Patents by Inventor Wen-Chen Wei
Wen-Chen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140308268Abstract: A detergent composition includes an alcoholic beverage, a moisturizer, a surfactant and water; and the surfactant is a natural coconut oil foaming agent. By including the alcoholic beverage, the detergent composition does not need any addition of a preserving agent and provides additional disinfecting effect as well as upgraded cleansing effect.Type: ApplicationFiled: December 11, 2013Publication date: October 16, 2014Inventor: Wen-Chen WEI
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Patent number: 8365407Abstract: A method for manufacturing a radiator including preparing, aligning, punching, bending, shearing and riveting, rotating, and removing processes is provided. The shearing, riveting, and rotating processes are repeated. A sheet metal is continuously punched to form a plurality of heat dissipation fins in a manufacturing machine, the heat dissipation fins are then orderly sheared, inserted into the metal base, and further fixed with the metal base by two-direction riveting. The radiator can thus be obtained in an automatic and faster process without unnecessary assembling steps with higher yield and reduced costs.Type: GrantFiled: April 14, 2009Date of Patent: February 5, 2013Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Publication number: 20120212950Abstract: A light emitting unit includes a heat-dissipating base, at least one light-bar member and a cover member. The heat-dissipating base has a contact portion on one side thereof. The light-bar member has a PCB and a plurality of light emitting devices disposed on and electrically connected with the PCB. The light-bar member is disposed on the contact portion of the heat-dissipating base. The cover member is detachably assembled with the heat-dissipating base and covering the light-bar member. The cover member has an opening and the inner surfaces of two sides of the cover member respectively have a pressing portion. The pressing portion presses onto the PCB to contact the contact portion of the heat-dissipating base in a firm manner. Therefore, the heat generated by the light-bar member can be efficiently transferred to the heat-dissipating base so as to improve the heat-dissipating efficiency of the light emitting unit.Type: ApplicationFiled: April 23, 2011Publication date: August 23, 2012Applicant: NENG TYI PRECISION INDUSTRIES CO., LTD.Inventor: WEN-CHEN WEI
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Patent number: 8230902Abstract: The present invention relates to a heat-dissipating element and a heat sink having heat-dissipating elements. The heat sink includes at least one substrate and a plurality of heat-dissipating elements. The substrate includes a base portion and a plurality of extending arms. Insertion slots are provided between each extending arm and two adjacent extending arms. Each heat-dissipating element is inserted in the corresponding insertion slot of the substrate. The lateral surfaces of each extending arm abut against the corresponding surfaces of the each heat-dissipating elements. A plurality of embossed heat-dissipating portions protrudes from at least one surface of each heat-dissipating element. According to the above, the present invention avoids the use of solders and heat transfer loss. Via the embossed heat-dissipating portions, the surface area of the heat-dissipating element for heat dissipation can be increased and thus the heat-dissipating effect is enhanced.Type: GrantFiled: March 25, 2008Date of Patent: July 31, 2012Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Publication number: 20120037351Abstract: A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.Type: ApplicationFiled: October 26, 2011Publication date: February 16, 2012Applicant: NENG TYI PRECISION INDUSTRIES CO., LTD.Inventor: WEN-CHEN WEI
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Patent number: 8087456Abstract: A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.Type: GrantFiled: March 10, 2008Date of Patent: January 3, 2012Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Patent number: 7963035Abstract: A manufacturing method for a radiator and a structure thereof are disclosed. The manufacturing method for a radiator includes the following steps. A substrate and a plurality of cooling sheets are provided. The side wall of the substrate has a plurality of concave troughs. The cooling sheets are respectively plugged into the concave troughs. The two side walls of each of the concave troughs tightly contact the two opposing surfaces of the cooling sheet. Thereby, each of the cooling sheets is located at the side wall of the substrate, and the top portion and the bottom portion of the cooling sheet extend to outside of the top surface and the bottom surface of the substrate. By using the riveting technology to directly fasten the cooling sheets via the two side walls of the concave troughs, the present invention prevents the heat-conduction loss from being occurred.Type: GrantFiled: March 14, 2008Date of Patent: June 21, 2011Assignee: Neg Tyi Precision Co., Ltd.Inventor: Wen-Chen Wei
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Patent number: 7897663Abstract: A clarifying agent composition comprises a diacetal powder and an organosilane treated fume silica having a pH value of 5.5 to 8, measured in a 4% w/w dispersion in 1:1 mixture of water-methanol. The diacetal has the general structure formula (I), (II), (III), (IV) or (V), wherein R1 and R2 are independently selected from the group consisting of H, C1-C4 alkyl, C1-C4 carbalkoxy, F, Cl, and Br; a is 0, 1, 2 or 3; b is 0, 1, 2 or 3 and n is 0 or 1. The organosilane treated fume silica is dispersed in the diacetal powder and being 0.05˜50% by weight the clarifying agent composition. This invention also intents to provide a new manufacturing method for preparing superfine powdery diacetal composition with high dispersion characteristic the use of said compositions for preparing polyolefin plastic article without the visible white spots on the surface of the corresponding article.Type: GrantFiled: October 25, 2007Date of Patent: March 1, 2011Assignee: Kuo Ching Chemical Co., Ltd.Inventors: Chiu-Peng Tsou, Yi-Jung Huang, Wen-Chen Wei, Ming-Ting Tsai, Wen-Chin Chiu
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Publication number: 20100257734Abstract: A method for manufacturing a radiator including preparing, aligning, punching, bending, shearing and riveting, rotating, and removing processes is provided. The shearing, riveting, and rotating processes are repeated. A sheet metal is continuously punched to form a plurality of heat dissipation fins in a manufacturing machine, the heat dissipation fins are then orderly sheared, inserted into the metal base, and further fixed with the metal base by two-direction riveting. The radiator can thus be obtained in an automatic and faster process without unnecessary assembling steps with higher yield and reduced costs.Type: ApplicationFiled: April 14, 2009Publication date: October 14, 2010Inventor: Wen-Chen WEI
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Patent number: 7631987Abstract: A light emitting diode lamp includes a heat sink, a socket, a light emitting module, a holder and a lens. The socket and the holder are respectively positioned opposite sides of the heat sink. The light emitting module is combined with the heat sink and has a light emitting diode unit. The lens is mounted on the light emitting diode unit and combined inside the holder. The heat sink includes a substrate and a plurality of heat dissipating fins. The substrate has a plurality of extending arms in a manner that a slot is formed between two neighboring extending arms. A plurality of heat dissipating fins is inserted into the corresponding slots. One of opposite sidewall surfaces of each extending arm is against one of opposite surfaces of each heat dissipating fin. Thereby, there is no need of producing a heat sink by soldering.Type: GrantFiled: March 14, 2008Date of Patent: December 15, 2009Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Publication number: 20090194251Abstract: The present invention relates to a heat-dissipating element and a heat sink having heat-dissipating elements. The heat sink includes at least one substrate and a plurality of heat-dissipating elements. The substrate includes a base portion and a plurality of extending arms. Insertion slots are provided between each extending arm and two adjacent extending arms. Each heat-dissipating element is inserted in the corresponding insertion slot of the substrate. The lateral surfaces of each extending arm abut against the corresponding surfaces of the each heat-dissipating elements. A plurality of embossed heat-dissipating portions protrudes from at least one surface of each heat-dissipating element. According to the above, the present invention avoids the use of solders and heat transfer loss. Via the embossed heat-dissipating portions, the surface area of the heat-dissipating element for heat dissipation can be increased and thus the heat-dissipating effect is enhanced.Type: ApplicationFiled: March 25, 2008Publication date: August 6, 2009Inventor: Wen-Chen Wei
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Publication number: 20090189169Abstract: A light emitting diode lamp includes a heat sink, a socket, a light emitting module, a holder and a lens. The socket and the holder are respectively positioned opposite sides of the heat sink. The light emitting module is combined with the heat sink and has a light emitting diode unit. The lens is mounted on the light emitting diode unit and combined inside the holder. The heat sink includes a substrate and a plurality of heat dissipating fins. The substrate has a plurality of extending arms in a manner that a slot is formed between two neighboring extending arms. A plurality of heat dissipating fins is inserted into the corresponding slots. One of opposite sidewall surfaces of each extending arm is against one of opposite surfaces of each heat dissipating fin. Thereby, there is no need of producing a heat sink by soldering.Type: ApplicationFiled: March 14, 2008Publication date: July 30, 2009Inventor: Wen-Chen Wei
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Publication number: 20090178795Abstract: A manufacturing method for a radiator and a structure thereof are disclosed. The manufacturing method for a radiator includes the following steps. A substrate and a plurality of cooling sheets are provided. The side wall of the substrate has a plurality of concave troughs. The cooling sheets are respectively plugged into the concave troughs. The two side walls of each of the concave troughs tightly contact the two opposing surfaces of the cooling sheet. Thereby, each of the cooling sheets is located at the side wall of the substrate, and the top portion and the bottom portion of the cooling sheet extend to outside of the top surface and the bottom surface of the substrate. By using the riveting technology to directly fasten the cooling sheets via the two side walls of the concave troughs, the present invention prevents the heat-conduction loss from being occurred.Type: ApplicationFiled: March 14, 2008Publication date: July 16, 2009Inventor: Wen-Chen Wei
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Publication number: 20090178794Abstract: A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.Type: ApplicationFiled: March 10, 2008Publication date: July 16, 2009Inventor: Wen Chen Wei
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Publication number: 20090111918Abstract: A clarifying agent composition comprises a diacetal powder and an organosilane treated fume silica having a pH value of 5.5 to 8, measured in a 4% w/w dispersion in 1:1 mixture of water-methanol. The diacetal has the general structure formula (I), (II), (III), (IV) or (V), wherein R1 and R2 are independently selected from the group consisting of H, C1-C4 alkyl, C1-C4 carbalkoxy, F, Cl, and Br; a is 0, 1, 2 or 3; b is 0, 1, 2 or 3 and n is 0 or 1. The organosilane treated fume silica is dispersed in the diacetal powder and being 0.05˜50% by weight the clarifying agent composition. This invention also intents to provide a new manufacturing method for preparing superfine powdery diacetal composition with high dispersion characteristic the use of said compositions for preparing polyolefin plastic article without the visible white spots on the surface of the corresponding article.Type: ApplicationFiled: October 25, 2007Publication date: April 30, 2009Inventors: Chiu-Peng Tsou, Yi-Jung Huang, Wen-Chen Wei, Ming-Ting Tsai, Wen-Chin Chiu
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Patent number: D626260Type: GrantFiled: February 2, 2010Date of Patent: October 26, 2010Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Patent number: D632406Type: GrantFiled: February 9, 2010Date of Patent: February 8, 2011Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Patent number: D646407Type: GrantFiled: March 14, 2011Date of Patent: October 4, 2011Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Patent number: D646807Type: GrantFiled: March 14, 2011Date of Patent: October 11, 2011Assignee: Neng Tyi Precision Industries Co., Ltd.Inventor: Wen-Chen Wei
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Patent number: D661680Type: GrantFiled: November 11, 2010Date of Patent: June 12, 2012Inventors: Wen-Chen Wei, Chia-Wei Hsu