Patents by Inventor Wen-An LIN

Wen-An LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200322183
    Abstract: Techniques are disclosed for an Ethernet Virtual Private Network (EVPN) Virtual Private Wire Service (VPWS) network with service interface-aware forwarding. In one example, a first network device signals to a second network device, using EVPN route advertisements, a multi-service service tunnel to transport network packets for a plurality of services. The services are identifiable by virtual local area network (VLAN) identifiers in the packets. The first network device is configured with a single transport interface for the service tunnel and the single transport interface is configured with respective service interfaces for the services. The first network device detects failure of a failed service interface of the service interfaces and outputs, in response to the failure, an EVPN route withdrawal message for the service tunnel that identifies the service corresponding to the failed service interface.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Wen Lin, Pankaj Kumar Gupta, Babu Singarayan, Sharmila Koppula, Manish Gupta, Kapil Arora
  • Publication number: 20200317602
    Abstract: The present invention discloses a novel 3-aryl-2-propen-1-one series derivative and the synthesis processes thereof. Besides, the present invention also discloses the series derivative as a pharmaceutical composition and their use for promoting myocardial regeneration.
    Type: Application
    Filed: April 8, 2019
    Publication date: October 8, 2020
    Applicant: GENHEALTH PHARMA CO., LTD.
    Inventors: Lain-Tze LEE, Hui-Ping TSAI, Shu-Fen HUANG, Yi-Wen LIN, Pi-Tsan HUANG, Ying-Ying WU, Mei-Hui CHEN, Li-Jie HSU
  • Patent number: 10796931
    Abstract: A manufacturing method of a package structure is described. The method includes at least the following steps. A carrier is provided. A semiconductor die and a sacrificial structure are disposed on the carrier. The semiconductor die is electrically connected to the bonding pads on the sacrificial structure through a plurality of conductive wires. As encapsulant is formed on the carrier to encapsulate the semiconductor die, the sacrificial structure and the conductive wires. The carrier is debonded, and at least a portion of the sacrificial structure is removed through a thinning process. A redistribution layer is formed on the semiconductor die and the encapsulant. The redistribution layer is electrically connected to the semiconductor die through the conductive wires.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: October 6, 2020
    Assignee: Powertech Technology Inc.
    Inventors: Han-Wen Lin, Hung-Hsin Hsu, Shang-Yu Chang Chien, Nan-Chun Lin
  • Patent number: 10793225
    Abstract: A wireless communication method adapted to an electrical gear-shifting system of bicycle comprises: establishing a first communication connection to an intermediate device by a master controller; establishing a second communication connection to the intermediate device by a slave controller, sending a control signal to the intermediate device through the first communication connection by the master controller, sending the control signal to the slave controller through the second communication connection by the intermediate device, wherein the slave controller controls a motor driver to perform a gear-shifting operation according to the control signal.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: October 6, 2020
    Assignee: TEKTRO TECHNOLOGY CORPORATION
    Inventors: Pao-Wen Lin, Hsun-Yu Chuang
  • Patent number: 10794872
    Abstract: A system and method for determining clearance between a fabrication tool and a workpiece is provided. In an exemplary embodiment, the method includes receiving a substrate within a tool such that a gap is defined there between. A transducer disposed on a bottom surface of the substrate opposite the gap provides an acoustic signal that is conducted through the substrate. The transducer also receives a first echo from a top surface of the substrate that defines the gap and a second echo from a bottom surface of the tool that further defines the gap. A width of the gap is measured based on the first echo and the second echo. In some embodiments, the bottom surface of the tool is a bottom surface of a nozzle, and the nozzle provides a liquid or a gas in the gap while the transducer is receiving the first and second echoes.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: October 6, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jun-Hao Deng, Kuan-Wen Lin, Sheng-Chi Chin, Yu-Ching Lee
  • Publication number: 20200310234
    Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Applicant: Coretronic Corporation
    Inventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin
  • Publication number: 20200306182
    Abstract: Provided herein are pharmaceutical compositions, intravitreal implants and particle suspensions comprising a polymer matrix and at lest one therapeutic agent that is released in a substantially linear manner for a particular duration.
    Type: Application
    Filed: March 5, 2020
    Publication date: October 1, 2020
    Inventors: Sanjib Kumar Das, Cheng-Wen Lin
  • Patent number: 10777461
    Abstract: A method of manufacturing chip package is disclosed. The method includes steps of providing a wafer with an upper surface and a lower surface opposite thereto, in which a plurality of conductive pads are disposed on the upper surface; forming a plurality of conductive bumps on the corresponding conductive pads; thinning the wafer from the lower surface towards the upper surface; forming an insulating layer under the lower surface; etching the upper surface of the wafer to form a plurality of trenches exposing the insulating layer; forming a passivation layer covering an inner wall of each of the trenches; and dicing the passivation layer and the insulating layer along each of the trenches to form a plurality of chip packages.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 15, 2020
    Assignee: COMCHIP TECHNOLOGY CO., LTD.
    Inventors: Chien-Chih Lai, Hung-Wen Lin
  • Publication number: 20200287780
    Abstract: Techniques are described for avoiding traffic black-holing in a multi-homed Ethernet virtual private networks (EVPNs) in which a customer device (CE) is multi-homed to a plurality of multi-homing provider edge devices (PEs) via respective links of an Ethernet segment. An overlay network is created over the Ethernet segment, and the multi-homing PEs of the EVPN are configured with a common anycast IP address for respective virtual network interfaces. Upon election as active designated forwarder (DF) for the EVPN, the DF PE of the multi-homing PEs advertises toward the customer network an IGP metric for the anycast IP address that is lower than the IGP metric(s) advertised by any of the non-DF standby PE routers segment to direct the CE to forward network packets from the customer network to the DF PE over the respective link of the Ethernet segment.
    Type: Application
    Filed: May 22, 2020
    Publication date: September 10, 2020
    Inventors: Tapraj Singh, Wen Lin, SelvaKumar Sivaraj, Rukesh Dorai, Sunesh Rustagi
  • Patent number: 10769811
    Abstract: A space coordinate converting server and method thereof are provided. The space coordinate converting server receives a field video recorded with a 3D object from an image capturing device, and generates a point cloud model accordingly. The space coordinate converting server determines key frames of the field video, and maps the point cloud model to key images of the key frames based on rotation and translation information of the image capturing device for generating a characterized 3D coordinate set. The space coordinate converting server determines 2D coordinates of the 3D object in key images, and selects 3D coordinates from the characterized 3D coordinate set according to the 2D coordinates. The space coordinate converting server determines a space coordinate converting relation according to marked points of the 3D object and the 3D coordinates.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 8, 2020
    Assignee: Institute For Information Industry
    Inventors: Jia-Wei Hong, Shih-Kai Huang, Ming-Fang Weng, Ching-Wen Lin
  • Patent number: 10768670
    Abstract: A control method is provided. The control method is applied to an electronic device. The control method includes the following steps: detecting a virtual screen signal; allocating a virtual screen image buffer module for temporarily storing virtual screen image information according to the virtual screen signal; integrating the virtual screen image information and second screen image information into an integrated image data stream by a direct mode; outputting a first screen image data stream to a first screen of an electronic device, so that the first screen displays a first image according to the first screen image data stream; and outputting the integrated image data stream to a second screen of the electronic device, so that the second screen displays a second image according to the integrated image data stream.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: September 8, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Che-Min Lin, Chin-Wen Lin
  • Publication number: 20200276179
    Abstract: Described herein are compounds and compositions for treating glaucoma and/or reducing intraocular pressure. Compositions may comprise an isoquinoline compound and a prostaglandin or a prostaglandin analog. Compounds described herein include those in which an isoquinoline compound is covalently linked to a prostaglandin or a prostaglandin analog, and those in which an isoquinoline compound and a prostaglandin free acid together form a salt.
    Type: Application
    Filed: February 3, 2020
    Publication date: September 3, 2020
    Inventors: Casey Kopczynski, Cheng-Wen Lin, Jill Marie Sturdivant, Mitchell A. deLong
  • Publication number: 20200279790
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Application
    Filed: May 14, 2020
    Publication date: September 3, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Patent number: 10761653
    Abstract: A display panel able to receive full fingerprint impressions in a display area together with command touches, in addition to showing images, includes a substrate, scan lines, data lines, touch scan lines, touch lines, sub-pixels, and fingerprint sensing units. A method for driving such multifunctional touch display panel is also provided.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 1, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Fu Weng, Chien-Wen Lin, Chia-Lin Liu
  • Publication number: 20200272458
    Abstract: Embodiments include a method, a cognitive software porting assistant system, and a computer program product for operating a cognitive software porting assistant system. Embodiments include analyzing code to identify strings of the code, tokenizing the strings of the code into tokens, and identifying a first set of tokens and a second set of tokens from the tokens, wherein the first set of tokens corresponds to a first platform and the second set of tokens corresponds to the second platform. Embodiments also include generating a first syntax tree for the first set of tokens and a second syntax tree for the second set of tokens, and serializing the first syntax tree and the second syntax tree. Embodiments include comparing the first serialized syntax tree with the second serialized syntax tree, and saving a mapping of the first serialized syntax tree and second serialized syntax tree responsive to the comparison.
    Type: Application
    Filed: February 25, 2019
    Publication date: August 27, 2020
    Inventors: Xiao Feng Guan, Ke Wen Lin, Yuxuan Zhang
  • Patent number: 10748940
    Abstract: A TFT substrate for a touch display panel of reduced thickness defines a display area and a surrounding non-display area. The TFT substrate includes a first conductive layer on the substrate and a second conductive layer on the first conductive layer. In the display area, the first conductive layer includes data lines and the second conductive layer includes common electrodes. Each common electrode extends as a strip along a first direction. Each data line extends along a second direction. The first direction intersects the second direction. Each data line crosses the common electrodes. Each data line functions as a touch driving electrode and each common electrode functions as a touch sensing electrode.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: August 18, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chia-Lin Liu, Yu-Fu Weng, Chien-Wen Lin, Tzu-Yu Cheng
  • Patent number: 10742542
    Abstract: A device may determine a link aggregation group (LAG) that aggregates links that includes a first group of links that connects the device to a first provider edge (PE) device and a second group of links that connects the device to the second PE device, where the first PE device and the second PE device are on an Ethernet virtual private network (EVPN) and are multi-homed PE devices for the device, and where the first PE device provides a local connection to a customer edge (CE) device for the device. The device may receive a message from the first PE device indicating that the first PE device lacks a connection with the EVPN, and may send, based on the message, traffic intended for the CE device via the first PE device and traffic intended for the EVPN via the second PE device and not the first PE device.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: August 11, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Wen Lin, Sharmila Koppula, Soumyodeep Joarder
  • Patent number: 10741642
    Abstract: Embodiments of mechanisms for forming dislocations in source and drain regions of finFET devices are provided. The mechanisms involve recessing fins and removing the dielectric material in the isolation structures neighboring fins to increase epitaxial regions for dislocation formation. The mechanisms also involve performing a pre-amorphous implantation (PAI) process either before or after the epitaxial growth in the recessed source and drain regions. An anneal process after the PAI process enables consistent growth of the dislocations in the source and drain regions. The dislocations in the source and drain regions (or stressor regions) can form consistently to produce targeted strain in the source and drain regions to improve carrier mobility and device performance for NMOS devices.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun Hsiung Tsai, Wei-Yuan Lu, Chien-Tai Chan, Wei-Yang Lee, Da-Wen Lin
  • Patent number: 10732757
    Abstract: A self-luminescence display apparatus capable of detecting pressure of touches applied by a user, the apparatus includes a display panel having a plurality of conductive layers and a supporting frame. One of the conductive layers cooperates with the supporting frame to form a plurality of force sensing capacitors. When a touch is applied, the display panel deforms according to pressure applied, which cause the capacitances of the force sensing capacitors to alter. The change in capacitance value, corresponding to a position where the touch operation is applied, can be calculated.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: August 4, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chien-Wen Lin, Yu-Fu Weng, Chia-Lin Liu
  • Patent number: D894851
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: September 1, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Tzu-Hsiang Wang, Chi-Chih Pu, Ya-Wen Lin