Patents by Inventor Wen Chen

Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210104376
    Abstract: A device for providing electrons and its method of making. The device includes an optical fiber with a tip and a metallic arrangement arranged at the tip. The metallic arrangement is arranged to be excited by an energy source to emit electrons or electron beams.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 8, 2021
    Inventors: Fu-Rong Chen, Kai-Wen Wu, Ying-Shuo Tseng, Pei-En Li, Yu-Chun Hsueh
  • Publication number: 20210105045
    Abstract: A communication device includes a dielectric substrate, a first coil antenna, a second coil antenna, and a switch circuit. The first coil antenna has a hollow region. The second coil antenna is disposed inside the hollow region of the first coil antenna. The dielectric substrate is configured to carry the first coil antenna and the second coil antenna. The switch circuit selectively enables at least one of the first coil antenna and the second coil antenna according to a power signal.
    Type: Application
    Filed: January 9, 2020
    Publication date: April 8, 2021
    Inventors: Ching-Wen CHEN, Chung-Che LIEN, Meng-Kai WU
  • Publication number: 20210103861
    Abstract: The disclosed embodiments provide a system for performing dynamic job bidding optimization. During operation, the system obtains historical data containing a time series of interactions with a job. Next, the system uses the historical data to calculate an initial price of a job based on a predicted number of interactions with the job. The system then determines a first dynamic adjustment to the initial price that improves utilization of a budget for the job and a second dynamic adjustment to the initial price that improves a performance of the job. Finally, the system applies the first and second adjustments to the initial price to produce an updated price for the job and delivers the job within an online system based on the updated price.
    Type: Application
    Filed: December 18, 2020
    Publication date: April 8, 2021
    Inventors: Keqing Liang, Wen Pu, Sahin Cem Geyik, Yu Wang, Ying Chen, Yin Zhang, Sumedha K. Swamy
  • Publication number: 20210104602
    Abstract: A semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device includes an insulating layer, a semiconductor layer, a plurality of isolation structures, a transistor, a first contact, a plurality of silicide layers, and a protective layer. The semiconductor layer is disposed on a front side of the insulating layer. The plurality of isolation structures are disposed in the semiconductor layer. The transistor is disposed on the semiconductor layer. The first contact is disposed beside the transistor and passes through one of the plurality of isolation structures and the insulating layer therebelow. The plurality of silicide layers are respectively disposed on a bottom surface of the first contact and disposed on a source, a drain, and a gate of the transistor. The protective layer is disposed between the first contact and the insulating layer.
    Type: Application
    Filed: December 16, 2020
    Publication date: April 8, 2021
    Applicant: United Microelectronics Corp.
    Inventors: Wen-Shen Li, Ching-Yang Wen, Purakh Raj Verma, Xingxing Chen, Chee-Hau Ng
  • Publication number: 20210103421
    Abstract: An immersive multimedia system, an immersive interactive method and a movable interactive unit are provided in the disclosure. The immersive multimedia system includes multiple movable interactive units, an imaging apparatus, and a computer device. The multiple movable interactive units are disposed on at least one of the wall and the ground. The imaging apparatus is adapted to display an image screen on at least one of the wall and the ground. The computer device is connected to the multiple movable interactive units and the imaging apparatus. The computer device is adapted to control the multiple movable interactive units and the imaging apparatus. The multiple movable interactive units each include a touch sensing unit, and the image screen provided by the imaging apparatus changes in response to the touch sensing unit of at least one of the multiple movable interactive units sensing being touched.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 8, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Yao-Lin Chang, Ching-Tai Chang, Chien-Chu Chen, Jui-Min Huang, Cheng-Ya Chi, Ken-Ping Lin, Han-Hsuan Tsai, Chih-Wen Chiang
  • Publication number: 20210104769
    Abstract: A storage module of distributed flow battery is provided. An electrochemical reaction is processed with the positive and negative electrolytes to produce and/or discharge direct current and further output the positive and negative electrolytes after the reaction. The module comprises two end plates; two frames disposed between the two end plates; two current collectors disposed between the two frames; two complex cast polar plates disposed between the two current collectors; two electrodes disposed between the two complex cast polar plates; a membrane disposed between the two electrodes; and three gaskets. Therein, two of the gaskets are set to sandwich and enclose one of the two complex cast polar plates; and the other one of the gaskets is set between the other one of the two complex cast polar plates and an adjacent one of the current collectors.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 8, 2021
    Inventors: Ning-Yih Hsu, Chien-Hong Lin, Han-Wen Chou, Chin-Lung Hsieh, Yi-Hsin Hu, Yu-De Zhuang, Yun-Shan Tsai, Qiao-ya Chen
  • Patent number: 10971759
    Abstract: The present disclosure provides a device for battery formation, which comprises a base plate, a press plate, a positioning block and a connecting assembly. The press plate is connected with the base plate, the positioning block and the connecting assembly each are provided as plurality in number and the plurality of the connecting assemblies correspond to the plurality of positioning blocks. The positioning block has a main portion and a protruding portion, the main portion is provided between the base plate and the press plate, and the protruding portion extends from a surface of the main portion away from the press plate. The base plate is provided with a plurality of positioning holes, and the protruding portion of each positioning block is inserted into the positioning hole. Each connecting assembly is provided to the main portion of a corresponding positioning block and used for being connected to a battery.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: April 6, 2021
    Assignees: JIANGSU CONTEMPORARY AMPEREX TECHNOLOGY, CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Wen Yu, Jian Chen, Jing Yang, Hua Zhang, Lin Chen
  • Patent number: 10969559
    Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket on the circuit board has the image sensor. The optical filter on the mounting bracket is above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board by a frame of adhesive. The surface of the mounting bracket facing away from the circuit board has positioning posts at corners of the surface of the mounting bracket. A surface of the lens unit connected to the mounting bracket has receiving grooves positioned at corners of the surface of the lens unit. The positioning posts are inserted into the receiving grooves.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: April 6, 2021
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
    Inventors: Kun Li, Shin-Wen Chen, Ke-Hua Fan, Long-Fei Zhang
  • Patent number: 10971386
    Abstract: A method for positioning a mobile device relative to a stationary device in a semiconductor manufacturing environment is disclosed. The method includes detecting a target affixed to the stationary device at a target location, wherein the target location corresponds to a location of the target relative to a reference point on the stationary device, determining a first position coordinate offset value based upon detecting the target, and moving the mobile device, using the first position coordinate offset value, relative to train the mobile device to move relative to the stationary device for the stationary device to performing a semiconductor manufacturing operation.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Yan-Han Chen, Cheng-Kang Hu, Ren-Hau Wu, Cheng-Hung Chen, Feng-Kuang Wu, Hsu-Shui Liu, Jiun-Rong Pai, Shou-Wen Kuo
  • Patent number: 10969837
    Abstract: A loop thermosiphon (LTS) heat sink includes an evaporator, a condenser, a gas conduit, and a liquid conduit. The evaporator includes a first surface, a second surface opposite to the first surface, and a third surface coupled between the first surface and the second surface. Each of the first surface and the second surface is configured to mount a heat generating component. One end of the gas conduit is coupled to one end of the liquid conduit, and another end of the gas conduit and another end of the liquid conduit are coupled to the evaporator through the third surface. The evaporator, the gas conduit, and the liquid conduit cooperatively form a circulation passage. A connecting portion of the gas conduit and the liquid conduit is received within the condenser.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: April 6, 2021
    Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
    Inventors: Han-Yu Li, Gong-Wen Zhang, Fang-Xing Yang, Xiang-Jie Chen, Jin-Xing Zhang
  • Patent number: 10972090
    Abstract: An output stage circuit for transmitting data via a bus includes a high side switch, a high side diode structure, a high side clamp circuit, a low side switch, and a low side diode structure. An impedance circuit of the bus is coupled between the high side switch and the low side switch, for generating a differential output signal according to high and low side output signals. A high side N-type region of the high side diode structure encompasses a high side P-type region thereof, and a low side N-type region of the low side diode structure encompasses a low side P-type region thereof. The high side clamp circuit is connected to the high side N-type region in series, for clamping a voltage of the high side N-type region to be not lower than a predetermined voltage, to prevent a parasitic PNP bipolar junction transistor from being turned ON.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: April 6, 2021
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Yu-Wen Chang, Leng-Nien Hsiu, Isaac Y. Chen
  • Patent number: 10971444
    Abstract: An electronic apparatus and an electronic system may include a first power delivery network (PDN) and a second PDN. The first PDN may include a first inductor as a segment of a power rail of the first PDN, while the second PDN may include a second inductor as a segment of a power rail of the second PDN. The first inductor and the second inductor may form a magnetically coupled inductor. The magnetically coupled inductor may provide migrated impedance ZT to the first PDN induced by the magnetically coupled inductor. The migrated impedance ZT to the first PDN may help the first PDN to reduce its voltage noise. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Jimmy Huat Since Huang, Xingjian Cai, Paik Wen Ong, Herh Nan Chen, Yun Ji
  • Patent number: 10971594
    Abstract: A semiconductor device has a semiconductor substrate with a dielectric layer disposed thereon. A trench is defined in the dielectric layer. A metal gate structure is disposed in the trench. The metal gate structure includes a first layer and a second layer disposed on the first layer. The first layer extends to a first height in the trench and the second layer extends to a second height in the trench; the second height is less than the first height.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: April 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Lien Huang, Chi-Wen Liu, Clement Hsingjen Wann, Ming-Huan Tsai, Zhao-Cheng Chen
  • Patent number: 10972646
    Abstract: A device with two cameras utilizing one photosensitive assembly includes a first camera assembly, a second camera assembly, and the photosensitive assembly. The first camera assembly and the second camera assembly are symmetrically positioned at both sides of the photosensitive assembly. The photosensitive assembly includes a driver and a connected photosensitive chip, the driver can drive the photosensitive chip to rotate, so that a photosensitive surface of the photosensitive chip is rotated between the first camera assembly and the second camera assembly. Therefore, the first camera assembly and the second camera assembly of the camera device are able to share one photosensitive chip, thereby the overall size and cost of the camera device is reduced. The present application also provides a mobile terminal having the camera device.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: April 6, 2021
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Shin-Wen Chen, Xiao-Mei Ma, Long-Fei Zhang, Kun Li
  • Patent number: 10969561
    Abstract: A driving mechanism for moving an optical element is provided, including a housing, a frame, a holder, and a driving assembly. The frame is fixed to the housing and forms a depressed surface adjacent to the housing. Specifically, the depressed surface faces the housing and is not in contact with the housing. The holder is movably disposed in the housing for holding the optical element. The drive assembly is disposed in the housing to drive the holder and the optical element to move relative to the frame.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: April 6, 2021
    Assignee: TDK Taiwan Corp.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Patent number: 10971223
    Abstract: A method includes applying a pulse sequence to a PCM device, each pulse of the pulse sequence including a pulse number, an amplitude, a leading edge, a pulse width, and a trailing edge, the trailing edge having a duration longer than a duration of the leading edge. Applying the pulse sequence includes increasing the pulse number while increasing at least one of the amplitude, the pulse width, or the trailing edge duration. A conductance level of the PCM device is altered in response to applying the pulse sequence.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Sheng Chen, Jau-Yi Wu, Chia-Wen Chang
  • Publication number: 20210098604
    Abstract: Methods of forming a semiconductor device are provided. A method according to the present disclosure includes forming, over a workpiece, a dummy gate stack comprising a first semiconductor material, depositing a first dielectric layer over the dummy gate stack using a first process, implanting the workpiece with a second semiconductor material different from the first semiconductor material, annealing the dummy gate stack after the implanting, and replacing the dummy gate stack with a metal gate stack.
    Type: Application
    Filed: July 17, 2020
    Publication date: April 1, 2021
    Inventors: Shih-Hao Lin, Jui-Lin Chen, Hsin-Wen Su, Kian-Long Lim, Bwo-Ning Chen, Chih-Hsuan Chen
  • Publication number: 20210094118
    Abstract: A wire clamping system for fully automatic wire bonding machine comprises a base, a wire clamping support, a wire clamping assembly, a driving mechanism and an elastic assembly. The wire clamping assembly can move relative to the capillary, so that when the wire clamping system completes the second bond, the metal wire at the end of the capillary may directly extend out of the capillary by the independent movement of the wire clamping assembly and a length thereof can be effectively controlled, in order to form a metal ball in the next first bond. Furthermore, when the wire clamping system completes the second bond, the wire clamping assembly is in a clamping state, which avoids wires flying, even though the second bond is not firmly connected or the machine vibrates.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 1, 2021
    Inventors: Wen Chen, Chengjun Zhang
  • Publication number: 20210095486
    Abstract: The present invention relates to a reinforcing structure of unexpired concrete building floors used for reinforcing a concrete column, a concrete beam and a concrete floor slab. The structure has: at least one external column each of the at least one external column wrapping around the concrete column; at least one framework each wrapping around the concrete beam; a plurality of brackets fixedly mounted to the lower surface of the concrete floor slab, and a base plate disposed at the bottom of the concrete column, wherein the bottom of each of the at least one external column is fixed to the base plate, the top of each of the at least one external column is fixed to a corresponding one of the at least one framework, and the corresponding framework is fixed to the plurality of brackets along a length direction of the concrete beam.
    Type: Application
    Filed: September 28, 2020
    Publication date: April 1, 2021
    Inventors: Baoru JIE, Jiangang JIE, Shuangxi ZHOU, Zhiyong YAO, Wenrong HU, Yuchun CHEN, Wujin TAO, Wen LIU, Luolong ZHAN, Xin HE
  • Publication number: 20210098290
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises an interlayer dielectric (ILD) layer disposed over a substrate; a first conductive feature at least partially embedded in the ILD layer; a dielectric layer disposed over and aligned with the ILD layer, wherein a top surface of the dielectric layer is above a top surface of the first conductive feature; an etch stop layer (ESL) disposed over the dielectric layer and over the first conductive feature; and a second conductive feature disposed on the first conductive feature, wherein the second conductive feature includes a first portion having a first bottom surface contacting a top surface of the first conductive feature and a second portion having a second bottom surface contacting a top surface of the dielectric layer.
    Type: Application
    Filed: July 17, 2020
    Publication date: April 1, 2021
    Inventors: Hsiu-Wen Hsueh, Cai-Ling Wu, Ya-Ching Tseng, Chii-Ping Chen, Neng-Jye Yang