Patents by Inventor Wen-An LIN

Wen-An LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Display Screen Module and Display Screen
    Publication number: 20200135083
    Abstract: Present disclosure discloses a display screen module and a display screen, which includes a front panel, a rear panel and a circuit module. The circuit module includes a driving device, a plurality of display assemblies and a substrate located between the front panel and the rear panel. The substrate includes a first mounting plate and second mounting plate which are integrated. The second mounting plate is formed by extension from one end of the first mounting plate along a horizontal direction. Each of the plurality of display assemblies includes a plurality of lamp beads provided at intervals on the substrate along an extension direction of the second mounting plate and facing the front panel. The driving device is arranged on the first mounting plate and partially protrudes from the rear panel. A size of the driving device is less than or equal to a size of the first mounting plate.
    Type: Application
    Filed: October 24, 2019
    Publication date: April 30, 2020
    Inventors: Shenghe WANG, Wen LIN, Zhenlong LI, Dacheng AN, Guoshi YANG, Azhen CHU, Wei LIU, Xiaohong Zou, Junfeng YANG
  • Composition and solution for temporary bonding
    Patent number: 10633569
    Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: April 28, 2020
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Hsiu-Ming Chang, Tsung-Tai Hung, Li-Jung Hsiao, Po-Wen Lin
  • HUMAN-COMPUTER INTERACTIVE REHABILITATION SYSTEM
    Publication number: 20200121247
    Abstract: The present invention provides a human-computer interactive rehabilitation system, which can automatically calculate rehabilitation strength suitable for the patient, so that it is not necessary to manually evaluate and adjust the parameter settings in human-computer interactive rehabilitation system when different patients use it. At the same time, the human-machine interactive rehabilitation system and the hospital end can track the rehabilitation status and intervene through the data platform at any time. The platform establishes a cloud community feedback and encouragement mechanism, and immediately transmits the rehabilitation results to the designated barriers of the patients, provides patient encouragement feedback, and strengthens the community interaction and linkage in the medical relationship.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 23, 2020
    Inventors: Chien-Wen Lin, Chia-Hsiang Lee, Yu-Jen Chen, Jui-Yun Hung
  • CONFIGURING TARGETED DISTRIBUTION OF TRAFFIC
    Publication number: 20200127917
    Abstract: A device may determine a link aggregation group (LAG) that aggregates links that includes a first group of links that connects the device to a first provider edge (PE) device and a second group of links that connects the device to the second PE device, where the first PE device and the second PE device are on an Ethernet virtual private network (EVPN) and are multi-homed PE devices for the device, and where the first PE device provides a local connection to a customer edge (CE) device for the device. The device may receive a message from the first PE device indicating that the first PE device lacks a connection with the EVPN, and may send, based on the message, traffic intended for the CE device via the first PE device and traffic intended for the EVPN via the second PE device and not the first PE device.
    Type: Application
    Filed: October 22, 2018
    Publication date: April 23, 2020
    Inventors: Wen Lin, Sharmila Koppula, Soumyodeep Joarder
  • MANUFACTURING METHOD OF PACKAGE STRUCTURE
    Publication number: 20200126815
    Abstract: A manufacturing method of a package structure is described. The method includes at least the following steps. A carrier is provided. A semiconductor die and a sacrificial structure are disposed on the carrier. The semiconductor die is electrically connected to the bonding pads on the sacrificial structure through a plurality of conductive wires. As encapsulant is formed on the carrier to encapsulate the semiconductor die, the sacrificial structure and the conductive wires. The carrier is debonded, and at least a portion of the sacrificial structure is removed through a thinning process. A redistribution layer is formed on the semiconductor die and the encapsulant. The redistribution layer is electrically connected to the semiconductor die through the conductive wires.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 23, 2020
    Applicant: Powertech Technology Inc.
    Inventors: Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien, Nan-Chun Lin
  • Optical lens system
    Patent number: 10627599
    Abstract: An optical lens of the present disclosure assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, an optical filter and a sensor. The optical lens also has an axis. The first lens element and the fifth lens element have negative power, the second lens element, the third lens element, the fourth lens element and the sixth lens element have positive power.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: April 21, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chia-Wen Lin
  • Aliasing behavior for traffic to multihomed sites in ethernet virtual private network (EVPN) networks
    Patent number: 10630509
    Abstract: For use in an Ethernet Virtual Private Network (EVPN) in which a site including at least one MAC-addressable device is multihomed, via a customer edge device (CE), to at least two provider edge devices (PE1 and PE2), the potential problem of one of the at least two provider edge devices (PE2) dropping or flooding packets designed for a MAC-addressable device of the multihomed site is solved by controlling advertisements of an auto-discovery per EVPN instance (A-D/EVI) route (or an auto-discovery per Ethernet segment identifier (A-D/ESI) route) to a remote provider edge device (PE3), belonging to the EVPN but not directly connected with the CE.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: April 21, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Ryan Bickhart, Wen Lin
  • SELF-POWERED SHEET
    Publication number: 20200114143
    Abstract: The disclosure provides a self-powered sheet which is configured to absorb and to be applied on a human skin. The self-powered sheet includes a base layer and a plurality of electrically conductive inks. The base layer is configured to absorb the liquid and adapted to be applied on the human skin. The base layer has a contact surface. The electrically conductive inks are disposed on the contact surface of the base layer. Each of the electrically conductive inks has a plurality of first electrodes and a plurality of second electrodes. When each of the first electrodes and each of the second electrodes are soaked in the liquid, an electrical potential difference between one of the plurality of first electrodes and one of the plurality of second electrodes generate a current in the human skin.
    Type: Application
    Filed: October 12, 2018
    Publication date: April 16, 2020
    Applicant: CYMMETRIK ENTERPRISE CO.,LTD.
    Inventors: Wen-An LIN, Che-Ling CHANG
  • SUB-PIXEL RENDERING DATA CONVERSION APPARATUS AND METHOD
    Publication number: 20200118501
    Abstract: A sub-pixel rendering data conversion apparatus including an inverse sub-pixel rendering circuit and a sub-pixel rendering circuit is provided. The inverse sub-pixel rendering circuit receives the first sub-pixel rendering data converted from the first true image data and converting the first sub-pixel rendering data to the second true image data, and the first sub-pixel rendering data includes data of the first sub-pixel rendering arrangement. The sub-pixel rendering circuit converts the second true image data to the second sub-pixel rendering data and outputs the second sub-pixel rendering data to a display panel, the second sub-pixel rendering data includes data of the second sub-pixel rendering arrangement, and the display panel includes a plurality of sub-pixels arranged in the manner of the second sub-pixel rendering arrangement.
    Type: Application
    Filed: October 12, 2018
    Publication date: April 16, 2020
    Applicant: Novatek Microelectronics Corp.
    Inventors: Shang-Yu Su, Cheng-Wen Lin, Feng-Ting Pai
  • Sub-pixel rendering data conversion apparatus and method
    Patent number: 10621932
    Abstract: A sub-pixel rendering data conversion apparatus including an inverse sub-pixel rendering circuit and a sub-pixel rendering circuit is provided. The inverse sub-pixel rendering circuit receives the first sub-pixel rendering data converted from the first true image data and converting the first sub-pixel rendering data to the second true image data, and the first sub-pixel rendering data includes data of the first sub-pixel rendering arrangement. The sub-pixel rendering circuit converts the second true image data to the second sub-pixel rendering data and outputs the second sub-pixel rendering data to a display panel, the second sub-pixel rendering data includes data of the second sub-pixel rendering arrangement, and the display panel includes a plurality of sub-pixels arranged in the manner of the second sub-pixel rendering arrangement.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: April 14, 2020
    Assignee: Novatek Microelectronics Corp.
    Inventors: Shang-Yu Su, Cheng-Wen Lin, Feng-Ting Pai
  • Projector, heat dissipation module and heat dissipation fin
    Patent number: 10620516
    Abstract: A projector includes a casing, an optical engine module and a heat dissipation module. The optical engine module disposed in the casing includes a light source, a light valve and a projection lens. The heat dissipation module disposed in the casing includes at least two heat pipes and a heat dissipation fin set. The heat dissipation fin set includes at least a heat dissipation fin and at least a turbulent structure. The heat dissipation fin has a surface including a heat pipe arrangement region and a turbulent region adjacent to each other. The at least one heat pipe passes through the heat pipe arrangement region, and an air flowing section is formed near the at least one heat pipe. The turbulent region has a turbulent section corresponding to the air flowing section, and the turbulent structure is disposed in the turbulent region and extends continuously in the turbulent section.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: April 14, 2020
    Assignee: Coretronic Corporation
    Inventors: Pei-Rong Wu, Shi-Wen Lin, Wen-Yen Chung, Tsung-Ching Lin
  • THERMAL MODULE AND PROJECTOR
    Publication number: 20200109849
    Abstract: A thermal module and a projector using the same are provided. The thermal module comprises a heat sink and a base. The heat sink comprises a bottom, a plurality of fins, a cover, and a plurality of side walls. The fins are disposed on the bottom, and each of the fins comprises a reference plane and a plurality of protrusions, wherein adjacent two of the protrusions are convex toward opposite directions with respect to the reference plane, and rows of through holes are formed by adjacent two protrusions along a flowing direction. The cover is disposed on the fins. The side walls are disposed between the bottom and the cover and surrounding the fins, wherein a liquid is capable of flowing through the heat sink by entering the inlet and exiting by the outlet of the side walls or the cover. The bottom of the heat sink is disposed on the base.
    Type: Application
    Filed: October 3, 2018
    Publication date: April 9, 2020
    Applicant: Coretronic Corporation
    Inventors: Shi-Wen Lin, Tsung-Ching Lin, Wei-Chi Liu
  • METHOD FOR MANUFACTURING A CHIP PACKAGE
    Publication number: 20200105714
    Abstract: A method for manufacturing chip package is disclosed. The method includes providing a wafer having an upper surface and a lower surface opposite thereto, in which the wafer comprises a plurality of conductive pads disposed on the upper surface; dicing the upper surface of the wafer to form a plurality of trenches; forming a patterned photoresist layer on the upper surface and in the trenches; forming a plurality of conductive bumps disposed correspondingly on the conductive pads; thinning the wafer from the lower surface toward the upper surface, such that the patterned photoresist layer in the trenches is exposed from the lower surface; forming an insulating layer under the lower surface; and dicing the patterned photoresist layer and the insulating layer along each trench to form a plurality of chip packages.
    Type: Application
    Filed: May 7, 2019
    Publication date: April 2, 2020
    Inventors: Chien-Chih LAI, Hung-Wen LIN
  • METHOD FOR MANUFACTURING CHIP PACKAGES
    Publication number: 20200105601
    Abstract: A method for manufacturing chip package includes the steps below. A wafer having an upper surface and a lower surface opposite thereto is provided, in which conductive bumps are disposed on the upper surface. The upper surface of the wafer is diced to form trenches. A first insulation layer exposing the conductive bumps is formed on the upper surface and in the trenches. A surface treatment layer is formed on the conductive bumps, and a top surface of the surface treatment layer is higher than that of the first insulation layer. The wafer is thinned from the lower surface toward the upper surface to expose the first insulation layer in the trenches. A second insulation layer is formed below the lower surface. The first and second insulation layers are diced along a center of each trench to form chip packages.
    Type: Application
    Filed: April 30, 2019
    Publication date: April 2, 2020
    Inventors: Chien-Chih LAI, Hung-Wen LIN
  • Generating executable files through compiler optimization
    Patent number: 10599406
    Abstract: Embodiments of the present invention may track a user's interaction trajectory associated with a problem occurred on a website. According to an embodiment of the present invention, a first symbol of a first definition associated with a first object file is obtained. Then, in response to the first symbol matching a second symbol of a second definition associated with a second object file, the first object file is optimized based on a first segment associated with the first definition in the first object file and an optimization to the second object file is skipped. Next, an executable file is generated based on the optimized first object file and the second object file.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: March 24, 2020
    Assignee: International Business Machines Corporation
    Inventors: Jin Song Ji, Ke Wen Lin, Zhao Wu, Qing S. Zhang
  • Object detection and tracking method and system for a video
    Patent number: 10600190
    Abstract: An object detection and tracking method and system are provided. The object detection and tracking method includes the following steps: (i) selecting one of a plurality of frames of a video as a current frame, (ii) searching in an object tracker searching area of the current frame to generate a current object tracker, (iii) searching in each auxiliary tracker searching area of the current frame to individually generate a current auxiliary tracker, (iv) when the current object tracker is located at a block different from the blocks located by the generated object trackers, generating a new auxiliary tracker at the central position of the current frame, and (v) repeating the above steps until all the frames have been processed.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: March 24, 2020
    Assignee: Institute For Information Industry
    Inventors: Bo-Chih Chen, Ching-Wen Lin
  • PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    Publication number: 20200091039
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first interconnect structure formed over a first substrate, and the first interconnect structure includes a first metal layer. The package structure further includes a second interconnect structure formed over a second substrate. The package structure includes a bonding structure between the first interconnect structure and the second interconnect structure. The bonding structure includes a first intermetallic compound (IMC) and a second intermetallic compound (IMC), a portion of the first IMC protrudes from the sidewall surfaces of the second IMC, and there could be a grain boundary between the first IMC and the second IMC.
    Type: Application
    Filed: April 3, 2019
    Publication date: March 19, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Liang SHAO, Wen-Lin SHIH, Su-Chun YANG, Chih-Hang TUNG, Chen-Hua YU
  • Combination therapy
    Patent number: 10588901
    Abstract: Described herein are compounds and compositions for treating glaucoma and/or reducing intraocular pressure. Compositions may comprise an isoquinoline compound and a prostaglandin or a prostaglandin analog. Compounds described herein include those in which an isoquinoline compound is covalently linked to a prostaglandin or a prostaglandin analog, and those in which an isoquinoline compound and a prostaglandin free acid together form a salt.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: March 17, 2020
    Assignee: Aerie Pharmaceuticals, Inc.
    Inventors: Casey Kopczynski, Cheng-Wen Lin, Jill Marie Sturdivant, Mitchell A. deLong
  • Automatic wall adhesion and cleaning system
    Patent number: 10590667
    Abstract: An automatic wall adhesion and cleaning system includes a cleaning mechanism for cleaning the outer wall of a building, and a vacuum-based wall adhesion mechanism adherable to the outer wall of the building by a vacuum suction force and adapted for carrying and moving the cleaning mechanism on the outer wall of the building. Thus, the automatic wall adhesion and cleaning system can save labor cost and eliminate the risk of human life due to rupture of the ropes of a hanging cage.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: March 17, 2020
    Inventor: Yi-Wen Lin
  • Charge Service Method and Charge Service System Capable of Providing Optimal Service Configurations
    Publication number: 20200083734
    Abstract: A charging service method includes transmitting information of a communication device to a charging station, transmitting information of the charging station to the communication device, acquiring available service information of the charging station from a charging station server according to the information of the charging station, selecting at least one service option for generating charging service information, transmitting the charging service information to the charging station server, generating charging station certification information to the communication device, relaying the charging station certification information from the communication device to the charging station, and enabling a charging function of the charging station to charge the communication device after the charging station certification information is received by the charging station.
    Type: Application
    Filed: January 10, 2019
    Publication date: March 12, 2020
    Inventors: Chun-Wen Lin, Ming-Hsun Sung