Patents by Inventor Wen-An HSIEH

Wen-An HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOISE FILTERING METHOD FOR MOTOR, RECORDING MEDIUM THEREOF AND MOTOR CONTROL CIRCUIT
    Publication number: 20200204092
    Abstract: The invention provides a noise filtering method for a motor. The motor rotates according to an operating voltage. The noise filtering method includes: setting an inspection period and a minimum threshold. The noise filtering method further includes: generating a pulse signal according to the operating voltage, determining whether a time corresponding to each sub-pulse signal in the pulse signal meets the inspection period, and determining whether a pulse width corresponding to each sub-pulse signal is equal to or greater than the minimum threshold. A recording medium storing a program code corresponding to the method, and a motor control circuit for executing the program code are also provided.
    Type: Application
    Filed: November 21, 2019
    Publication date: June 25, 2020
    Applicants: Lite-On Singapore Pte Ltd, Lite-On Technology Corporation
    Inventors: Kok Liang Goh, Jian Song, Lukman Arif Kurniawan, Biswas Partha, Ying Lin, Lee Kia Ching, Cheng-Wen Hsieh
  • HEAT DISSIPATION FAN
    Publication number: 20200191157
    Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 18, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Hung-Chi Chen, Yu-Shih Wang, Ming-Fei Tsai
  • Gate structure and method of fabricating the same
    Patent number: 10686049
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: June 16, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Bo-Wen Hsieh, Yi-Chun Lo, Wen-Jia Hsieh
  • HEAT DISSIPATION MODULE
    Publication number: 20200183469
    Abstract: A heat dissipation module including a chamber, a first cooling fin, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling fin is disposed in the accommodating space. The first cooling fin has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling fin and has at least one through hole.
    Type: Application
    Filed: March 18, 2019
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Wei-Chin Chen, Jau-Han Ke
  • BLADE AND FAN
    Publication number: 20200182253
    Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped main body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
  • THERMAL DISSIPATION MODULE
    Publication number: 20200182554
    Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
    Type: Application
    Filed: February 15, 2020
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • BLADE AND FAN STRUCTURE
    Publication number: 20200182258
    Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 11, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Shun-Ta Yu
  • Heat dissipation module
    Patent number: 10642322
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: May 5, 2020
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Thermal dissipation module
    Patent number: 10634435
    Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 28, 2020
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Laptop computer
    Patent number: 10635142
    Abstract: A laptop computer includes a host, a hinge mechanism, and a display. The host includes a housing and a base disposed in the housing and having a curved groove. The hinge mechanism is connected to the host and includes a rotation element. The rotation element includes a curved portion located in the curved groove. The display is affixed to the rotation element.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: April 28, 2020
    Assignee: ACER INCORPORATED
    Inventors: Yan-Fong Cheng, Cheng-Nan Ling, Kai-Teng Cheng, Cheng-Wen Hsieh, Fang-Ying Huang, Szu-Wei Yang, Yi-Ta Huang, Pao-Min Huang, Hsueh-Chih Peng
  • Lattice Boiler Evaporator
    Publication number: 20200124351
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 23, 2020
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • HEAT DISSIPATION MODULE
    Publication number: 20200110450
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 9, 2020
    Applicant: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Accessory for a portable electronic device and combination of the accessory and the portable electronic device
    Patent number: 10606328
    Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: March 31, 2020
    Assignee: Acer Incorporated
    Inventors: Sheng-Yan Chen, Hsueh-Chih Peng, Wen-Neng Liao, Cheng-Wen Hsieh
  • HEAT DISSIPATION MODULE
    Publication number: 20200091038
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1mm to be qualified to achieve a safety certification.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Using voltage ride through frequency histogram for low current measurement
    Patent number: 10578655
    Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 3, 2020
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Chi-Wen Hsieh, Yi-Chun Lin, Tseng-Te Huang, Ming-Chen Yuan, Chien-Hau Chu, Yu-Chin Chi
  • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    Publication number: 20200058762
    Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.
    Type: Application
    Filed: July 10, 2019
    Publication date: February 20, 2020
    Inventors: Chi-Wen HSIEH, Chien-Ping HUNG, Chi-Kang CHANG, Shih-Chi FU, Kuei-Shun CHEN
  • Lattice boiler evaporator
    Patent number: 10563926
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: February 18, 2020
    Assignee: ACER INCORPORATED
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • AXIAL FLOW FAN
    Publication number: 20200049159
    Abstract: An axial flow fan includes a hub and a plurality of fan blade sets. The hub is configured to rotate around an axis. The fan blade sets are disposed at the peripheral of the hub, wherein each of the fan blade sets includes a first fan blade and a second fan blade arranged side by side along the axis and a flow channel is defined by each of the first fan blades and the corresponding second fan blade. Each of the flow channels has an inlet and an outlet opposite to each other, wherein at least one of each of the first fan blades and the corresponding second fan blade has a flow guiding hole and each of the flow guiding holes is located between the inlet and the outlet. Each of the flow guiding holes is communicated with the flow channel.
    Type: Application
    Filed: November 26, 2018
    Publication date: February 13, 2020
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • HEAT DISSIPATION FAN
    Publication number: 20200040738
    Abstract: A heat dissipation fan including a hub and a plurality of fan assemblies are provided. The fan assemblies are disposed around the hub, and each of the fan assemblies includes at least two blades. A runner is formed between the at least two blades. A width of the runner gradually reduces along a rotating axis of the hub.
    Type: Application
    Filed: August 1, 2019
    Publication date: February 6, 2020
    Applicant: Acer Incorporated
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200035799
    Abstract: A semiconductor device includes a semiconductor substrate and a gate structure. The semiconductor substrate includes a first semiconductor fin and a second semiconductor fin. The gate structure includes a work function metal structure crossing over the first semiconductor fin and the second semiconductor fin. The work function metal structure comprises a first portion over a portion of the first semiconductor fin, a second portion over a portion of the second semiconductor fin, and a third portion connecting the first portion to the second portion, wherein a thickness of the third portion is smaller than a thickness of the second portion and greater than a thickness of the first portion along an extension direction of the second semiconductor fin.
    Type: Application
    Filed: July 26, 2018
    Publication date: January 30, 2020
    Inventors: Bo-Wen HSIEH, Wen-Hsin CHAN