Abstract: An LED package structure includes a substrate with a concave groove therein, an LED die received in the concave groove, a heat conductive pillar, two electrically conductive pillars, a heat conductive plate, and two contact pads. The heat conductive pillar extends through the substrate and thermally connects with the LED die and the heat conductive plate. The electrically conductive pillars extend through substrate and electrically connect with the LED die, respectively. The electrically conductive pillars and the heat conductive pillar are spaced from each other. The contact pads respectively and electrically connect with the electrically conductive pillars. The contact pads are spaced from each other.

Abstract: A light-emitting diode (LED) light bulb and an application thereof are described. The light-emitting diode light bulb comprises: a light-emitting diode light source module; a base, wherein the light-emitting diode light source module is disposed on the base; and a driver portion to drive the light-emitting diode light source module, comprising a rotation shaft, wherein the driver portion is connected to the base via the rotation shaft, such that the light-emitting diode light source module can rotate relative to the driver portion.

Abstract: A zero-setting QoS system, which is designed with priority session and bandwidth technologies in an undifferentiated network, such that the packets for universal or dedicated network can obtain priority transmission services. As a QoS system of priority levels, the network packets are received from the inlet, and 802.1q tag and 802.1p tag are loaded onto the packets, so that the packets can be transmitted by priority levels, then 802.1q tag and 802.1p tag are removed from the outlet of the system, enabling easy operation in an undifferentiated network environment; therefore, the system with rapid transmission capability can allocate and transmit the network packets within a shorter response time and by better priority levels.

Abstract: A cooling apparatus for server rack is disclosed, which is disposed above at least one server rack. The cooling apparatus for server rack includes a fan module disposed at a back end above the least one server rack, a heat exchanger module disposed at a front end above the least one server rack, and an air guide connecting the fan module and the heat exchanger module. A hot air exhausted from the back end of the least one server rack is extracted by the fan module and is sent to the heat exchanger module through the air guide, and the hot air is cooled by the heat exchanger module, and a cool air is exhausted from the front end of the least one server rack.

Abstract: An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules.

Abstract: A fluorescent structure for a light-emitting package includes a first fluorescent layer and a second fluorescent layer covering the first fluorescent layer. The first fluorescent layer includes first fluorescent strips, and defines first transparent regions between the first fluorescent strips. The second fluorescent layer includes second fluorescent strips, and defines second transparent regions between the second fluorescent strips. A method for forming the fluorescent structure and a light-emitting diode package using the fluorescent structure are also provided.

Abstract: A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.

Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.

Abstract: An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.

Abstract: An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.

Abstract: In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together.

Abstract: An electric motor has a stator and a rotor. The stator has a housing with inlets and outlets. The rotor has a shaft, a rotor core and a commutator. A fan is fixed to the rotor. An end cap is fitted to the housing to close a first end of the housing and support electrical components, including brush gear. The brush gear includes two brush assemblies, each comprising a brush for making sliding electrical contact with the commutator and a brush guidance mechanism for resiliently urging the brush into contact with the commutator. The brush assemblies are accommodated in compartments of the end cap. Each compartment has vents on an axially facing side thereof and openings in a transverse wall thereof. An air guide guides a part of the airflow generated by the fan exiting from at least one of the outlets of the housing to flow into the compartments via the openings and exit the compartments via the vents to cool the brushes.

Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.

Abstract: A fastener driving tool includes a flywheel rotated by a drive unit and having a wheel rim formed with teeth, an impact member having a mating toothed unit movable with a carrier frame to engage the teeth so as to be swept thereby to an end-stroke position to enable a striking rod to drive a fastener into a targeted workpiece, and an actuating unit configured to actuate the carrier frame to move from an upper position to a lower position in response to a triggering action of a trigger so as to move the mating toothed unit from an disengaging position to an engaging position.

Abstract: The disclosure provides a unit with a sound isolation/vibration isolation structure, an array employing the same, and a method for fabricating the same. The unit with a sound isolation/vibration isolation structure includes: a hollow frame surrounding an inside space; a film disposed within the inside space, vertically contacting an inside wall of the hollow frame; and a body mass disposed on a top surface of the film. Particularly, the horizontal area of the inside space is larger than the area of the top surface of the film.

Abstract: The invention is to provide an isolated transgenic mammalian neural cell, which comprises at least one heterologous vector expressing AhR/ARNT. Also provided is methods the detection of a sample containing a chemical substance damage to the nervous system and the selection of drugs for treating neurodegenerative disorders.

Abstract: A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.