Patents by Inventor Wen-An HSIEH

Wen-An HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190183960
    Abstract: The present invention provides a method to treat asthma and airway allergy by administering the dipeptide cyclo tyrosine-valine or a related cyclodipeptide compound to a subject in need thereof. Cyclo tyrosine-valine or the related cyclodipeptide compound reduces Th2 cell activation, airway hyperresponsiveness, accumulation of immune cells in bronchoalveolar fluid, and allergen-specific antibody production in an animal or human subject. The compound can therefore be used to treat asthma and airway allergy.
    Type: Application
    Filed: February 27, 2018
    Publication date: June 20, 2019
    Inventors: Yun-Fei Ko, Jan Martel, Jian-Ching Liau, Chen-Yaw Chiu, Chuan-Sheng Lin, Luis Dominick B. Antig, Pei-Wen Hsieh, Yu-Li Chen, Chih-Jung Chang, Tsung-Ru Wu, David Marcelo Ojcius, Chia-Chen Lu, Hsin-Chih Lai, John D. Young
  • Patent number: 10312338
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: June 4, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Bo-Wen Hsieh, Yi-Chun Lo, Wen-Jia Hsieh
  • Publication number: 20190163246
    Abstract: A heat dissipation system of an electronic device including a body, at least one heat source, and a heat dissipation module is provided. The body has a stack tunnel, and the heat source is disposed in the body. The heat dissipation module includes an evaporator and a pipe connecting to the evaporator to form a loop, and a working fluid is filled in the loop. The evaporator is in thermal contact with the heat source to absorb heat generated from the heat source, and the heat is transferred to the loop through phase transition of the working fluid in the loop, such that the loop heats the air in the stack tunnel in a two-dimensional manner.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Cheng-Yu Cheng, Shun-Ta Yu
  • Patent number: 10286645
    Abstract: A three-dimensional printing apparatus and a method of compensating a coordinate offset of a nozzle are provided. The method includes the following. A first nozzle and a second nozzle are controlled to print a testing three-dimensional object on a platform according to a calibration model. The testing three-dimensional object includes a plurality of correlation structures respectively corresponding to a plurality of compensation parameters, and each correlation structure includes a first sub-structure and a second sub-structure. The first sub-structure is formed of a first forming material, and the second sub-structure is formed of a second forming material. Through observing a joint level between the first sub-structure and the second sub-structure of each correlation structure, a best correlation structure, which is used for performing compensation on a printing coordinate of the first nozzle or the second nozzle, is selected from the correlation structures.
    Type: Grant
    Filed: November 16, 2014
    Date of Patent: May 14, 2019
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Yang-Teh Lee, Kwan Ho, Chi-Wen Hsieh, Yu-Chuan Chang, Chi-Chieh Wu
  • Publication number: 20190128279
    Abstract: A heat dissipation fan including a hub and a plurality of metal fan blades disposed all around the hub. Each of the metal fan blades has a first end and a second end opposite to each other, wherein the first end is connected to the hub, and the metal fan blade has a flap wing at the second end. An angle is included between the flap wing and a surface of the metal fan blade.
    Type: Application
    Filed: October 24, 2018
    Publication date: May 2, 2019
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Yu-Ming Lin, Cheng-Yu Cheng, Cheng-Wen Hsieh
  • Publication number: 20190109198
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.
    Type: Application
    Filed: November 20, 2018
    Publication date: April 11, 2019
    Inventors: Bo-Wen HSIEH, Wen-Jia HSIEH, Yi-Chun LO, Mi-Hua LIN
  • Patent number: 10247495
    Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: April 2, 2019
    Assignee: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10247196
    Abstract: A blade module and a fan using the same are provided. The blade module includes a rotating shaft and a plurality of blades. Each blade is connected to the rotating shaft and includes a blade body and an airflow guiding portion. The airflow guiding portion is connected to the blade body and has an opening.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 2, 2019
    Assignee: ACER INCORPORATED
    Inventors: Kuang-Hua Lin, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20190077078
    Abstract: A platform structure of 3D printer includes a movable platform (1), a work carrier (2), an electromagnet (3) and a positioning structure (4). Either of the movable platform (1) and the work carrier (2) has a magnetically attractable portion (20). The electromagnet (3) is installed on another of the movable platform (1) and the work carrier (2) and is capable of magnetically attracting the MAP (20) to make the work carrier (2) removably connect to the movable platform (1). The positioning structure (4) includes a first positioning portion (41) formed on the movable platform (1) and a second positioning portion (42) formed on the work carrier (2). The first positioning portion (41) and the second positioning portion (42) engage with each other. Thereby, the platform structure (10) is convenient to use and has a function of fast assembling and dissembling the work carrier (2).
    Type: Application
    Filed: November 1, 2017
    Publication date: March 14, 2019
    Inventors: Chi-Wen HSIEH, Chi-Chieh WU
  • Publication number: 20190063451
    Abstract: A heat dissipation fan including a hub and a plurality of heat dissipation blades is provided. The heat dissipation blades are arranged around the periphery of the hub. Each of the heat dissipation blades includes a curved surface body and a flow guiding portion. The curved surface body has a pressure bearing surface and a negative pressing surface opposite to the pressure bearing surface. The flow guiding portion is connected to the curved surface body. The flow guiding portion has a concave surface and a convex surface opposite to the concave surface, wherein the concave surface is recessed in the pressure bearing surface and the convex surface protrudes outward from the negative pressing surface.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 28, 2019
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10209744
    Abstract: A portable electronic device includes a body, a heat source, an evaporator, a pipe, and at least one structural component. An inner space of the body is divided into a first space and a second space. The heat source is disposed at the first space and in thermal contact with the evaporator. The pipe is connected with the evaporator to form a loop and passes through at least one of the first space and the second space. At least a portion of the pipe surrounds and is in thermal contact with the structural component disposed inside the body. A working fluid is filled and is circulated in the loop. By absorbing heat in the evaporator, the working fluid in liquid state is vaporized to exit the evaporator. While passing through the pipe, the working fluid in vapor state dissipates heat to be condensed into liquid and flow into the evaporator.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: February 19, 2019
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 10208767
    Abstract: A fan module and an electronic device are provided. The fan module includes a fan housing, a fan and a heat dissipating member. The fan housing has an open side and an enclosing side which surrounds the open side, wherein the open side is provided with a first airflow guiding channel. The fan is disposed within the fan housing, the heat dissipating member is disposed at the open side, the heat dissipating member has a second airflow guiding channel which is communicated with the first airflow guiding channel, and the air generated by the fan passes through the first airflow guiding channel and the second airflow guiding channel and flows out for dust exhausting. The electronic device includes a chassis and the fan module, and the fan module is mounted in the chassis.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 19, 2019
    Assignee: Acer Incorporated
    Inventors: Kuang-Hua Lin, Wen-Neng Liao, Cheng-Wen Hsieh
  • Publication number: 20190053085
    Abstract: A first base station (BS) for handling a flexible duplexing comprises at least one storage device and at least one processing circuit coupled to the at least one storage device. The at least one storage device stores, and the at least one processing circuit is configured to execute instructions of: scheduling a first cell of the first BS according to a first uplink/downlink (UL/DL) configuration, wherein the first UL/DL configuration comprises at least one flexible slot; and transmitting assistance information of the at least one flexible slot of the first cell from the first cell to a second cell.
    Type: Application
    Filed: August 8, 2018
    Publication date: February 14, 2019
    Inventors: Wei-Chen Pao, Chien-Min Lee, Chia-Wen Hsieh
  • Publication number: 20190022933
    Abstract: An intermittent excitation apparatus of a 3D printer includes at least one guide, a drive rod, a movable seat, and a microcontroller. When the microcontroller controls a first motor in a non-excitation and non-rotation condition, the movable seat is fixed on the drive rod and the 3D printer performs a plane printing operation. When the microcontroller controls the first motor in an excitation and rotation condition, the movable seat moves along the drive rod. Therefore, it is to significantly reduce heat generated inside the first motor, decrease costs, and reduce the size of the 3D printer.
    Type: Application
    Filed: October 2, 2017
    Publication date: January 24, 2019
    Inventors: Kwan HO, Chien-Ying HUANG, Chih-Ming CHANG, Chih-Hao LEE, Hung-Tang TENG, Chung-Chih YANG, Chi-Wen HSIEH
  • Patent number: 10182283
    Abstract: A noise cancellation device includes an anti-noise filter circuit, an output circuit, and a detection circuit. The anti-noise filter circuit provides a corresponding one of transfer functions to process a digital signal, in order to generate a noise cancellation signal, in which the transfer functions are different from each other. The output circuit mixes the noise cancellation signal, a reference signal, and an input signal to generate a mixed signal, and generates a sound output signal based on the mixed signal, in which the digital signal is associated with the sound output signal. The detection circuit controls the anti-noise filter circuit to provide the corresponding one of the transfer functions according to a comparison result of a first ratio and a first threshold value, in which the first ratio is a ratio of a first power of the mixed signal to a second power of the digital signal.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: January 15, 2019
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Pei-Wen Hsieh
  • Publication number: 20190012296
    Abstract: A method for matrix by vector multiplication, applied in an artificial neural network system, is disclosed. The method comprises: compressing a plurality of weight values in a weight matrix and indices of an input vector into a compressed main stream; storing M sets of synapse values in M memory devices; and, performing reading and MAC operations according to the M sets of synapse values and the compressed main stream to obtain a number M of output vectors. The step of compressing comprises: dividing the weight matrix into a plurality of N×L blocks; converting entries of a target block and corresponding indices of the input vector into a working block and an index matrix; removing zero entries in the working block; shifting non-zero entries row-by-row to one of their left and right sides in the working block; and, respectively shifting corresponding entries in the index matrix.
    Type: Application
    Filed: June 25, 2018
    Publication date: January 10, 2019
    Inventors: Pei-Wen HSIEH, Chen-Chu HSU, Tsung-Liang CHEN
  • Publication number: 20180374777
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
    Type: Application
    Filed: December 1, 2017
    Publication date: December 27, 2018
    Applicant: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10162435
    Abstract: An input device and an input method using the same are provided. The input device is adapted to a computing device and includes a stylus body, a tip sensing module, a gesture sensing module, a processor and a wireless module. The tip sensing module is configured to detect a touch event on a touch screen of the computing device. The gesture sensing module is configured to detect an orientation of the stylus body. The processor is coupled to the tip sensing module and the gesture sensing module, and is configured to generate a command when the touch event on the touch screen and the orientation are detected. The wireless module is coupled to the processor and is configured to transmit the command to the computing device to trigger a function on the computing device.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: December 25, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Peter Timothy Clark, Chih-Wen Hsieh, Yi-Ou Wang
  • Publication number: 20180367259
    Abstract: A communication device for handling a code block group (CBG)-based communication operation comprises at least one storage device; and at least one processing circuit, coupled to the at least one storage device. The at least one storage device stores, and the at least one processing circuit is configured to execute instructions of receiving an indication configuring at least one CBG-based communication operation to the communication device from a network; receiving a maximum number of CBGs in a transport block (TB) for the at least one CBG-based communication operation from the network; and performing the at least one CBG-based communication operation with the network according to the maximum number of CBGs.
    Type: Application
    Filed: June 15, 2018
    Publication date: December 20, 2018
    Inventors: Chia-Wen Hsieh, Chien-Min Lee
  • Patent number: 10141416
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate stack structure formed over a substrate. The gate stack structure includes a gate electrode structure having a first portion and a second portion and a first conductive layer below the gate electrode structure. In addition, the first portion of the gate electrode structure is located over the second portion of the gate electrode structure, and a width of a top surface of the first portion of the gate electrode structure is greater than a width of a bottom surface of the second portion of the gate electrode structure.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: November 27, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Wen Hsieh, Wen-Jia Hsieh, Yi-Chun Lo, Mi-Hua Lin