Patents by Inventor Wen-An HSIEH
Wen-An HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11879665Abstract: A gas exchange device for filtering a gas is provided. The gas exchange device includes a gas-intake channel having a gas-intake-channel inlet and a gas-intake-channel outlet, a gas-exhaust channel disposed aside the gas-intake channel and including a gas-exhaust-channel inlet and a gas-exhaust-channel outlet, a purification unit disposed in the gas-intake channel for filtering the gas passing through the gas-intake channel, a gas-intake guider and a gas-exhaust guider for guiding the gas, a driving controller disposed in the gas-intake channel near the gas-intake guider for controlling enablement and disablement of the purification unit, the gas-intake guider and the gas-exhaust guider, and a gas detection main body for detecting the gas and generating detection data.Type: GrantFiled: December 22, 2021Date of Patent: January 23, 2024Assignee: Microjet Technology Co., Ltd.Inventors: Hao-Jan Mou, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai, Wei-Ming Lee, Chin-Wen Hsieh
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Patent number: 11852158Abstract: A fan including a frame and an impeller is disclosed. The frame has an air inlet and an air outlet. The impeller is disposed in the frame and includes a hub and multiple blades. Each blade has a negative pressure surface facing the air inlet, a positive pressure surface facing the air outlet, a blade root, and a blade tip opposite to the blade root. In a first region extending from the blade root to the blade tip by a first length, the negative pressure surface and the positive pressure surface are respectively a convex arc surface and a plane. In a second region extending from the blade tip to the blade root by a second length smaller than the first length, the negative pressure surface and the positive pressure surface are respectively a convex arc surface and a concave arc surface or both are convex arc surfaces.Type: GrantFiled: May 3, 2023Date of Patent: December 26, 2023Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Kuang-Hua Lin, Yu-Ming Lin, Chun-Chieh Wang
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Patent number: 11852420Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.Type: GrantFiled: February 15, 2023Date of Patent: December 26, 2023Assignee: Acer IncorporatedInventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
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Patent number: 11854878Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.Type: GrantFiled: October 9, 2020Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING LTD.Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
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Patent number: 11848367Abstract: A method for manufacturing a semiconductor device is provided. The method includes etching a dummy gate to form a gate trench to expose a channel portion of a first fin and a first isolation structure; depositing a gate dielectric layer and first and second work function layers, wherein the second work function layer has a first portion directly over the channel portion of the first fin and a second portion directly over the first isolation structure; etching the second portion of the second work function layer, wherein the first portion of the second work function layer remains; depositing a third work function layer over and in contact with the first portion of the second work function layer and the first work function layer; and filling the gate trench with a gate metal.Type: GrantFiled: May 21, 2021Date of Patent: December 19, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Bo-Wen Hsieh, Wen-Hsin Chan
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Publication number: 20230383762Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.Type: ApplicationFiled: May 17, 2023Publication date: November 30, 2023Inventors: Jau-Han KE, Tsung-Ting CHEN, Chun-Chieh WANG, Yu-Ming LIN, Cheng-Wen HSIEH, Wen-Neng LIAO
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Patent number: 11813863Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.Type: GrantFiled: September 7, 2021Date of Patent: November 14, 2023Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ying-Lun Chang, Hsien-Chung Tai, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh
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Patent number: 11811357Abstract: The disclosed embodiments relate to a dismantling device configured for a frame of a PV module. The dismantling device includes a connection portion, a first holding portion, and a second holding portion. The first holding portion is connected to the connection portion and configured to press against one of an inner wall and outer wall of the frame. The second holding portion is slidably disposed on the connection portion and movably closer to or away from the first holding portion along a sliding direction. The second holding portion is configured to press against the other one of the inner wall and the outer wall so as to clamp the frame with the first holding portion and to distort the frame.Type: GrantFiled: December 28, 2020Date of Patent: November 7, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Teng-Yu Wang, Chih-Lung Lin, Mu-Hsi Sung, Neng-Wen Hsieh, Chin-Yueh Li
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Publication number: 20230354554Abstract: A heat dissipation system suitable for a portable electronic device with two heat sources is provided. The heat dissipation system includes a fan, two heat dissipation fin sets, a gate, a first heat pipe, a second heat pipe, and a control unit. The fan is a centrifugal fan and has a main outlet and a sub outlet. The heat dissipation fin sets are disposed respectively at the main outlet and the sub outlet, and the gate is disposed at the sub outlet. The first heat pipe thermally contacts the heat sources and the heat dissipation fin set located at the main outlet. The second heat pipe thermally contacts one of the heat sources and the two heat dissipation fin sets. The control unit is electrically connected to the gate to drive the gate to open or close the sub outlet according to a load of the two heat sources.Type: ApplicationFiled: April 25, 2023Publication date: November 2, 2023Applicant: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Tsung-Ting Chen, Jau-Han Ke, Chun-Chieh Wang, Chi-Tai Ho, Kuan-Lin Chen
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Publication number: 20230349386Abstract: A centrifugal heat dissipation fan including a hub, a frame, and double-layer fan blade sets is provided. The double-layer fan blade sets surround the hub and are arranged along a radial direction at an inner layer and an outer layer. A gap is maintained along the radial direction between the fan blade set located at the inner layer and the fan blade set located at the outer layer. The frame is connected to the hub and the fan blade set located at the outer layer.Type: ApplicationFiled: April 25, 2023Publication date: November 2, 2023Applicant: Acer IncorporatedInventors: Cheng-Wen Hsieh, Wen-Neng Liao, Kuang-Hua Lin, Wei-Chin Chen, Tsung-Ting Chen
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Publication number: 20230337391Abstract: Provided is a centrifugal heat dissipation fan including a housing and an impeller. The impeller is disposed in the housing. The impeller has a hub and multiple blades disposed surrounding the hub. Every two adjacent blades have different blade structures relative to the housing such that the blade structures pass by a fixed position of the housing and generate blade tones of varying frequencies when the impeller rotates.Type: ApplicationFiled: April 18, 2023Publication date: October 19, 2023Applicant: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Tsung-Ting Chen, Sheng-Yan Chen, Chun-Chieh Wang
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Patent number: 11791110Abstract: A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.Type: GrantFiled: September 17, 2021Date of Patent: October 17, 2023Assignee: Acer IncorporatedInventors: Hung-Chi Chen, Cheng-Wen Hsieh
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Publication number: 20230328930Abstract: A graphics card including a circuit board module, a first heat dissipation fin, and a pair of fans is provided. The circuit board module includes a circuit board and a heat source. The circuit board has first to fourth sides surrounding the heat source. The first and second sides are opposite sides. The third and fourth sides are opposite sides. The first heat dissipation fin is in thermal contact with the heat source and has multiple channels communicating with the first to fourth sides. The fans disposed on the first and second sides respectively have first flow outlets facing the first heat dissipation fin and generate flows towards the first heat dissipation fin through the first flow outlets. The flows meet and squeeze in the channels to form turbulent flows and flow out of the graphics card through the third and fourth sides respectively. A computer host is also provided.Type: ApplicationFiled: April 10, 2023Publication date: October 12, 2023Applicant: Acer IncorporatedInventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Shu-Hao Kuo, Tsung-Ting Chen
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Publication number: 20230317459Abstract: Interconnect structures and methods and apparatuses for forming the same are disclosed. In an embodiment, a method includes supplying a process gas to a process chamber; igniting the process gas into a plasma in the process chamber; reducing a pressure of the process chamber to less than 0.3 mTorr; and after reducing the pressure of the process chamber, depositing a conductive layer on a substrate in the process chamber.Type: ApplicationFiled: June 8, 2023Publication date: October 5, 2023Inventors: Chun-Hsu Yang, Huei-Wen Hsieh, Nai-Hao Yang, Yu-Cheng Hsiao, Chun-Sheng Chen, Che-Wei Tien, Kuan-Chia Chen
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Patent number: 11775034Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.Type: GrantFiled: January 11, 2022Date of Patent: October 3, 2023Assignee: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
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Patent number: 11772461Abstract: A method of air pollution filtration in a vehicle is disclosed. A plurality of purification devices are provided to detect and transmit an inside-device gas detection datum, respectively, for intelligently selecting and controlling the activation of filtering the air pollution in the inner space of the vehicle. An in-car gas exchange system and a connection device are provided. The connection device receives and compares the respective inside-device gas detection datum, and selectively transmits a control instruction to drive the in-car gas exchange system and the purification devices. The movement of the air pollution is accelerated by the gas convention of the in-car gas exchange system, so that the air pollution is directionally moved toward the corresponding one of the purification devices adjacent to the air pollution for filtration. The air pollution in the inner space of the vehicle is filtered rapidly, so as to provide clean, safe and breathable air.Type: GrantFiled: November 30, 2021Date of Patent: October 3, 2023Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ching-Sung Lin, Chin-Chuan Wu, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh
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Patent number: 11772029Abstract: A gas detection and purification device can be placed in an in-car space and includes a housing, a purification module, a gas-guiding unit, and a gas detection module. The housing has a gas inlet and a gas outlet. A gas channel is between the gas inlet and the gas outlet. The purification module is disposed in the gas channel to filter the gas guided into the gas channel. The gas-guiding unit is disposed in the gas channel and at one side of the purification module. The gas-guiding unit guides the gas into the device from the gas inlet, guides the gas to pass through the purification module for performing filtering and purifying, and discharges the gas out from the gas outlet. The gas detection module is disposed in the gas channel to detect the gas guided into the housing to obtain gas detection data.Type: GrantFiled: November 5, 2020Date of Patent: October 3, 2023Assignee: MICROJET TECHNOLOGY CO., LTD.Inventors: Hao-Jan Mou, Ching-Sung Lin, Chin-Chuan Wu, Yung-Lung Han, Chi-Feng Huang, Chun-Yi Kuo, Chin-Wen Hsieh
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Publication number: 20230292807Abstract: Provided is a nutritional composition with natural ingredient, including natural ingredient, fat, carbohydrate, and protein, in which a viscosity of the nutritional composition is from 20 cPs to 1000 cPs. Provided also is a method of preparing nutritional composition with natural ingredient, so as to obtain a nutritional composition with the flavor of natural ingredients.Type: ApplicationFiled: March 16, 2023Publication date: September 21, 2023Inventors: Kai En Chuang, Ann Feng, Wen Hsieh Lo, Jun Yi Wu
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Publication number: 20230301017Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.Type: ApplicationFiled: May 23, 2023Publication date: September 21, 2023Applicant: Acer IncorporatedInventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
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Patent number: D1007520Type: GrantFiled: April 6, 2021Date of Patent: December 12, 2023Assignee: CHINA MEDICAL UNIVERSITYInventors: Der-Yang Cho, Chih-Yu Chi, Chia-Huei Chou, Yow-Wen Hsieh, Pei-Ran Sun, Lu-Ching Ho, Ming-Tung Chen