Abstract: A gate dielectric structure is formed over a channel structure. One or more work function (WF) metal layers of a metal gate are formed over the gate dielectric structure. The one or more WF metal layers are treated with a fluorine-containing material. One or more processes are performed to cause fluorine from the fluorine-containing material to diffuse at least partially into the gate dielectric structure.

Abstract: A manufacturing method of micro fluid actuator includes: providing a substrate; depositing a first protection layer on a first surface of the substrate; depositing an actuation region on the first protection layer; applying lithography dry etching to a portion of the first protection layer to produce at least one first protection layer flow channel; applying wet etching to a portion of a main structure of the substrate to produce a chamber body and a first polycrystalline silicon flow channel region, while a region of an oxidation layer middle section of the main structure is not etched; applying reactive-ion etching to a portion of a second surface of the substrate to produce at least one substrate silicon flow channel; and applying dry etching to a portion of a silicon dioxide layer to produce at least one silicon dioxide flow channel.

Abstract: A thin profile gas transporting device includes a gas collecting plate, a valve sheet, a discharge sheet, and a gas pump. The gas pump is disposed on the gas collecting plate. The gas collecting plate, the valve sheet, and the discharge sheet are stacked and assembled sequentially. Through simplifying the structures of the gas collecting plate and the discharge sheet, the thicknesses of the gas collecting plate and the discharge sheet can be reduced. Moreover, through the arrangement of several pressure relief holes, the pressure relieving operation can be performed rapidly and quietly.

Abstract: A gas detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a light-emitting element, a particle-sensing element, a gas-sensing element, a driving-chip element and an encapsulation layer. The driving-chip element controls driving operations of the microelectromechanical element, the light-emitting element, the particle-sensing element and the gas-sensing element, respectively. When the microelectromechanical element is enabled to actuate transportation of gas, the gas is introduced into the gas detection device through an inlet aperture of the substrate. Scattered light spots generated by the light beam of the light-emitting element irradiating on suspended particles contained in the gas are received by the particle-sensing element to generate a detection datum of the suspended particles. The gas-sensing element detects the gas passing through and generates a detection datum of hazardous gas contained in the gas.

Abstract: A fan including a hub and a plurality metal blades is provided. Each of the blades extends from the hub and is inclined relative to a radial direction of the hub. Each blade has a distal edge away from the hub, and has a pair of wingtips at the distal edge.

Abstract: An actuator includes a suspension plate, an outer frame, one or more supporting elements, a piezoelectric sheet, an inlet plate, and a resonance sheet. The suspension plate, the outer frame, the supporting element, the piezoelectric sheet, the inlet plate, and the resonance sheet are fabricated as a modular structure, and the modular structure has a length, a width, and a height.

Abstract: Provided is a heat dissipation structure, including a conductive member disposed on and thermally coupled to a heat source, a heat pipe including evaporating and condensing parts, a fan disposed in correspondence to the condensing part, and a heat storage component disposed on a circuit board. The evaporating part is disposed on and thermally coupled to the conductive member. The heat source is located between the conductive member and the circuit board. The conductive member is located between the heat pipe and the heat source. The circuit board is located between the heat source and the heat storage component, and is thermally coupled to the heat source. The heat storage component is thermally coupled to the circuit board and is filled with a working medium absorbing heat conducted from the heat source to the circuit board by latent heat of absorption during phase change. An electronic device is also provided.

Abstract: A portable electronic device including a first body, a second body, a heat source, a first heat pipe, a second heat pipe, and a heat conducting element is provided. The second body is pivotally connected to the first body. The heat source is disposed in the first body and thermally coupled to the heat source. The second heat pipe is disposed in the first body and thermally coupled to the first heat pipe. The heat conducting element is connected to and thermally coupled to the second body, and the heat conducting element slidably contacts the second heat pipe and is thermally coupled to the second heat pipe.

Abstract: Interconnect structures and methods and apparatuses for forming the same are disclosed. In an embodiment, a method includes supplying a process gas to a process chamber; igniting the process gas into a plasma in the process chamber; reducing a pressure of the process chamber to less than 0.3 mTorr; and after reducing the pressure of the process chamber, depositing a conductive layer on a substrate in the process chamber.

Abstract: An air pollution prevention device applied for a baby carriage includes a sealing cover, a filtration cleaner, a gas detection module and an intelligent control and process device. The sealing cover is hooded on the baby carriage for forming a sealed space. The filtration cleaner penetrates the sealing cover form the outside of the baby carriage for introducing an outside air into the sealed space of the baby carriage and discharging an air pollution source out of the sealed space. The gas detection module detects the air pollution source and outputs gas detection data. The intelligent control and process device receives and compares the gas detection data and controls an enablement of a gas guider of the filtration cleaner for filtering and exchanging the air pollution source in the sealed space so as to generate a clean air.

Abstract: A nasal-plug filter device including a device body, a filter, a first actuator, a second actuator, and a gas sensor is provided. The device body has a ventilating channel, and the ventilating channel has an inlet end and an outlet end. The filter is disposed at the outlet end. The first actuator is disposed at the inlet end for being driven to transmit gas outside the device body into the device body. The second actuator is stacked on and bonded to the first actuator, and the second actuator is driven to transmit the gas transmitted by the first actuator to the filter to be filtered and purified. The gas sensor is disposed at the outlet end. A connection element may be provided for connecting two nasal-plug filter devices with each other.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.

Abstract: An indoor pollution prevention system includes a plurality of gas detection modules, one or more intelligent control-driving processing devices, one or more gas-exchange processing devices, and one or more indoor cleaning and filtration devices. The gas-exchange processing device includes one or more flow-guiding component and a cleaning and filtration assembly. The intelligent control-driving processing device controls the operation of the indoor cleaning and filtration device in real-time under a surveillance condition, therefore the air pollution source in the indoor space passes through the indoor cleaning and filtration device, allowing the air pollution source in the indoor space to be filtered and exchanged to become a clean air.

Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.

Abstract: A system performs adaptive thermal ceiling control at runtime. The system includes computing circuits and a thermal management module. When detecting a runtime condition change that affects power consumption in the system, the thermal management module determines an adjustment to the thermal ceiling of a computing circuit, and increases the thermal ceiling of the computing circuit according to the adjustment.

Abstract: A multi-loop cycling heat dissipation module including a first tank, a first pipe, a second tank, and a second pipe is provided. The first pipe is connected to the first tank to form a first loop, a first working fluid fills the first loop to transfer heat via phase transformation, and a first high-temperature section and a first low-temperature section are formed on the first pipe. The second pipe is connected to the second tank to form a second loop, a second working fluid fills the second loop to transfer heat via phase transformation, and a second high-temperature section and a second low-temperature section are formed on the second pipe. The first high-temperature section is in thermal contact with the second low-temperature section, and the first low-temperature section is in thermal contact with the second high-temperature section.

Abstract: A cooling fan includes a hub, a plurality of blades, and a plurality of flow disturbing elements. The blades are arranged on a peripheral surface of the hub; each of the blades has a leading edge and a trailing edge opposite to the leading edge, and each of the blades has at least one flow disturbing element arranged at the trailing edge. Each of the flow disturbing elements includes an engaging part and an extending part opposite to the engaging part; the engaging part of each of the flow disturbing elements is connected to the trailing edge of the corresponding blade, and the extending part of each of the flow disturbing elements extends outwardly toward a direction away from the trailing edge of the corresponding blade.

Abstract: A gas detecting module is provided. The gas detecting module includes a base, a piezoelectric actuator, a driving circuit board, a laser component, a particulate sensor and an outer cover. A gas-guiding-component loading regain and a laser loading region are separated by the base. By the design of the gas flowing path, the driving circuit board covering the bottom surface of the base, and the outer cover covering the surfaces of the base, an inlet path is collaboratively defined by the gas inlet groove of the base and the driving circuit board, and an outlet path is collaboratively defined by a gas outlet groove of the base, the outer cover and the driving circuit board. Consequently, the thickness of the gas detecting module is drastically reduced.

Abstract: A heat dissipation fan including a housing, a hub, and a plurality of blades is provided. The hub is rotatably disposed in the housing. The blades are disposed at a surrounding edge of the hub to be rotated with the hub. When the heat dissipation fan is operated, at least one flow path is formed by two adjacent blades, and the flow path has a reduction section away from the hub.