Patents by Inventor Wei-cheng Chen

Wei-cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149431
    Abstract: A manufacturing method of an electronic package includes the following steps. A first interfacial dielectric layer is formed to cover sides of multiple first conductive vias and multiple second conductive vias. Multiple chips are directly bonded to the first and second conductive vias. A base dielectric layer is formed to fill a gap between the adjacent chips. A bridge element is directly bonded to the first conductive vias, such that the bridge element partially overlaps the adjacent chips respectively. A second interfacial dielectric layer and multiple third conductive vias are formed on the first interfacial dielectric layer and the bridge element. A redistribution circuit structure is formed on the second interfacial dielectric layer and the third conductive vias. Multiple conductive bumps are formed on the redistribution circuit structure. An electronic package is also provided.
    Type: Application
    Filed: July 8, 2024
    Publication date: May 8, 2025
    Applicant: VIA Technologies, Inc.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Chen-Yueh Kung
  • Publication number: 20250121486
    Abstract: A toolbox handle structure includes a chamber and a tool slot, and includes an opening on one end. A receiving tube is movably arranged in the chamber. An inner sleeve is inserted in the receiving tube. A bead-holding recess and a hole are disposed on one side adjacent to the opening. A pressing spring is disposed in the inner sleeve to abut against the pressing set. A bead is disposed in the bead-holding recess and pushed by the pressing set to protrude from the hole and abuts the receiving tube. A pressing set is moved by an external force to make the bead fall into the bead-holding recess to be released from abutting against the receiving tube.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 17, 2025
    Inventor: Wei-Cheng CHEN
  • Publication number: 20240421124
    Abstract: A manufacturing method of an electronic package includes the following steps. Multiple chips and a base dielectric layer are provided. A back surface of each chip is fixed to a back surface temporary carrier via a back surface temporary bonding layer. A base dielectric layer surrounds each chip and covers the back surface temporary bonding layer. A material of the base dielectric layer includes a silicate composite material. At least one bridge element is installed on the adjacent chips. An intermediate dielectric layer covering the base dielectric layer, the chips, and the bridge element is formed. Multiple intermediate conductive vias and a redistribution structure are respectively formed on the chips and the intermediate dielectric layer. Multiple conductive bumps are formed on the redistribution structure. The back surface temporary bonding layer and the back surface temporary carrier are removed. An electronic package produced by the manufacturing method is also provided.
    Type: Application
    Filed: September 27, 2023
    Publication date: December 19, 2024
    Applicant: VIA Technologies, Inc.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Chen-Yueh Kung
  • Publication number: 20240421096
    Abstract: A manufacturing method of an electronic package includes the following steps. Multiple chips are temporarily fixed to a temporary carrier. At least one bridge element is installed on the adjacent chips. A base dielectric layer covering a temporary bonding layer, the chips, and the bridge element is formed. A material of the base dielectric layer includes a silicate composite material. Multiple base conductive vias and a redistribution structure are respectively formed on the chips and the base dielectric layer. Multiple conductive bumps are formed on the redistribution structure. In addition, an electronic package is also provided, which may be produced by the manufacturing method.
    Type: Application
    Filed: September 27, 2023
    Publication date: December 19, 2024
    Applicant: VIA Technologies, Inc.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Chen-Yueh Kung
  • Publication number: 20240319367
    Abstract: The present application provides a ranging device with angle reporting and the angle reporting method thereof. The ranging device comprises a ranging module and a control module. The control module is coupled to the ranging module and acquires angle information. The control module acquires a plurality of distance sensing values from the ranging module and generates a packet according to the distance sensing value and the angle information.
    Type: Application
    Filed: November 16, 2023
    Publication date: September 26, 2024
    Inventors: Wei-Cheng Chen, Chih-Han Yen
  • Publication number: 20240241439
    Abstract: A photosensitive resin composition, a cured film and a black matrix are provided. The photosensitive resin composition includes an alkali-soluble resin (A), an ethylenically unsaturated monomer (B), a photoinitiator (C), a thermal acid generator (D), a black colorant (E) and a solvent (F). The alkali-soluble resin (A) includes a resin having a fluorene ring and two or more ethylenically polymeric groups (A-1), an epoxy resin (A-2), or a combination thereof. The resin having a fluorene ring and two or more ethylenically polymeric groups (A-1) includes a structural unit represented by Formula (A1) as follows. In Formula (A1), * represents a bonding position.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Echem Materials Company Limited
    Inventors: Wei-Cheng Chen, Jui-Yu Hsu, Yu-Lun Li
  • Publication number: 20240146085
    Abstract: The present disclosure provides a battery charging system and method. The battery charging method includes: determining a degree of healthy of a battery module according to an evaluation mechanism; setting a charging standard according to the degree of healthy; by handshaking with a charger, setting a charging voltage for the charger according to the charging standard to charge the battery module; and by the charger, perform a charging operation on the battery module until a fully charged condition is satisfied.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Tsung-Nan WU, Chih-Hsiang HSU, Wei-Cheng CHEN
  • Patent number: 11904519
    Abstract: Present invention is related to an extrusion equipment for processing a fibre composite. The extrusion equipment comprises a decompression and a melt tank arranged and operated vertically along with the direction of gravity. The melt tank comprises a melt tank impregnation section and a melt tank control section with a melt tank cavity as a channel condition defined within. The channel has its inner diameter or passage gradually decreased from top to bottom. The extrusion equipment provided by the present invention is configured in the direction of gravity for processing the melted thermoplastic resin and the fibre vertically for avoiding fibre fracture or breakage and improving the quality of the final products. As the melted plastic is processed vertically along with the gravity, the melted plastic could transfer or pass through the channel quickly without resulting decomposition due to the high heat and the long retention time in the cavity.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: February 20, 2024
    Assignee: Plastics Industry Development Center
    Inventors: Chia-Yu Yu, Li-Kai Lin, Chia-Hsin Tung, Wei-Cheng Chen
  • Patent number: 11850709
    Abstract: A toolbox handle of a combination screwdriver. A handle includes a barrel and a plate seat. The barrel includes a chamber and an embedding slot. A receiving seat is movably disposed in the chamber and includes an outer sleeve and a resisting base. An outer spring elastically abuts the resisting base. A retractable assembly is inserted in the outer sleeve and includes an inner spring, a positioning rod, and an inner sleeve. A ball is disposed on the positioning recess of the positioning rod to abut the receiving seat. A pressing plate is combined to abut the positioning rod. Therefore, the receiving seat is stably positioned in the handle and is ejectable for use after being pressed.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: December 26, 2023
    Assignee: YIH CHENG FACTORY CO., LTD.
    Inventor: Wei-Cheng Chen
  • Publication number: 20230211475
    Abstract: A toolbox handle of a combination screwdriver. A handle includes a barrel and a plate seat. The barrel includes a chamber and an embedding slot. A receiving seat is movably disposed in the chamber and includes an outer sleeve and a resisting base. An outer spring elastically abuts the resisting base. A retractable assembly is inserted in the outer sleeve and includes an inner spring, a positioning rod, and an inner sleeve. A ball is disposed on the positioning recess of the positioning rod to abut the receiving seat. A pressing plate is combined to abut the positioning rod. Therefore, the receiving seat is stably positioned in the handle and is ejectable for use after being pressed.
    Type: Application
    Filed: January 4, 2022
    Publication date: July 6, 2023
    Inventor: Wei-Cheng CHEN
  • Publication number: 20230191681
    Abstract: Present invention is related to an extrusion equipment for processing a fibre composite. The extrusion equipment comprises a decompression and a melt tank arranged and operated vertically along with the direction of gravity. The melt tank comprises a melt tank impregnation section and a melt tank control section with a melt tank cavity as a channel condition defined within. The channel has its inner diameter or passage gradually decreased from top to bottom. The extrusion equipment provided by the present invention is configured in the direction of gravity for processing the melted thermoplastic resin and the fibre vertically for avoiding fibre fracture or breakage and improving the quality of the final products. As the melted plastic is processed vertically along with the gravity, the melted plastic could transfer or pass through the channel quickly without resulting decomposition due to the high heat and the long retention time in the cavity.
    Type: Application
    Filed: April 7, 2022
    Publication date: June 22, 2023
    Inventors: Chia-Yu Yu, Li-Kai Lin, Chia-Hsin Tung, Wei-Cheng Chen
  • Publication number: 20230011763
    Abstract: The present application provides a gesture determining method and an electronic device. The gesture determining method includes: sensing a control gesture through at least one motion sensor, and correspondingly generating sensing data; sequentially segmenting the sensing data into a plurality of streaming windows according to a unit of time, each streaming window including a group of sensing values; determining whether a sensing value in a streaming window is greater than a critical value, and triggering subsequent gesture recognition when the sensing value is greater than the critical value; and performing a recognition operation on the streaming window by using a gesture recognition model to consecutively output a recognition result; and determining whether the recognition result meets an output condition, and outputting a predicted gesture corresponding to the recognition result when the recognition result meets the output condition.
    Type: Application
    Filed: June 20, 2022
    Publication date: January 12, 2023
    Inventors: Shih-Chieh Liao, Chin-Hao Chang, Shih-Chuan Chiu, Yi-Nan Lee, Chia-Hao Kang, Wei-Cheng Chen, Tzu-Hung Chuang
  • Patent number: 11455267
    Abstract: A calibration device includes a main control unit, an interface conversion unit and an electronic load generation unit. The electronic load generation unit provides an electronic load, so that a USB control chip generates a constant load current. The USB control chip uses at least one preset conversion parameter to generate an analog-to-digital conversion value according to the constant load current. The main control unit generates a to-be-calibrated output current according to the analog-to-digital conversion value. The main control unit generates at least one calibrated conversion parameter according to the constant load current and the to-be-calibrated output current. The USB control chip uses the at least one calibrated conversion parameter to generate a calibrated analog-to-digital conversion value, so that an over current protection mechanism is accurately enabled.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: September 27, 2022
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Shun-Fu Yang, Wei-Cheng Chen, Jen-Cheng Li, Wen-Hsien Chan, Po-Yao Fang
  • Patent number: 11449121
    Abstract: The product detection system includes a computing device, at least one power detection instrument and a product detection device. The product detection device includes a processing unit, plural USB-C transmission ports and plural detection connection ports. A product detection method includes following steps. Firstly, at least one USB-C under-test product is connected with the plural USB-C transmission ports, and the at least one power detection instrument is connected with the plural detection connection ports. Then, the USB-C transmission port is set as a first role or a second role. Then, the USB-C transmission port corresponding to the first role is cyclically operated at plural designated voltages under control of the processing unit, and the processing unit issues an output voltage to the USB-C transmission port corresponding to the second role. Then, an operation status of the USB-C under-test product is detected.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: September 20, 2022
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Shun-Fu Yang, Yi-Kang Chiu, Wei-Cheng Chen
  • Patent number: 11445092
    Abstract: A camera module includes a circuit board, an image sensor, a filter removable switch, a camera lens, and a thermally conductive structure. The circuit board has a surface. The image sensor is disposed on the surface. The filter removable switch is located over the surface. The camera lens is on the light-sensing path of the image sensor. The thermally conductive structure is contacted between the circuit board and the filter removable switch and has a channel. The image sensor is located in the channel.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: September 13, 2022
    Assignee: Chicony Electronics Co., Ltd.
    Inventors: Wei-Cheng Chen, Tsung-You Wang
  • Patent number: 11347914
    Abstract: The present disclosure relates to a method for use with an electronic design. Embodiments may include performing, using a processor, an electronic design process on a portion of an electronic design. Embodiments may also include automatically monitoring the electronic design process on a periodic basis using a pulse monitor to acquire one or more sampling results and storing the one or more sampling results. Embodiments may further include providing, during the electronic design process, the one or more sampling results to a graphical user interface.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: May 31, 2022
    Assignee: Cadence Design Systems, Inc.
    Inventors: Wei-Cheng Chen, Yuan-Kai Pei, Yu-Chi Su
  • Publication number: 20220164017
    Abstract: The product detection system includes a computing device, at least one power detection instrument and a product detection device. The product detection device includes a processing unit, plural USB-C transmission ports and plural detection connection ports. A product detection method includes following steps. Firstly, at least one USB-C under-test product is connected with the plural USB-C transmission ports, and the at least one power detection instrument is connected with the plural detection connection ports. Then, the USB-C transmission port is set as a first role or a second role. Then, the USB-C transmission port corresponding to the first role is cyclically operated at plural designated voltages under control of the processing unit, and the processing unit issues an output voltage to the USB-C transmission port corresponding to the second role. Then, an operation status of the USB-C under-test product is detected.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 26, 2022
    Inventors: Shun-Fu Yang, Yi-Kang Chiu, Wei-Cheng Chen
  • Patent number: 11226528
    Abstract: An array substrate carrying a display area and a camera area surrounded by the display area provides connections to both areas free of electrical interference. The camera area includes a transparent area and a routing area surrounding the transparent area. The array substrate includes a first conductive layer and a second conductive layer. The first conductive layer includes first wires and first capacitance compensation patterns. The second conductive layer includes second wires. Each first capacitance compensation pattern is between adjacent first wires. Along a thickness direction of the array substrate, a projection of each first capacitance compensation pattern on the substrate overlaps with a projection of at least one second wire. A display panel and a display device are also disclosed.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: January 18, 2022
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Shiang-Ruei Ouyang, Wei-Cheng Chen
  • Patent number: 11227848
    Abstract: A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: January 18, 2022
    Assignee: VIA Alliance Semiconductor Co., Ltd.
    Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Hsueh-Chung Shelton Lu
  • Publication number: 20220007936
    Abstract: The present invention provides a neurological disorders decision support system that can assist an examiner to diagnose an examinee. The neurological disorders decision support system includes a user module, a screening module, an intelligent calculation module and a diagnosis module. The user module sends an inquiry to the examinee, receives a response message from the examinee, and retrieves a physiological characteristic signal of the examinee. The screening module executes a neurological examination application program to indicate to the examinee to obtain physiological characteristic signals. The screening module outputs response messages and physiological characteristic signals for the intelligent calculation module to execute an algorithm to generate an analysis report. The analysis report assists the examiner for diagnosis, and sends a diagnosis notification to the user module through the diagnosis module. The invention also provides a neurological disorders decision support method.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 13, 2022
    Inventors: Chun-Chen YANG, Ching-Fu WANG, Chin-Hsun HUANG, Wei-Cheng CHEN