Light emitting diode package

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Description

FIG. 1 is a top perspective view of a light emitting diode package;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a first side view thereof;

FIG. 4 is a second side view thereof;

FIG. 5 is a third side view thereof;

FIG. 6 is a fourth side view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The dash-dash broken lines in the drawing depict potions of the light emitting diode package and form no part of the claimed design.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
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Other references
  • Würth Elektronik | Understanding parameters, posted on Feb. 5, 2024, 2024 Würth Elektronik eiSos GmbH & Co., KG, Deutschland [online], site visited Nov. 13, 2024. Available from, ,https://www.we-online.com/components/media/o782907v410%20ANO009b_Understanding%parameters%20in%20ICLED520datasheets_EN.pdf. (Year: 2024).
Patent History
Patent number: D1086507
Type: Grant
Filed: Jan 10, 2025
Date of Patent: Jul 29, 2025
Assignee: LIGITEK ELECTRONICS CO., LTD. (New Taipei)
Inventors: Yi-Wen Chen (New Taipei), Wen-Chung Chou (New Taipei), I-Hsin Tung (New Taipei)
Primary Examiner: Cary M Robinson
Assistant Examiner: Julie Marie Bailey
Application Number: 29/983,473
Classifications