structures is disposed on the n-type well. A select unit is disposed on one side of each memory cell column. An n-type source region is disposed in the substrate adjacent to the select unit. An n-type drain region is disposed in the substrate on the other side of the memory cell column. A bit line is disposed on the substrate. The bit line connects with the n-type drain region through a conductive plug. The conductive plug penetrates the junction between the n-type drain region and the shallow p-type well and forms a short between them.

Abstract: A non-volatile memory having memory cell columns is provided. Each memory cell column includes many memory cells having a charge-trapping layer and a column select unit. There are no gaps between the memory cells and between the column select unit and the memory cells. A source region and a drain region are disposed in the substrate next to the sides of the serially connected memory cells and column select unit. The selecting lines connect to the gates of the column select unit in the same row. The word lines connect to the gates of the memory cells in the same row. The source lines connect to the source regions in the same row. The sub-bit lines connect to the drain regions in the same column. The main-bit lines connect to the sub-bit lines respectively. The sub-bit line select units are disposed between the sub-bit lines and the main bit lines.

Abstract: A non-volatile memory is provided. A substrate has at least two isolation structures therein to define an active area. A well is located in the substrate. A shallow doped region is located in the well. At least two stacked gate structures are located on the substrate. Pocket doped regions are located in the substrate at the peripheries of the stacked gate structures; each of the pocket doped regions extends under the stacked gate structure. Drain regions are located in the pocket doped regions at the peripheries of the stacked gate structures. An auxiliary gate layer is located on the substrate between the stacked gate structures. A gate dielectric layer is located between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stacked gate structure. Plugs are located on the substrate and extended to connect with the pocket doped region and the drain regions therein.

Abstract: A non-volatile memory is provided. A well is disposed in a substrate and a shallow well is disposed inside the well. At least two stack gate structures are disposed on the substrate. Drain regions are disposed in the shallow well outside the stack gate structures. An auxiliary gate layer is disposed on the substrate between the two stack gate structures. The auxiliary gate layer extends down passing through a portion of the substrate. A gate dielectric layer is disposed between the auxiliary gate layer and the substrate and between the auxiliary gate layer and the stack gate structures. A conductive plug is disposed on the substrate. The conductive plug extends downward to connect with the shallow well and the drain region therein.

Abstract: A non-volatile memory is provided. A substrate having a plurality of trenches and a plurality of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A plurality of select gate dielectric layers are disposed between the select gates and the substrate. A plurality of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A plurality of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers.

Abstract: A non-volatile memory device having a substrate, an n type well, a p type well, a control gate, a composite dielectric layer, a source region and a drain region is provided. A trench is formed in the substrate. The n type well is formed in the substrate. The p type well is formed in the substrate above the n type well. The junction of p type well and the n type well is higher than the bottom of the trench. The control gate which protruding the surface of substrate is formed on the sidewalls of the trench. The composite dielectric layer is formed between the control gate and the substrate. The composite dielectric layer includes a charge-trapping layer. The source region and the drain region are formed in the substrate of the bottom of the trench respectively next to the sides of the control gate.

Abstract: A one-time programmable read only memory is provided. The memory includes a substrate, a select transistor, an electrode and a dielectric layer. The select transistor is formed on the substrate. The electrode is formed over the source region of the select transistor. The dielectric layer is formed between the electrode and the source region of the select transistor. Digital data is stored in the memory through the breakdown or not of the dielectric layer.

Abstract: A nonvolatile memory is provided. The memory includes a select transistor and a trench transistor. The select transistor is formed on the substrate. The select transistor includes a first gate formed on the substrate and first and second source/drain regions formed in the substrate next to the first gate. The trench transistor is formed in the substrate. The trench transistor includes a second gate formed in the trench of substrate, an electron trapping layer formed between the second gate and the trench and second and third source/drain regions formed in the substrate next to the second gate. The select transistor and the trench transistor share the second source/drain region.

Abstract: A non-volatile memory including a plurality of memory units is provided. Each of the memory units includes a first memory cell and a second memory cell. The first memory cell is disposed over the substrate. The second memory cell is disposed next to the sidewall of the first memory cell and over the substrate. The first memory cell includes a first gate disposed over the substrate, a first composite dielectric layer disposed between the first gate and the substrate. The second memory cell includes a second gate disposed over the substrate and a second composite dielectric layer disposed between the second gate and the substrate and between the second gate and the first memory cell. Each of the first and second composite dielectric layers includes a bottom dielectric layer, a charge-trapping layer and a top dielectric layer.

Abstract: A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.

Abstract: A method of programming a flash memory through boosting a voltage level of a source line. The flash memory has n memory cell transistors cascaded in series, a local bit line positioned above the n memory cell transistors, a buried bit line positioned under the n memory cell transistors, and a source line positioned under the buried bit line. The method includes inputting a word line voltage to a control gate of a kth memory cell transistor, and after floating the local bit line, inputting a source line voltage to the source line for inducing an FN tunneling effect inside the kth memory cell transistor through capacitance coupling between the buried bit line and the source line.

Abstract: A method of programming a flash memory through boosting a voltage level of a source line. The flash memory has n memory cell transistors cascaded in series, a local bit line positioned above the n memory cell transistors, a buried bit line positioned under the n memory cell transistors, and a source line positioned under the buried bit line. The method includes inputting a word line voltage to a control gate of a kth memory cell transistor, and after floating the local bit line, inputting a source line voltage to the source line for inducing an FN tunneling effect inside the kth memory cell transistor through capacitance coupling between the buried bit line and the source line.

Abstract: A CMOS-compatible read only memory (ROM) includes a first single-poly PMOS transistor that is serially electrically connected to a second single-poly PMOS transistor for recording digital data “1” or digital data “0”. The first and second single-poly PMOS transistors are both formed on an N-well of a P-type substrate. The first single-poly PMOS transistor includes a select gate electrically connected to a word line, a first P+ source doping region electrically connected to a source line, and a first P+ drain doping region. The second single-poly PMOS transistor includes a floating gate, a second P+ source doping region electrically connected to the first P+ drain doping region, and a second P+ drain doping region electrically connected to a bit line. The second P+ source doping region and the second P+ drain doping region define a floating gate channel region under the floating gate. A fast FPLD-to-ROM conversion method is also disclosed.

Abstract: A fabrication method for a non-volatile memory includes providing a first metal oxide semiconductor (MOS) transistor having a control gate and a second MOS transistor having a source, a drain, and a floating gate. The first MOS transistor and the second MOS transistor are formed on a well. The method further includes biasing the first MOS with a first biasing voltage to actuate the first MOS transistor, biasing the second MOS transistor with a second biasing voltage to enable the second MOS transistor to generate a gate current, and adjusting capacitances between the floating gate of the second MOS transistor and the drain, the source, the control gate, and the well according to voltage difference between the floating gate of the second MOS transistor and the source of the second MOS transistor.

Abstract: A CMOS-compatible read only memory (ROM) includes a first single-poly PMOS transistor that is serially electrically connected to a second single-poly PMOS transistor for recording digital data “1” or digital data “0”. The first and second single-poly PMOS transistors are both formed on an N-well of a P-type substrate. The first single-poly PMOS transistor includes a select gate electrically connected to a word line, a first P+ source doping region electrically connected to a source line, and a first P+ drain doping region. The second single-poly PMOS transistor includes a floating gate, a second P+ source doping region electrically connected to the first P+ drain doping region, and a second P+ drain doping region electrically connected to a bit line. The second P+ source doping region and the second P+ drain doping region define a floating gate channel region under the floating gate. A fast FPLD-to-ROM conversion method is also disclosed.

Abstract: A fabrication method for a non-volatile memory includes providing a first metal oxide semiconductor (MOS) transistor having a control gate and a second MOS transistor having a source, a drain, and a floating gate. The first MOS transistor and the second MOS transistor are formed on a well. The method further includes biasing the first MOS with a first biasing voltage to actuate the first MOS transistor, biasing the second MOS transistor with a second biasing voltage to enable the second MOS transistor to generate a gate current, and adjusting capacitances between the floating gate of the second MOS transistor and the drain, the source, the control gate, and the well according to voltage difference between the floating gate of the second MOS transistor and the source of the second MOS transistor.

Abstract: A low voltage single-poly flash memory cell includes a first ion well of a first conductivity type, a second ion well of a second conductivity type formed on the first ion well, a charge storage layer comprising a first insulating layer, a trapping layer, and a second insulating layer, located on the second ion well, a gate located on the charge storage layer, a sourceand a drain of the second conductivity type located in two sides of the charge storage layer, and an ion doped region of the first conductivity type formed in the second ion well and under and surrounding the source and at least a portion of a bottom of the first insulating layer.

Abstract: A low voltage single-poly flash memory cell includes a first ion well of a first conductivity type, a second ion well of a second conductivity type formed on the first ion well, a charge storage layer comprising a first insulating layer, a trapping layer, and a second insulating layer, located on the second ion well, a gate located on the charge storage layer, a sourceand a drain of the second conductivity type located in two sides of the charge storage layer, and an ion doped region of the first conductivity type formed in the second ion well and under and surrounding the source and at least a portion of a bottom of the first insulating layer.