Patents by Inventor Wen-Chen Wei

Wen-Chen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140308268
    Abstract: A detergent composition includes an alcoholic beverage, a moisturizer, a surfactant and water; and the surfactant is a natural coconut oil foaming agent. By including the alcoholic beverage, the detergent composition does not need any addition of a preserving agent and provides additional disinfecting effect as well as upgraded cleansing effect.
    Type: Application
    Filed: December 11, 2013
    Publication date: October 16, 2014
    Inventor: Wen-Chen WEI
  • Patent number: 8365407
    Abstract: A method for manufacturing a radiator including preparing, aligning, punching, bending, shearing and riveting, rotating, and removing processes is provided. The shearing, riveting, and rotating processes are repeated. A sheet metal is continuously punched to form a plurality of heat dissipation fins in a manufacturing machine, the heat dissipation fins are then orderly sheared, inserted into the metal base, and further fixed with the metal base by two-direction riveting. The radiator can thus be obtained in an automatic and faster process without unnecessary assembling steps with higher yield and reduced costs.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: February 5, 2013
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Publication number: 20120212950
    Abstract: A light emitting unit includes a heat-dissipating base, at least one light-bar member and a cover member. The heat-dissipating base has a contact portion on one side thereof. The light-bar member has a PCB and a plurality of light emitting devices disposed on and electrically connected with the PCB. The light-bar member is disposed on the contact portion of the heat-dissipating base. The cover member is detachably assembled with the heat-dissipating base and covering the light-bar member. The cover member has an opening and the inner surfaces of two sides of the cover member respectively have a pressing portion. The pressing portion presses onto the PCB to contact the contact portion of the heat-dissipating base in a firm manner. Therefore, the heat generated by the light-bar member can be efficiently transferred to the heat-dissipating base so as to improve the heat-dissipating efficiency of the light emitting unit.
    Type: Application
    Filed: April 23, 2011
    Publication date: August 23, 2012
    Applicant: NENG TYI PRECISION INDUSTRIES CO., LTD.
    Inventor: WEN-CHEN WEI
  • Patent number: 8230902
    Abstract: The present invention relates to a heat-dissipating element and a heat sink having heat-dissipating elements. The heat sink includes at least one substrate and a plurality of heat-dissipating elements. The substrate includes a base portion and a plurality of extending arms. Insertion slots are provided between each extending arm and two adjacent extending arms. Each heat-dissipating element is inserted in the corresponding insertion slot of the substrate. The lateral surfaces of each extending arm abut against the corresponding surfaces of the each heat-dissipating elements. A plurality of embossed heat-dissipating portions protrudes from at least one surface of each heat-dissipating element. According to the above, the present invention avoids the use of solders and heat transfer loss. Via the embossed heat-dissipating portions, the surface area of the heat-dissipating element for heat dissipation can be increased and thus the heat-dissipating effect is enhanced.
    Type: Grant
    Filed: March 25, 2008
    Date of Patent: July 31, 2012
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Publication number: 20120037351
    Abstract: A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.
    Type: Application
    Filed: October 26, 2011
    Publication date: February 16, 2012
    Applicant: NENG TYI PRECISION INDUSTRIES CO., LTD.
    Inventor: WEN-CHEN WEI
  • Patent number: 8087456
    Abstract: A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: January 3, 2012
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: 7963035
    Abstract: A manufacturing method for a radiator and a structure thereof are disclosed. The manufacturing method for a radiator includes the following steps. A substrate and a plurality of cooling sheets are provided. The side wall of the substrate has a plurality of concave troughs. The cooling sheets are respectively plugged into the concave troughs. The two side walls of each of the concave troughs tightly contact the two opposing surfaces of the cooling sheet. Thereby, each of the cooling sheets is located at the side wall of the substrate, and the top portion and the bottom portion of the cooling sheet extend to outside of the top surface and the bottom surface of the substrate. By using the riveting technology to directly fasten the cooling sheets via the two side walls of the concave troughs, the present invention prevents the heat-conduction loss from being occurred.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: June 21, 2011
    Assignee: Neg Tyi Precision Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: 7897663
    Abstract: A clarifying agent composition comprises a diacetal powder and an organosilane treated fume silica having a pH value of 5.5 to 8, measured in a 4% w/w dispersion in 1:1 mixture of water-methanol. The diacetal has the general structure formula (I), (II), (III), (IV) or (V), wherein R1 and R2 are independently selected from the group consisting of H, C1-C4 alkyl, C1-C4 carbalkoxy, F, Cl, and Br; a is 0, 1, 2 or 3; b is 0, 1, 2 or 3 and n is 0 or 1. The organosilane treated fume silica is dispersed in the diacetal powder and being 0.05˜50% by weight the clarifying agent composition. This invention also intents to provide a new manufacturing method for preparing superfine powdery diacetal composition with high dispersion characteristic the use of said compositions for preparing polyolefin plastic article without the visible white spots on the surface of the corresponding article.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: March 1, 2011
    Assignee: Kuo Ching Chemical Co., Ltd.
    Inventors: Chiu-Peng Tsou, Yi-Jung Huang, Wen-Chen Wei, Ming-Ting Tsai, Wen-Chin Chiu
  • Publication number: 20100257734
    Abstract: A method for manufacturing a radiator including preparing, aligning, punching, bending, shearing and riveting, rotating, and removing processes is provided. The shearing, riveting, and rotating processes are repeated. A sheet metal is continuously punched to form a plurality of heat dissipation fins in a manufacturing machine, the heat dissipation fins are then orderly sheared, inserted into the metal base, and further fixed with the metal base by two-direction riveting. The radiator can thus be obtained in an automatic and faster process without unnecessary assembling steps with higher yield and reduced costs.
    Type: Application
    Filed: April 14, 2009
    Publication date: October 14, 2010
    Inventor: Wen-Chen WEI
  • Patent number: 7631987
    Abstract: A light emitting diode lamp includes a heat sink, a socket, a light emitting module, a holder and a lens. The socket and the holder are respectively positioned opposite sides of the heat sink. The light emitting module is combined with the heat sink and has a light emitting diode unit. The lens is mounted on the light emitting diode unit and combined inside the holder. The heat sink includes a substrate and a plurality of heat dissipating fins. The substrate has a plurality of extending arms in a manner that a slot is formed between two neighboring extending arms. A plurality of heat dissipating fins is inserted into the corresponding slots. One of opposite sidewall surfaces of each extending arm is against one of opposite surfaces of each heat dissipating fin. Thereby, there is no need of producing a heat sink by soldering.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: December 15, 2009
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Publication number: 20090194251
    Abstract: The present invention relates to a heat-dissipating element and a heat sink having heat-dissipating elements. The heat sink includes at least one substrate and a plurality of heat-dissipating elements. The substrate includes a base portion and a plurality of extending arms. Insertion slots are provided between each extending arm and two adjacent extending arms. Each heat-dissipating element is inserted in the corresponding insertion slot of the substrate. The lateral surfaces of each extending arm abut against the corresponding surfaces of the each heat-dissipating elements. A plurality of embossed heat-dissipating portions protrudes from at least one surface of each heat-dissipating element. According to the above, the present invention avoids the use of solders and heat transfer loss. Via the embossed heat-dissipating portions, the surface area of the heat-dissipating element for heat dissipation can be increased and thus the heat-dissipating effect is enhanced.
    Type: Application
    Filed: March 25, 2008
    Publication date: August 6, 2009
    Inventor: Wen-Chen Wei
  • Publication number: 20090189169
    Abstract: A light emitting diode lamp includes a heat sink, a socket, a light emitting module, a holder and a lens. The socket and the holder are respectively positioned opposite sides of the heat sink. The light emitting module is combined with the heat sink and has a light emitting diode unit. The lens is mounted on the light emitting diode unit and combined inside the holder. The heat sink includes a substrate and a plurality of heat dissipating fins. The substrate has a plurality of extending arms in a manner that a slot is formed between two neighboring extending arms. A plurality of heat dissipating fins is inserted into the corresponding slots. One of opposite sidewall surfaces of each extending arm is against one of opposite surfaces of each heat dissipating fin. Thereby, there is no need of producing a heat sink by soldering.
    Type: Application
    Filed: March 14, 2008
    Publication date: July 30, 2009
    Inventor: Wen-Chen Wei
  • Publication number: 20090178795
    Abstract: A manufacturing method for a radiator and a structure thereof are disclosed. The manufacturing method for a radiator includes the following steps. A substrate and a plurality of cooling sheets are provided. The side wall of the substrate has a plurality of concave troughs. The cooling sheets are respectively plugged into the concave troughs. The two side walls of each of the concave troughs tightly contact the two opposing surfaces of the cooling sheet. Thereby, each of the cooling sheets is located at the side wall of the substrate, and the top portion and the bottom portion of the cooling sheet extend to outside of the top surface and the bottom surface of the substrate. By using the riveting technology to directly fasten the cooling sheets via the two side walls of the concave troughs, the present invention prevents the heat-conduction loss from being occurred.
    Type: Application
    Filed: March 14, 2008
    Publication date: July 16, 2009
    Inventor: Wen-Chen Wei
  • Publication number: 20090178794
    Abstract: A method for manufacturing a heat sink having heat-dissipating fins and a structure of the same are provided. The method includes the steps of: providing a substrate comprising a center portion and a plurality of extending arms, a gap being provided between each two adjacent extending arms; providing a plurality of heat-dissipating fins, the heat-dissipating fins being inserted into the gaps between the extending arms, each heat-dissipating fin comprising a base piece and two heat-dissipating plates; and bending and pressing each extending arm of the substrate with one of the two opposite side walls of each extending arm abutting against one of the two opposite surface of each heat-dissipating plate. Via the above arrangement, the present invention has an effect of avoiding the heat transfer loss.
    Type: Application
    Filed: March 10, 2008
    Publication date: July 16, 2009
    Inventor: Wen Chen Wei
  • Publication number: 20090111918
    Abstract: A clarifying agent composition comprises a diacetal powder and an organosilane treated fume silica having a pH value of 5.5 to 8, measured in a 4% w/w dispersion in 1:1 mixture of water-methanol. The diacetal has the general structure formula (I), (II), (III), (IV) or (V), wherein R1 and R2 are independently selected from the group consisting of H, C1-C4 alkyl, C1-C4 carbalkoxy, F, Cl, and Br; a is 0, 1, 2 or 3; b is 0, 1, 2 or 3 and n is 0 or 1. The organosilane treated fume silica is dispersed in the diacetal powder and being 0.05˜50% by weight the clarifying agent composition. This invention also intents to provide a new manufacturing method for preparing superfine powdery diacetal composition with high dispersion characteristic the use of said compositions for preparing polyolefin plastic article without the visible white spots on the surface of the corresponding article.
    Type: Application
    Filed: October 25, 2007
    Publication date: April 30, 2009
    Inventors: Chiu-Peng Tsou, Yi-Jung Huang, Wen-Chen Wei, Ming-Ting Tsai, Wen-Chin Chiu
  • Patent number: D626260
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: October 26, 2010
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: D632406
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: February 8, 2011
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: D646407
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: October 4, 2011
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: D646807
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: October 11, 2011
    Assignee: Neng Tyi Precision Industries Co., Ltd.
    Inventor: Wen-Chen Wei
  • Patent number: D661680
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: June 12, 2012
    Inventors: Wen-Chen Wei, Chia-Wei Hsu