Abstract: A semiconductor device includes a semiconductor substrate and a gate structure. The semiconductor substrate includes a first semiconductor fin and a second semiconductor fin. The gate structure includes a work function metal structure crossing over the first semiconductor fin and the second semiconductor fin. The work function metal structure comprises a first portion over a portion of the first semiconductor fin, a second portion over a portion of the second semiconductor fin, and a third portion connecting the first portion to the second portion, wherein a thickness of the third portion is smaller than a thickness of the second portion and greater than a thickness of the first portion along an extension direction of the second semiconductor fin.

Abstract: A method of performing a communication operation via a cell for a communication device comprises receiving information of a number of available DCIs for a first period from a network; receiving a first DCI in a first subframe in a first period from the network and determining that the first subframe of a cell is in an on state; receiving a second DCI in a second subframe in the first period after the first subframe from the network and determining that the second subframe of the cell is in the on state, if the number of available DCIs is not achieved; and stopping receiving any DCI in the first period and determining that at least one first subframe of the cell in a rest of the first period is in an off state, if the number of available DCIs is achieved.

Abstract: A method for matrix by vector multiplication, applied in an artificial neural network system, is disclosed. The method comprises: compressing a plurality of weight values in a weight matrix and indices of an input vector into a compressed main stream; storing M sets of synapse values in M memory devices; and, performing reading and MAC operations according to the M sets of synapse values and the compressed main stream to obtain a number M of output vectors. The step of compressing comprises: dividing the weight matrix into a plurality of N×L blocks; converting entries of a target block and corresponding indices of the input vector into a working block and an index matrix; removing zero entries in the working block; shifting non-zero entries row-by-row to one of their left and right sides in the working block; and, respectively shifting corresponding entries in the index matrix.

Abstract: A hinge mechanism is provided, including a fixed member, a rotary member pivotally connected to the fixed member, a pin, a first gear set, and a second gear set. The first and second gear sets are connected to the fixed member and the rod and respectively have a teeth-uncompleted gear. When the rotary member rotates relative to the fixed member from an initial angle to a first angle, the first gear set drives the pin to rotate in a first direction. When the rotary member further rotates relative to the fixed member from the first angle to a second angle, the second gear set drives the ping to rotate in a second direction, which is the opposite of the first direction.

Abstract: A portable electronic device having a heat source is provided with a suitable heat dissipation module. The heat dissipation module includes an evaporator, at least one pipe, a working fluid, and at least one check valve. The evaporator thermally contacts the heat source to transmit the heat generated by the heat source to the evaporator. The pipe is connected to the evaporator to form at least one loop, and the working fluid is filled in the loop. The working fluid absorbs and dissipates the heat in the loop to generate a phase change. The check valve is disposed at the loop and provides at least one recirculation channel in the same direction as the first direction and opposite to a second direction to block the working fluid from flowing in the second direction. The first and the second directions are opposite to each other.

Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.

Abstract: A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.

Abstract: An electronic device including a touch input unit, a display unit, and a control unit is provided. The touch input unit includes a first default input function. The display unit is configured to display a default interface or a first interface. The first interface is corresponding to the first default input function. The control unit is electrically connected to the touch input unit and the display unit for controlling the display unit to be switched from the default interface to the first interface.

Abstract: A method of handling an on-off state of a cell for a communication device comprises receiving a first downlink (DL) control information (DCI) in a first subframe from a network, wherein the first DCI indicates at least one first on-off state of at least one first subframe of a first cell of the network; and determining an on-off state of a second subframe of the first cell according to the first DCI, wherein the at least one first subframe comprises the second subframe.

Abstract: A fan and a balance ring for the fan are provided. The fan includes a housing, a hub disposed in the housing, blades connected to the side surface of the hub, and a balance ring connected to the hub. The balance ring includes a ring chamber and a balance liquid filled in the ring chamber. The volume of the balance liquid is less than the volume of the ring chamber.

Abstract: A laptop computer includes a host, a hinge mechanism, and a display. The host includes a housing and a base disposed in the housing and having a curved groove. The hinge mechanism is connected to the host and includes a rotation element. The rotation element includes a curved portion located in the curved groove. The display is affixed to the rotation element.

Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.

Abstract: An accessory is selectively coupled in a first position or a second position to a portable electronic device. The accessory includes a touch unit and a heat dissipation unit. The touch unit is configured to be touched by a user to apply a contact force. An area of the touch unit to be touched by the user is defined as a contact point. When the accessory is in the first position, the touch unit detects a location of the contact point and outputs a control signal to the portable electronic device. The heat dissipation unit comes in contact with a heat source of the portable electronic device when the accessory is in the second position.

Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.

Abstract: A fan structure including a fan housing and a fan body is provided. The fan housing includes a base and a cover assembled on the base. The cover includes a main portion, a periphery portion, a plurality of connecting portions and a plurality of flow guiding portions. The connecting portions are connected to the main portion and the periphery portion. The cover has a plurality of air inlet openings among the main portion, the periphery portion and connecting portions, wherein each of the flow guiding portions protrudes from the main portion and is adjacent to an inner side of the corresponding air inlet opening. The fan body is rotatably disposed in the fan housing. An electronic assembly is also provided.

Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Abstract: A method of handling a communication operation for a network of a wireless communication system comprises determining a reconfiguration set comprising at least one UL/DL configuration; scheduling a UL/DL configuration in the reconfiguration set for a frame; determining a reference UL/DL configuration according to the reconfiguration set; transmitting information related to the reconfiguration set to a communication device of the wireless communication system; and performing a communication operation in the frame with the communication device according to the reference UL/DL configuration, irrespective of the UL/DL configuration scheduled for the frame, wherein the communication operation is a transmission, or the communication operation is a reception.

Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.

Abstract: A three-dimensional (3D) printing system including a control module, at least one moving module, a particle-type 3D printing nozzle and a coil-type 3D printing nozzle is provided. The moving module, the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are respectively and electrically connected to the control module, and the particle-type 3D printing nozzle and the coil-type 3D printing nozzle are disposed on the at least one moving module. The control module moves the particle-type 3D printing nozzle or the coil-type 3D printing nozzle through the at least one moving module, and drives the particle-type 3D printing nozzle or the coil-type 3D printing nozzle to perform a 3D printing operation to print a 3D object.

Abstract: A three-dimensional printing nozzle, a three-dimensional printing nozzle assembly, and a three-dimensional printing apparatus are provided. The three-dimensional printing nozzle includes a nozzle body having an inlet and an outlet, a driving unit disposed in the nozzle body, a first heating unit, and a first heat dissipation unit. A particle forming material is adapted to enter the nozzle body from the inlet. The driving unit is configured for pushing the particle forming material to move from the inlet to the outlet. The first heating unit is disposed in the nozzle body for heating and melting the particle forming material and extrudes a melted forming material out of the nozzle body from the outlet through the driving unit. The first heat dissipation unit is disposed in the nozzle body and located between the first heating unit and the inlet to reduce heat transmitted from the first heating unit to the inlet.