Patents by Inventor Weiping Li

Weiping Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12113388
    Abstract: The present application provides a charging control method and apparatus, a battery management system and a readable storage medium. The charging control method includes: obtaining a battery temperature and a battery state of charge; determining a pulse charging frequency according to the battery temperature, the battery state of charge and a pre-calibrated corresponding relationship; obtaining a preset waveform characteristic of a pulse charging waveform; where the waveform characteristic includes a ratio range of an area of a positive pulse waveform to an area of a negative pulse waveform in each pulse cycle of the pulse charging waveform; and generating a charging request according to the pulse charging frequency and the waveform characteristic and transmitting the charging request to a charging device. The method is used for improving charging stability and safety of a battery.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: October 8, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED
    Inventors: Zhanliang Li, Yu Yan, Zhimin Dan, Shuyun Xiong, Weiping Sun, Xiyang Zuo
  • Patent number: 12095301
    Abstract: A charging method, a battery management system for a traction battery and a charging pile are provided, which can effectively ensure normal charging of an electric vehicle. The charging method is used for charging a traction battery, and the method includes: determining, by the battery management system (BMS) of the traction battery, a pulse charging demand parameter according to a battery state parameter of the traction battery; and sending a pulse charging information to a charging pile by the BMS, the pulse charging information including the pulse charging demand parameter for indicating the charging pile to output a pulse current for charging the traction battery.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: September 17, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Shuyun Xiong, Yu Yan, Zhimin Dan, Zhanliang Li, Weiping Sun
  • Patent number: 12087734
    Abstract: The present application provides a method for forming a chip package and a chip package. The method comprises mounting at least one chipset including at least first and second chips on a carrier with front surface of the chips face away from the carrier; attaching an interconnection device to the front surfaces of the first and second chips to enable electrically connections between the chips; forming a molded encapsulation layer whereby the first chip, the second chip and the interconnection device are embedded or partially embedded in the molded encapsulation layer; thinning one side of the molded encapsulation layer away from the carrier to expose first bumps on the first and second chips; forming second bumps on a surface of one side of the molded encapsulation layer where the first bumps are exposed; and removing the carrier. Thus, a flexible, efficient and low-cost packaging scheme is provided for multi-chip connection.
    Type: Grant
    Filed: December 4, 2021
    Date of Patent: September 10, 2024
    Assignee: Yibu Semiconductor Co., Ltd.
    Inventor: Weiping Li
  • Patent number: 12087737
    Abstract: A method of forming a package comprises forming a stack of chip layers. Each chip layer has a front side facing away from the carrier substrate. A first chip layer includes a plurality of first chips having first chip contacts on the front side of the first chip layer and chip couplers having through vias. A second chip layer includes a plurality of second chip having second chip contacts on the front side of the second chip layer and coupled to respective ones of at least a first subset of the through vias. The method further comprises forming a redistribution layer on the front side of the first chip layer and dividing the stack of chip layers and the redistribution layer to form a plurality of chip packages. A chip package thus formed include a stack of chips and one or more chip connectors on a singulated redistribution layer.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: September 10, 2024
    Assignee: Yibu Semiconductor Co., Ltd.
    Inventor: Weiping Li
  • Publication number: 20240289952
    Abstract: The present disclosure is a three-way U-Net method for accurately segmenting an uncertain boundary of a retinal blood vessel, includes: describing an uncertainty of a blood vessel boundary label, constructing an upper bound and a lower bound of the uncertain boundary based on the dilation operator and the erosion operator respectively to obtain a maximum value and a minimum value for the blood vessel boundary, and mapping the boundary with uncertain information into one range; combining an uncertainty representation of the boundary with a loss function, and designing a three-way loss function; training network parameters by adopting a stochastic gradient descent algorithm and utilizing a total loss of the three-way loss function; and designing and implements an auxiliary diagnosis application system for intelligently segmenting the retinal blood vessel with functions of the fundus data acquisition, the intelligent accurate segmentation and the auxiliary diagnosis for the retinal blood vessel.
    Type: Application
    Filed: May 24, 2023
    Publication date: August 29, 2024
    Applicant: NANTONG UNIVERSITY
    Inventors: Weiping DING, Ying SUN, Tao HOU, Xinjie SHEN, Hengrong JU, Jiashuang HUANG, Haipeng WANG, Tingzhen QIN, Yu GENG, Ming LI, Haowen XUE, Zhongyi WANG
  • Publication number: 20240277867
    Abstract: Provided is a system for drug delivery comprising a modified poly (amidoamine) (“PAMAM”) comprising a photo-cleavable compound bound to one or more active agents to form a nanocomplex. Also provided is a method of treating a subject comprising administering the PAMAM nanocomplex and irradiating the nanocomplex at the target site with a light source. In particular, the modified PAMAM is a DEACM-modified PAMAM or a BODIPY-modified PAMAM. Also provided is a method for screening for PAMAM-coumarin-active agent nanocomplexes.
    Type: Application
    Filed: June 9, 2022
    Publication date: August 22, 2024
    Inventors: Weiping WANG, Yang ZHOU, Yafei LI
  • Patent number: 12060893
    Abstract: A portable blowing device includes a body and fans arranged in the body. Air channels are arranged in the body and extend in the length direction of the body to allow airflow to pass through. Wind shields are arranged in the air channels, and a periphery of the wind shield is closely connected with a side wall of the air channel so that a sub-air channel is formed between the wind shield and the side wall of the air channel. Air outlets are formed in the side wall for communicating with outside and the sub-air channel, and airflow generated by the fan can enter the sub-air channel and then exits the air outlets. Because of the reduced volume of the sub-air channel, the airflow is concentrated after entering the sub-air channel, and airflow exiting the air outlets is strengthened, so that the cooling effect and the user experience are improved.
    Type: Grant
    Filed: May 8, 2021
    Date of Patent: August 13, 2024
    Assignee: SHENZHEN LANHE TECHNOLOGIES CO., LTD.
    Inventors: Kai Liu, Xunhuan Wu, Guang Yang, Weiping Li, Jun Zhu, Quan Lv, You Lai, Tong Li
  • Publication number: 20240261416
    Abstract: Provided herein are achiral cereblon (CRBN) ligands based on phenyl dihydrouracil that have optimal binding to CRBN without having chiral carbons. Also provided herein are the proteolysis targeting chimeras (PROTACs) comprising the CRBN ligands and a protein binder, pharmaceutical compositions containing the PROTACs, and methods of treating diseases using the PROTACs.
    Type: Application
    Filed: January 30, 2024
    Publication date: August 8, 2024
    Applicant: Wisconsin Alumni Research Foundation
    Inventors: Weiping Tang, Haibo Xie, Yunxiang Wu, Junzhuo Liao, Chunrong Li, Ira Tandon, Hua Tang
  • Patent number: 12046525
    Abstract: A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are described herein. The semiconductor packaging method comprises providing at least one semiconductor device and a carrier board. A plurality of first alignment solder parts are formed on an active surface of each semiconductor device in addition to connection terminals. A plurality of second alignment solder parts are formed on a surface of the carrier board.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: July 23, 2024
    Assignee: Yibu Semiconductor Co., Ltd.
    Inventor: Weiping Li
  • Publication number: 20240151622
    Abstract: A new acoustic technique, tensile acoustic rheometry (TAR) for performing rheology measurement of a soft viscoelastic material sample is provided. In TAR, an excitation acoustic pulse is applied using a focused ultrasound transducer to a sample material to induce oscillatory motion of the sample. To track this induced motion, high repetition frequency ultrasound pulse-echo technique is used using a co-linear, con-focal ultrasound transducer that detects the backscattered echo signal from a surface or an interface of the sample. The detection ultrasound transducer system converts the echo signals to an electrical signal, and a processor determines a displacement of the interface of the sample as a function of time. The processor also determines the spectrogram, or the frequency spectrum of the dynamic surface movement of the sample material as a function of the time. Viscoelastic properties of the material are then determined from the displacement and the spectrogram measurements.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Inventors: Cheri X. Deng, Jan P. Stegemann, Weiping Li, Eric C. Hobson
  • Publication number: 20240153918
    Abstract: A method of forming a package is provided. The method comprises assembling on a carrier a stack of chip layers including a plurality of first chip layers and a second chip layer; encapsulating the stack of chip layers in a molding compound; removing the carrier to form a package main body; forming a redistribution layer on an exposed side of a first chip layer; and dividing the package main body to form a plurality of packages. Each first chip layer includes first chips and chip couplers. A chip package includes at least one chip stack and at least one chip coupler stack on a singulated redistribution layer. Each chip stack includes at least one chip from each chip layer, and each chip coupler stack includes at least one chip coupler and/or at least one chip coupler segment from each of the first chip layers.
    Type: Application
    Filed: January 15, 2024
    Publication date: May 9, 2024
    Inventor: Weiping Li
  • Patent number: 11973061
    Abstract: A method of forming a package is provided. The method comprises assembling on a carrier a stack of chip layers including a plurality of first chip layers and a second chip layer; encapsulating the stack of chip layers in a molding compound; removing the carrier to form a package main body; forming a redistribution layer on an exposed side of a first chip layer; and dividing the package main body to form a plurality of packages. Each first chip layer includes first chips and chip couplers. A chip package includes at least one chip stack and at least one chip coupler stack on a singulated redistribution layer. Each chip stack includes at least one chip from each chip layer, and each chip coupler stack includes at least one chip coupler and/or at least one chip coupler segment from each of the first chip layers.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 30, 2024
    Assignee: Yibu Semiconductor Co., Ltd.
    Inventor: Weiping Li
  • Patent number: 11955396
    Abstract: A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are disclosed herein. The semiconductor packaging method comprises providing at least one semiconductor device and a carrier board. A plurality of first alignment solder parts are formed on a passive surface of the semiconductor device, and a plurality of corresponding second alignment solder parts are formed on the carrier board. The method further comprises forming a plurality of alignment solder joints by aligning and soldering the first alignment solder parts to respective ones of the second alignment solder parts whereby the semiconductor device is aligned and fixed to the carrier board; encapsulating the at least one semiconductor device to form a molded package body; sequentially forming a redistribution layer and external terminals on the molded package body so that the connection terminals are connected to the external terminal through the interconnection layer.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: April 9, 2024
    Assignee: Yibu Semiconductor Co., Ltd.
    Inventor: Weiping Li
  • Patent number: 11873825
    Abstract: A portable blowing device configured for being worn around a neck of a human body, includes two arms each defining an airflow channel therein; and fans received in the arms respectively. The arm includes an inner side wall close to the neck and an outer side wall connected to the inner side wall. The arm includes an air inlet and an air outlet in communication with the airflow channel respectively. The air inlet is arranged at the inner side wall and/or the outer side wall. The fan is configured to generate an airflow passing through the air inlet, the airflow channel and the air outlet in sequence.
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: January 16, 2024
    Assignee: SHENZHEN LANHE TECHNOLOGIES CO., LTD.
    Inventors: Kai Liu, Xunhuan Wu, Guang Yang, Weiping Li, Quan Lv, You Lai, Jun Zhu, Tong Li
  • Patent number: 11819610
    Abstract: The present invention provides an improved visual laryngeal mask comprising a tube, an end of the tube is provided with a fixing seat. The fixing seat is provided with an airbag, and the fixing seat has a recess which is provided with an airway opening. An imaging cavity extends longitudinally inside an inner wall of the tube. The imaging cavity has a built-in imaging device, and the imaging cavity protrudes forward relative to the airway opening to form a stopper which prevents an epiglottis from blocking the imaging device. A front end of the stopper is concaved to form a recess, and an opening of the imaging cavity is located at a low point of the recess.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: November 21, 2023
    Assignee: Zhejiang UE Medical Corp.
    Inventors: Hongbo Li, Mingzhang Zuo, Ziqing Hei, Shanglong Yao, Xuerui Xiong, Weiping Li, Weidong Wang, Taohong Wang, Mengya Huang, Jinmin Cai
  • Publication number: 20230280050
    Abstract: A wearable air conditioner includes a shell for being worn around a wearing portion of a user, a fan and a temperature regulating member disposed in the shell. The shell includes a first air passage, a first accommodating chamber, at least one air outlet in communication with the first air passage, and vent holes in communication with the first accommodating chamber. The temperature regulating member is configured for generating heat energy or cold energy. The temperature regulating member is in thermal connection with a sidewall of the first accommodating chamber. An airflow generated by the fan is capable of entering the first air passage and then exiting the shell via the at least air outlet.
    Type: Application
    Filed: May 10, 2023
    Publication date: September 7, 2023
    Applicant: Shenzhen Lanhe Technologies Co., Ltd.
    Inventors: Kai LIU, You LAI, Guang YANG, Weiping LI, Guowei SONG, Xunhuan WU, Xiaofeng YUE, Xiankun FANG, Yongsheng YANG, Tong LI
  • Publication number: 20230193910
    Abstract: A portable blowing device configured for being worn around a neck of a human body, includes two arms each defining an airflow channel therein; and fans received in the arms respectively. The arm includes an inner side wall close to the neck and an outer side wall connected to the inner side wall. The arm includes an air inlet and an air outlet in communication with the airflow channel respectively. The air inlet is arranged at the inner side wall and/or the outer side wall. The fan is configured to generate an airflow passing through the air inlet, the airflow channel and the air outlet in sequence.
    Type: Application
    Filed: February 15, 2023
    Publication date: June 22, 2023
    Applicant: Shenzhen Lanhe Technologies Co., Ltd.
    Inventors: Kai LIU, Xunhuan WU, Guang YANG, Weiping LI, Quan LV, You LAI, Jun ZHU, Tong LI
  • Publication number: 20230193909
    Abstract: The present disclosure provides a portable blowing device configured for being worn around a neck of a human body, the portable blowing device includes two parts and two first fans. Each first part defines an airflow channel therein and includes an inner side wall, an outer side wall, and a top side wall connected between the inner side wall and the outer side wall. Each fan is received in one corresponding part and configured for generating an airflow to flow through the airflow channel defined therein. At least a portion of each of the two top side walls includes an inclined surface. Each of the parts defines at least one first air inlet and at least one first air outlet communicated with the at least one first air inlet and the airflow channel, and each of the first air outlets is defined in one corresponding inclined surface.
    Type: Application
    Filed: February 20, 2023
    Publication date: June 22, 2023
    Inventors: Kai Liu, Xunhuan Wu, Weiping Li, Guang Yang, Quan Lv, You Lai, Jun Zhu, Tong Li
  • Patent number: D986540
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: May 23, 2023
    Inventor: Weiping Li
  • Patent number: D1041743
    Type: Grant
    Filed: May 29, 2024
    Date of Patent: September 10, 2024
    Assignee: Shenzhen Jingliang Longqing Network Tech. Co., Ltd
    Inventors: Lizhou Shen, Yao Fu, Liwu Duan, Zhiliang Zhang, Weiping Li, Yuzhou Xu