Abstract: A signal processing method is provided and includes the following steps. A first synchronizing signal having a synchronizing frequency and a next expected pulse with an expected rising edge is provided. A second synchronizing signal having a selected frequency being within a frequency range is produced when the synchronizing frequency of the first synchronizing signal is out of a frequency range. A third synchronizing signal having a first pulse with a first rising edge is produced when the synchronizing frequency is within the frequency range, wherein the first rising edge is produced at an expected time point. Whether the next expected pulse appears in a period from the expected time point to a certain time point is detected as a detecting result. And a first falling edge of the first pulse is produced based on the detecting result. A picture-field flicker phenomenon of an LCD is eliminated through the method.

Abstract: A method of fabricating strained-silicon transistors includes providing a semiconductor substrate, in which the semiconductor substrate includes a gate, at least a spacer, and a source/drain region; performing a first rapid thermal annealing (RTA) process; removing the spacer and forming a high tensile stress film over the surface of the gate and the source/drain region; and performing a second rapid thermal annealing process.

Abstract: Rubbery polymers can be formed having the general formula: R1R2N—(CH2)n—X—CH2—CHR3R4 wherein R1 and R2 are independently selected from a group consisting of alkyls, cycloalkyls, alkenyls, cycloalkenyls, aryls, phenyls, heterocycles, acyls, and silanes, or R1 in combination with R2 forms a heterocyclic ring; n is an integer from 1 to 20; X is selected from a group consisting of sulfur, a phosphorus moiety, and a silicon moiety; R3 and R4 are one of hydrogen, alkyls, alkenyls, and at least one of which includes reactive unsaturation such as an alkenyl group. Moreover, this invention discloses a process of making functionalized rubbery polymers from the functionalized monomers.

Abstract: The invention discloses a method for fabricating a photoelectric device. A ceramic substrate is first provided, and then a first patterned electrode and a second patterned electrode are formed on and underneath the surface of the ceramic substrate. A plurality of photoelectric devices is sequentially connected to the first electrode layer with a wire solder or a eutectic joint method. The encapsulation materials cover the each photoelectric die to prevent damaged from the external force or environment. Cutting the ceramic substrate along the spaces between the photoelectric dies forms a plurality of independent package units.

Abstract: A package structure for light emitting diode devices comprises a substrate having a reflective cavity, a die mounted inside the reflective cavity, a reflective layer disposed on the surface of the reflective cavity, a plurality of electrodes disposed under the surface of the substrate which is opposite to the reflective cavity, and a dual brightness enhancement film overlaid on the reflective cavity. The dual brightness enhancement film efficiently reflects the polarized light that is generated from the die and is not in a transparent direction back to the reflective layer. Subsequently, this light is reflected from the reflective layer to the dual brightness enhancement film. The portions of the reflected light propagating in the same direction as the transparent direction will transmit through the package structure.

Abstract: A device and a method for reducing input noise providing at least a microcontroller. The microcontroller comprises: at least a noise reduction device, at least an analog switch and at least a signal output unit. The noise reduction device connected to the ground or a voltage is turned on to charge or discharge a stray capacitor existing on a turned off analog switch so that the amount of charge stored in the stray capacitor is zero or a specific value. Thereby, the noise in a touch switch is reduced and the cost of layout on the PCB is saved.

Abstract: This invention relates to a silica reinforced rubber composition containing an ionic compound and article having a component thereof. The invention particularly relates to an article such as a rubber tire having a component of such rubber composition. Said ionic compound is composed of a combination of an organic cation moiety and an organic or inorganic anion moiety. Said ionic compound is desirably an ionically conductive ionic compound. The invention particularly relates to improvement of one or more physical properties of a rubber composition by an inclusion of such ionic compound and/or providing a path of least electrical resistance for a electrically resistive component of an article such as a tire by an inclusion in the rubber composition of said component of an ionically conductive ionic compound composed of a combination of an organic cation moiety and an organic or inorganic anion moiety.

Abstract: An acetone extract, chloroform extract or hexane extract of Angelicae sinensis and/or the active components purified therefrom, such as n-butylidenephthalide, are administered alone or in combination with one or more chemotherapy drugs and are effective in treating cancers.

Abstract: A signal converter includes an interconnect interface, a FIFO set, which comprises a transmitter FIFO and a receiver FIFO respectively connected to the interconnect interface through a data bus, a parallel/serial converter connected to the transmitter FIFO and the receiver FIFO by two data buses respectively and kept apart from the FIFO set, and a serial I/O interface connected to the parallel/serial converter.

Abstract: A tilting angle measuring device includes an optical device, a four-quadrant optical detector and a computing unit. By the optical device, a light beam emitted by the coherent light source is processed into a reference beam and a test beam. The four-quadrant optical detector has four photoelectric converting units arranged in an array for respectively receiving the reference and test beams. The computing unit is electrically connected to the four-quadrant optical detector for computing a tilting angle of the object with respect to a predetermined position according to four intensity values of the test beam.

Abstract: A foldable bicycle has a rear frame, a folding assembly and a front frame. The rear frame has a seat tube, a bottom bracket, a rear fork and a rear wheel. The folding assembly is connected to the rear frame and has a supporting device, a rotating jacket and a locking device. The supporting device is connected to the bottom bracket and has a mounting bracket and a supporting element. The mounting bracket is connected to the bottom bracket. The connecting tube is pivotally connected to the mounting bracket. The extending tube is connected to the connecting tube. The rotating jacket is rotatably mounted around the extending tube. The locking device is connected to the rotating jacket and the seat tube of the rear frame. The front frame is connected to the folding assembly and has a top tube, a head tube, a front fork and a front wheel.

Abstract: A package structure for photoelectronic devices comprises a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and a second surface, wherein the first surface is opposed to the second surface. The first surface has a reflective opening, and the second surface has at least two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recesses. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the surface of the second insulating layer. The second conductive layer is disposed on the surface of the second surface and inside the electrode via holes.

Abstract: A package structure of a light-emitting diode (LED) comprises a package carrier, an LED die mounted and electrically connected to the package carrier, a molding compound covering the package carrier and the LED die, and two electrodes disposed on opposite end portions of the molding component. A reflecting layer is overlaid on two side surfaces of the molding component facing the LED die, respectively. Thus, the rays emitted by the LED die are reflected by the reflecting layer and directed above the circuit surface of the LED die. Afterward, they pass through the molding compound to access the outside of the LED package. Each electrode has at least two surfaces vertical to each other, and is respectively electrically connected to a P-electrode and an N-electrode of the LED die.

Abstract: A motor driven rotating device is disclosed that includes a fixed base, an eccentric rotating mechanism above the base, first magnets in the base, and second magnets in the rotating mechanism. A polarity of each first magnet is opposite to that of each second magnet so as to maintain a gap between the base and the rotating mechanism. Also, the rotating mechanism is adapted to eccentrically rotate.

Abstract: An electret and composite formed therewith. The electret includes a polymer, copolymerizing from monomers including VdF as a first monomer and HFP, CTFE, TFE, or combinations thereof as a second monomer.

Abstract: An encoding system for a data set, particularly for a video data set is disclosed in the present invention. The encoding system includes a coding strategies represented as a tree-based structure, a cost projection system for each tree node, and a parameter searching algorithm for coding strategies to encode a data set. When the encoder parameters are obtained, the coding strategies and rate-allocation have better performance comparing to the related art.

Abstract: A method for fabricating a semiconductor device is provided. First, a substrate is provided, and a first-type MOS (metallic oxide semiconductor) transistor, an input/output (I/O) second-type MOS transistor, and a core second-type MOS transistor are formed on the substrate. Then, a first stress layer is formed to overlay the substrate, the first-type MOS transistor, the I/O second-type MOS transistor, and the core second-type MOS transistor. Then, at least the first stress layer on the core second-type MOS transistor is removed to reserve at least the first stress layer on the first-type MOS transistor. Finally, a second stress layer is formed on the core second-type MOS transistor.

Abstract: Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

Abstract: A method for manufacturing CMOS transistors includes an etching back process alternatively performed after the gate structure formation, the lightly doped drain formation, source/drain implantation, or SEG process to etch a hard mask layer covering and protecting a first type gate structure, and to reduce thickness deviation between the hard masks covering the first type gate structure and a second type gate structure. Therefore the damage to spacers, STIs, and the profile of the gate structures due to the thickness deviation is prevented.

Abstract: A package structure of a compound semiconductor device comprises a thin conductive film with a pattern, a die, at least one metal wire or metal bump and a transparent encapsulation material. The die is mounted on the first surface of the thin conductive film, and is electrically connected to the thin conductive film through the metal wire or the metal bump. The transparent encapsulation material is overlaid on the first surface of the conductive film and the die. A second surface of the conductive film is not covered by the transparent encapsulation material, and is opposite the first surface.