Patents by Inventor Wen-An Liang

Wen-An Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR PACKAGING LIGHT EMITTING DIODE
    Publication number: 20130178003
    Abstract: A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.
    Type: Application
    Filed: September 13, 2012
    Publication date: July 11, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Lung-Hsin CHEN, Wen-Liang TSENG, Pin-Chuan CHEN
  • Light emitting diode package having multiple luminescent conversion layers
    Patent number: 8476664
    Abstract: A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: July 2, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Wen-Liang Tseng, Chieh-Ling Chang
  • LIGHT EMITTING DIODE PACKAGE HAVING FLUORESCENT FILM DIRECTLY COATED ON LIGHT EMITTING DIODE DIE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20130161673
    Abstract: A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 27, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: Lung-Hsin CHEN, Wen-Liang TSENG, Pin-Chuan CHEN
  • Method for fabricating a flip-chip semiconductor optoelectronic device
    Patent number: 8470621
    Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: June 25, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chester Kuo, Lung Hsin Chen, Wen Liang Tseng, Shih Cheng Huang, Po Min Tu, Ying Chao Yeh, Wen Yu Lin, Peng Yi Wu, Shih Hsiung Chan
  • Traffic light
    Patent number: 8459838
    Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: June 11, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh
  • Method for making light emitting diode package
    Patent number: 8455275
    Abstract: A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: June 4, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Meng-Hsien Hong, Wen-Liang Tseng, Hsin-Tung Chiang, Pin-Chuan Chen
  • Method for manufacturing light emitting diode
    Patent number: 8455274
    Abstract: A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: June 4, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Pin-Chuan Chen, Hsin-Chiang Lin, Wen-Liang Tseng
  • Light-emitting diode light source module
    Patent number: 8445928
    Abstract: A light-emitting diode (LED) light source module is described, comprising: a heat conduction substrate, wherein a surface of the heat conduction substrate includes a plurality of recesses; a plurality of light-emitting diode chips respectively disposed in the recesses; an insulation layer disposed on the surface of the heat conduction substrate outside of the recesses; an electric conduction layer disposed on the insulation layer, wherein the light-emitting diode chips are electrically connected to the electric conduction layer; and an encapsulation layer covering the light-emitting diode chips, the electric conduction layer and the insulation layer.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: May 21, 2013
    Assignee: CHI MEI Lighting Technology Corp.
    Inventors: Shi-Ming Cheng, Wen-Liang Li, Chang-Hsin Chu, Hsing-Mao Wang
  • ALIGNMENT ACCURACY MARK
    Publication number: 20130106000
    Abstract: An alignment accuracy (AA) mark is described, including N (N?3) pattern sets defined by N exposure steps respectively. The N exposure steps are performed also to a device area disposed on a wafer together with the AA mark. The i-th (i=1, 2 . . . N?1) pattern set surrounds the (i+1)-th pattern set. Each pattern set includes a 1st set of x-directional linear patterns, a 2nd set of x-directional linear patterns arranged opposite to the 1st set of x-directional linear patterns in the y-direction, a 1st set of y-directional linear patterns, and a 2nd set of y-directional linear patterns arranged opposite to the 1st set of y-directional linear patterns in the x-direction, wherein each set of x- or y-directional linear patterns include at least three separate parallel linear patterns.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 2, 2013
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kai-Lin Chuang, Wen-Liang Huang, Chia-Hung Lin, Chun-Chi Yu
  • LED ILLUMINATION MODULE
    Publication number: 20130107511
    Abstract: An LED illumination module includes a base, first white-light LEDs mounted on a central portion of a top surface of the base, and second white-light LEDs mounted on a periphery of the top surface of the base and surrounding the first white-light LEDs. A power of the first white-light LEDs is equal to that of the second white-light LEDs. An average value of luminescence efficiencies of the first white-light LEDs is smaller than that of the second white-light LEDs. An average value of color rendering indexes of the first white-light LEDs is larger than that of the second white-light LEDs.
    Type: Application
    Filed: June 11, 2012
    Publication date: May 2, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHIA-CHIANG YANG, WEN-LIANG TSENG
  • ENERGY SAVING AIR CONDITIONING SYSTEM AND AIR CONDITIONING METHOD THEREOF
    Publication number: 20130105107
    Abstract: An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally to managed.
    Type: Application
    Filed: May 24, 2012
    Publication date: May 2, 2013
    Applicant: QUANTA COMPUTER INC
    Inventors: Chao-Jung Chen, Chien-Pang Chen, Kai-Hung Lin, Chih-Ming Chen, Wen-Liang Huang
  • extracts for inhibition or prevention of H1N1 influenza virus infection and its application thereof
    Patent number: 8414938
    Abstract: Disclosed are an Schisandrae fructus extract for inhibition or prevention of influenza and its application, wherein the Schisandrae fructus extract is obtained by water, methanol, or ethanol extraction process and the extract comprises compounds such as schisandrone, benzoylgomisin P, wulignan A1, epigomisin O, epiwulignan A1, and tigloylgomisin P. The extracts and purified compounds of Schisandrae fructus has anti-influenza virus H1N1 and H1N1-TR (a Tamiflu drug resistant virus strain) activities, therefore the extracts and the purified compounds of Schisandrae fructus can be applied as an inhitibory agent of a pharmaceutical composition for treatment or prevention agent for influenza infection.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: April 9, 2013
    Assignee: National Defense Medical Center
    Inventors: Wen-Liang Chang, Chen-Wen Yao, Chi-Hong Chu, An-Rong Lee, Ann Chen, Wen-Hsin Huang, Kuo-Yuan Hwa, Chiao-Ying Chien, Chien-Yi Pai
  • LED PACKAGE DEVICE
    Publication number: 20130082293
    Abstract: An LED package device comprises a substrate, an LED chip, a reflector and a covering layer. The covering layer completely encapsulates the reflector, the LED chip and the substrate to enhance the robustness and unitary integrity of the LED package device; two electrodes comprising two bulges penetrate through the covering layer to reach a base of the LED package device. The LED package device is able to function as a side emitting type of LED package. Front sides of the two bulges are level with a front side of the LED package device and configured for being mounted to a printed circuit board and electrically connecting therewith.
    Type: Application
    Filed: February 6, 2012
    Publication date: April 4, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHIA-CHIANG YANG, WEN-LIANG TSENG
  • CHIPPING HAMMER CLAMPING STRUCTURE FOR A PNEUMATIC TOOL
    Publication number: 20130075983
    Abstract: A chipping hammer clamping structure for a pneumatic tool includes primarily a grip which is filled in with high-pressure air, an air cylinder which is connected with the grip, a braking unit which is at a front end of the air cylinder, an inner rim of which is a support part and which can move along the air cylinder, and a shield which is sheathed at a rear rim of the air cylinder and is combined with the grip. When in use, as the air cylinder is formed integrally, the chipping hammer can be more robust to increase a striking force. Besides, dust and particles produced in operation are discharged from the groove at the front rim of the shield, thereby avoiding contamination to an operator.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 28, 2013
    Inventor: Wen-Liang HSIAO
  • Electric motor
    Patent number: 8405273
    Abstract: A universal motor has a stator and a rotor. The stator has stator core and a stator winding. The stator core has a yoke with two ends and two equivalent salient poles formed at the ends of the yoke respectively. The stator winding is wound on the yoke.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: March 26, 2013
    Assignee: Johnson Electric S.A.
    Inventors: Yue Li, Bao Ting Liu, Ji Dong Chai, Wen Liang Li
  • METHOD FOR MANUFACTURING LED AND LED OBTAINED THEREBY
    Publication number: 20130069101
    Abstract: A method for manufacturing a light emitting diode is disclosed. Firstly, two leads each including a plateau are provided. A blocking layer is then formed on each plateau. A base is molded on the leads to embed the two leads therein, wherein the two blocking layer are exposed from the base. The blocking layers are removed from the plateaus so that the two plateaus are exposed. A light emitting chip is bonded on one plateau with a wire connecting the chip with the other plateau. Finally, an encapsulant is formed on the base to seal the chip and the wire.
    Type: Application
    Filed: August 7, 2012
    Publication date: March 21, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, WEN-LIANG TSENG, LI-HSIANG CHEN, HSING-FEN LO
  • METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE
    Publication number: 20130065332
    Abstract: A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs.
    Type: Application
    Filed: August 23, 2012
    Publication date: March 14, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HSIN-CHIANG LIN, WEN-LIANG TSENG
  • LED lamp structure
    Patent number: 8384276
    Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: February 26, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Min-Tsun Hsieh, Wen-Liang Tseng, Lung-Hsin Chen, Chih-Yung Lin, Ching-Lien Yeh
  • SURFACE PROFILE MEASUREMENT APPARATUS AND ALIGNMENT METHOD THEREOF AND AN IMPROVED SUB-APERTURE MEASUREMENT DATA ACQUISITION METHOD
    Publication number: 20130044332
    Abstract: A surface profile measurement apparatus, which measures a surface profile of an object, includes a wavefront measurement unit, a driving unit and a rotation unit. The wavefront measurement unit has an image sensor and emits a detecting light. The driving unit has a plurality of stages for moving the object or the wavefront measurement unit. The rotation unit has a rotation axis, is disposed on one of the stages of the driving unit, and holds the object. When measuring the object, the rotation unit rotates the object and the image sensor simultaneously exposes and acquires a measurement data, formed by the detecting light reflected from the object. An alignment method of the surface profile measurement apparatus and an improved sub-aperture measurement data acquisition method are also disclosed.
    Type: Application
    Filed: August 20, 2012
    Publication date: February 21, 2013
    Inventor: Chao-Wen LIANG
  • Light emitting diode package and method of fabricating the same
    Patent number: 8378378
    Abstract: A light emitting diode package includes a base having a first surface, an electrode portion attached to the base, a pair of inner electrodes disposed on the first surface, a pair of outer electrodes, a pair of conductive pillars, a light emitting diode die, and a cap layer. Each outer electrode includes an end surface section and a side surface section. The end surface sections are disposed, corresponding to the inner electrodes, on the second surface. Each side surface section extends onto the side surface of the electrode portion. The conductive pillar penetrates between the inner electrode and the outer electrode. The light emitting diode die is on the first surface, electrically connecting the inner electrode. The cap layer covers the light emitting diode die.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: February 19, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Shen Bo Lin, Chao Hsiung Chang, Wen Liang Tseng