Patents by Inventor Wen-An HSIEH

Wen-An HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220287605
    Abstract: A blood picker including one or more needles, a storage device, and a fluid transmission control system is provided. The needle is adapted to be inserted into a blood vessel of a human for blood detection. The storage device is in communication with the needle and provided with a drawing tube in communication with an inner space of the storage device. The fluid transmission control system includes a fluid transmission device, a driving controller, and a power supply. The fluid transmission device is in communication with one end of the drawing tube. The power supply provides a power source for the driving controller to enable the fluid transmission device, so that after the fluid transmission device is enabled, the inner space of the storage device is controlled by the fluid transmission device to generate a pressure difference, thereby allowing the blood to be drawn and stored in the storage device.
    Type: Application
    Filed: March 9, 2022
    Publication date: September 15, 2022
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin, Yang Ku
  • FAN
    Publication number: 20220290684
    Abstract: A fan adapted for being disposed in an electronic device is provided. The fan includes a hub and a plurality of metal blades respectively extending from the hub. Each of the metal blades has a root portion connected to the hub and an end portion away from the hub, and a mass of the end portion is greater than a mass of the root portion, such that the metal blade is elongated while the fan is rotated.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Han-Liang Huang, Sheng-Yan Chen, Tsung-Ting Chen
  • Patent number: 11430692
    Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: August 30, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Cheng-Lun Tsai, Huei-Wen Hsieh, Chun-Sheng Chen, Kai-Shiang Kuo, Jen-Wei Liu, Cheng-Hui Weng, Chun-Chieh Lin, Hung-Wen Su
  • Publication number: 20220270832
    Abstract: A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.
    Type: Application
    Filed: September 17, 2021
    Publication date: August 25, 2022
    Applicant: Acer Incorporated
    Inventors: Hung-Chi Chen, Cheng-Wen Hsieh
  • Patent number: 11402157
    Abstract: An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: August 2, 2022
    Assignee: ACER INCORPORATED
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao, Jau-Han Ke
  • Publication number: 20220231143
    Abstract: A gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the gate region over the semiconductor substrate, a first work function metal layer disposed over the gate dielectric layer and lining a bottom surface of an inner sidewall of the spacer, and a filling metal partially wrapped by the first work function metal layer. The filling metal includes a first portion and a second portion, wherein the first portion is between the second portion and the semiconductor substrate, and the second portion is wider than the first portion.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventors: Bo-Wen HSIEH, Yi-Chun LO, Wen-Jia HSIEH
  • Publication number: 20220229477
    Abstract: A heat dissipation system of a portable electronic device is provided. The heat dissipation system includes a body and at least one fan. A heat source of the portable electronic device is disposed in the body. The fan is a centrifugal fan disposed in the body. The fan has at least one flow inlet, at least one flow outlet, and at least one spacing portion. The flow outlet faces toward the heat source, and the spacing portion surrounds the flow inlet and abuts against the body, so as to isolate the flow inlet and the heat source in two spaces independent of each other in the body.
    Type: Application
    Filed: January 11, 2022
    Publication date: July 21, 2022
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Chun-Chieh Wang, Shu-Hao Kuo
  • Patent number: 11394497
    Abstract: A user equipment (UE) receives physical downlink shared channel (PDSCH) in a downlink slot as scheduled using a downlink control indicator (DCI). The UE identifies that the downlink slot is part of a group of downlink slots based on the DCI and/or another DCI corresponding to the group. The UE identifies one or more uplink slots at which to transmit hybrid automatic repeat request (HARQ) feedback corresponding to the slots in the group, and transmits the HARQ feedback at one of these uplink slots. If HARQ feedback is not received, a semi-static codebook may prevent HARQ payload size misalignment.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: July 19, 2022
    Assignee: ACER INCORPORATED
    Inventors: Chia-Wen Hsieh, Chien-Min Lee
  • Publication number: 20220219456
    Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.
    Type: Application
    Filed: November 18, 2021
    Publication date: July 14, 2022
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Hsien-Chung Tai, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh
  • Publication number: 20220221172
    Abstract: A gas exchange device for filtering a gas is provided. The gas exchange device includes a gas-intake channel having a gas-intake-channel inlet and a gas-intake-channel outlet, a gas-exhaust channel disposed aside the gas-intake channel and including a gas-exhaust-channel inlet and a gas-exhaust-channel outlet, a purification unit disposed in the gas-intake channel for filtering the gas passing through the gas-intake channel, a gas-intake guider and a gas-exhaust guider for guiding the gas, a driving controller disposed in the gas-intake channel near the gas-intake guider for controlling enablement and disablement of the purification unit, the gas-intake guider and the gas-exhaust guider, and a gas detection main body for detecting the gas and generating detection data.
    Type: Application
    Filed: December 22, 2021
    Publication date: July 14, 2022
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan MOU, Yung-Lung HAN, Chi-Feng HUANG, Chang-Yen TSAI, Wei-Ming LEE, Chin-Wen HSIEH
  • Publication number: 20220216181
    Abstract: A system-in-package chip of printer driver system applicable in a printer includes a first chip, a second chip, and a third chip. The first chip, the second chip, and the third chip are arranged in a common package. The first chip and the second chip are arranged side-by-side on a carrier in the common package. The third chip is arranged on a top portion of the first chip in the common package. A wire carrier structure is formed on the top portion of the first chip before the third chip is disposed on the first chip.
    Type: Application
    Filed: December 22, 2021
    Publication date: July 7, 2022
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh, Tsung-I Lin
  • Patent number: 11379021
    Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 5, 2022
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Cheng-Wen Hsieh, Wen-Neng Liao
  • Publication number: 20220194183
    Abstract: A method of air pollution filtration in a vehicle is disclosed. A plurality of purification devices are provided to detect and transmit an inside-device gas detection datum, respectively, for intelligently selecting and controlling the activation of filtering the air pollution in the inner space of the vehicle. An in-car gas exchange system and a connection device are provided. The connection device receives and compares the respective inside-device gas detection datum, and selectively transmits a control instruction to drive the in-car gas exchange system and the purification devices. The movement of the air pollution is accelerated by the gas convention of the in-car gas exchange system, so that the air pollution is directionally moved toward the corresponding one of the purification devices adjacent to the air pollution for filtration. The air pollution in the inner space of the vehicle is filtered rapidly, so as to provide clean, safe and breathable air.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 23, 2022
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Ching-Sung Lin, Chin-Chuan Wu, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh
  • Patent number: 11353041
    Abstract: A fan blade includes an arc-shaped body and a connecting portion. The arc-shaped body has a main portion and an end portion connected to the main portion, wherein a width of the end portion is gradually decreased in a direction away from the main portion. The connecting portion is connected to the main portion, and the end portion and the connecting portion are respectively located at two opposite sides of the main portion. A fan structure is also provided.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: June 7, 2022
    Assignee: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Jau-Han Ke, Shun-Ta Yu
  • Publication number: 20220161556
    Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.
    Type: Application
    Filed: September 7, 2021
    Publication date: May 26, 2022
    Applicant: Microjet Technology Co., Ltd.
    Inventors: Hao-Jan Mou, Ying-Lun Chang, Hsien-Chung Tai, Yung-Lung Han, Chi-Feng Huang, Chin-Wen Hsieh
  • Fan
    Patent number: 11339796
    Abstract: A fan blade includes an arch-shaped body, a connecting portion, at least one sheet and at least one reinforcement component. The arch-shaped body has a pressure bearing surface and a negative pressure surface opposite to the pressure bearing surface. The connecting portion is connected to a first end portion of the arch-shaped body. The sheet is connected to the pressure bearing surface or the negative pressure surface. The reinforcement component is connected to the pressure bearing surface. An orthogonal projection of the sheet on the arch-shaped body and an orthogonal projection of the reinforcement component on the arch-shaped body are not overlapped with each other. A fan is also provided.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: May 24, 2022
    Assignee: Acer Incorporated
    Inventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin
  • Patent number: 11332210
    Abstract: The disclosure provides a bicycle head. The bicycle head includes a head assembly and a control assembly. The head assembly includes a handlebar and a stem. The handlebar is mounted on the stem. The control assembly includes a casing, a first circuit board, an antenna and a battery. The casing is pivotably disposed at a portion where the handlebar is mounted on the stem. The first circuit board, the antenna and the battery are electrically connected to one and another, and at least one of the first circuit board, the antenna and the battery is located in the casing.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: May 17, 2022
    Assignee: TEKTRO TECHNOLOGY CORPORATION
    Inventor: Chia-Wen Hsieh
  • Publication number: 20220130166
    Abstract: An electronic circuit adapted to drive a display panel is provided. The display panel includes touch sensors and fingerprint sensors. The electronic circuit includes a touch sensing circuit, a fingerprint sensing circuit and a display driving circuit. The touch sensing circuit senses a touch of a finger and determines a first area corresponding to the touch on the display panel. The fingerprint sensing circuit senses a fingerprint image of the finger corresponding to the first area. The display driving circuit drives pixels of the first area with respective first gray levels and pixels of a second area outside the first area with respective second gray levels. The display driving circuit processes respective third gray levels to obtain the respective second gray levels. The display driving circuit generates gamma voltages corresponding to the respective first gray levels and the respective second gray levels according to the same gamma curve.
    Type: Application
    Filed: January 4, 2022
    Publication date: April 28, 2022
    Applicant: Novatek Microelectronics Corp.
    Inventors: Wei-Lun Shih, Tzu-Wen Hsieh, Huan-Teng Cheng, Huang-Chin Tang, Yueh-Teng Mai, Shi-Hao Huang, Jung-Chung Lee
  • Patent number: D951243
    Type: Grant
    Filed: August 15, 2018
    Date of Patent: May 10, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Sheng-Ta Lin, Chih-Wen Hsieh
  • Patent number: D962879
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 6, 2022
    Assignee: Acer Incorporated
    Inventors: Shu-Hao Kuo, Wen-Neng Liao, Cheng-Wen Hsieh