Abstract: A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each of the heat dissipating fins is predetermined when assembling to constitute the structure. The heat dissipating fins are completed from a single stamping, and can be assembled to form heat dissipation areas of different spacing to accommodate a cool air flow being fanned from different oriented fans, thereby reducing obstruction and disturbance of the air flow and rapidly and smoothly guiding the air flow to other heat dissipating fins. Moreover, the heat dissipating structure enlarges area of heat circulation, thereby augmenting speed of heat diffusion, improving heat dissipation effect on heat emitting from computer electronic components, and enhancing functionality of the fan.

Abstract: A heat sink device has a metal body connected with a voltage source, multiple sharp teeth formed on one side of the metal body, and a metal grounded member provided separately from the metal body. When the metal body is electrified, the sharp teeth are in a strong electrical field to generate a corona phenomenon, and the air around the sharp teeth is ionized. The ions having the same charge with the sharp teeth will be rejected by the sharp teeth, and all moves to the metal grounded member, whereby an electric wind is generated to dissipate the heat.

Abstract: A multidirectional heat dissipating structure that joins and assembles a plurality of heat dissipating fins, length of each of which vary, and can be arranged and assembled to form a plurality of flow guiding plates, each of which assumes a certain angle in accordance with the direction of air, thereby forming an appropriate air channel that smoothly guides an air flow from a fan, causing cool air to rapidly flow towards heat conduction areas formed by spacings between the heat dissipating fins, thereby accelerating dissipation of heat from a heat source at a bottom portion of the heat dissipating fins. Moreover, the heat dissipating structure is applicable for use in various horizontal blowing and downward blowing heat dissipating devices.

Abstract: A heat dissipating structure having different compactness assembled from a plurality of small heat dissipating fins, thereby forming heat dissipation areas having different spacing. The heat dissipating fins are stamp formed from single strips, and spacing of each of the heat dissipating fins is predetermined when assembling to constitute the structure. The heat dissipating fins are completed from a single stamping, and can be assembled to form heat dissipation areas of different spacing to accommodate a cool air flow being fanned from different oriented fans, thereby reducing obstruction and disturbance of the air flow and rapidly and smoothly guiding the air flow to other heat dissipating fins. Moreover, the heat dissipating structure enlarges area of heat circulation, thereby augmenting speed of heat diffusion, improving heat dissipation effect on heat emitting from computer electronic components, and enhancing functionality of the fan.

Abstract: A compound of the formula: (I): wherein R1, R2 and R3 are independently selected from the group consisting of H, C1-C8 alkyl, (CH2)n-aryl (wherein n is 0-6, phenyl or benzyl), NO2 or CN, F, Cl, Br and I; and n is 0 or 1. The present invention also relates to a compound of the formula (II): wherein R1, R2 and R3 are independently selected from the group consisting of H, C1-C8 alkyl, (CH2)n-aryl (wherein n is 0-6, phenyl or benzyl), NO2 or CN, F, Cl, Br and I; and n is 0 or 1.

Abstract: A highly efficient heat sink, comprised of a seat, a heat insulation plate, a heat conduction plate and heat dispersion plates. The heat insulation plate and the heat conduction plate are respectively extended from both ends of the seat, the heat insulation plates and heat conduction plate are each curved inward to form heat dispersion plates. An air conduction outlet is provided where the heat dispersion plate is respectively connected to the heat insulation plate and heat conduction plate, and an air vent is provided in the inner side to allow air circulation on each plane of the heat dispersion plate, the heat insulation plate and the conduction plate without heat accumulation inside the sink.

Abstract: A flexible heat pipe mainly has a heat pipe disposed between an electronic heat generating component and a heat sink; the middle segment of the said heat pipe is a flexible hose with a capillary structure disposed on the inner tube wall and connects with metal tubes at two ends by means of lashing rings; a flexible heat pipe formed accordingly can be adjusted toward any direction, placed over various parts inside a computer and respectively assembled to the electronic heat generating component as well as the heat sink which is to be mounted in any proper and ventilating area for evenly and rapidly diffusing the heat so as to achieve the effect of space utilization and best heat dissipation.

Abstract: A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate thereof to increase the self-heat convection of the bottom portion of the notebook computer placed on the heat sink base and to disperse the heat for quickly dissipating the heat source so as to efficiently reduce the temperature.

Abstract: A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate thereof to increase the self-heat convection of the bottom portion of the notebook computer placed on the heat sink base and to disperse the heat for quickly dissipating the heat source so as to efficiently reduce the temperature.

Abstract: A heat dissipater structure has a heat sink base with peripheral sides thereof folded upwards from the bottom plate and cut into a plurality of lateral plates at proper angles to form wind channels for current conduction and to define a receiving slot at the center for holding a fan. A convex block is disposed on two opposite lateral plates for easily hooking and assembling a cover body so as to allow the air current inducted by the fan to rapidly dissipate the heat absorbed by the bottom plate outwardly through the wind channels formed by the interference of the lateral plates.

Abstract: A heat dissipation device coupling structure includes of a heat sink and frame-type retaining tabs. The heat sink has a shoulder plate projecting outward from lower base thereof and L-shaped lock tabs are disposed on two ends at the lower extent of the positioner rod which is elevated thereby. A seat section having a stop tab at lower end thereof and tensile clip tabs curving outward from upper end thereof. A lip tab is folded downwardly along the outer rims of a frame plate forming upper and lower containment recesses. When assembling, a central processing unit is first inserted into the lower containment recess such that face plate is secured against the upper end of the frame plate, following which a shoulder plate of the heat sink is inserted into the lower extent of the positioner rod, with the other side of the heat sink held down by clip tabs in the upper containment recess thereby tightly secure the central processing unit.

Abstract: A memory heat sink device includes a heat sink piece and a clamp member, wherein a retaining portion is disposed at the upper end rim of the heat sink to assemble two heat sink pieces and to make a space on the inner side for receiving a memory; a position limiting slot is disposed on the outer lateral plane with a retainer hole at the upper end thereof for hooking a reverse hook of the clamp member; a guide hole is disposed at the upper end of the retaining hole; the upper end rim connects with the guide hole bends to form a bearing retainer seat; the clamp member placed across the bearing retainer seat clamps two heat sink pieces to press the opening end into the position limiting slot, thereby the reverse hook and the retainer hole are fixedly hooked to easily assemble a heat sink device.

Abstract: A flexible heat pipe mainly has a heat pipe disposed between an electronic heat generating component and a heat sink; the middle segment of the said heat pipe is a flexible hose with a capillary structure disposed on the inner tube wall and connects with metal tubes at two ends by means of lashing rings; a flexible heat pipe formed accordingly can be adjusted toward any direction, placed over various parts inside a computer and respectively assembled to the electronic heat generating component as well as the heat sink which is to be mounted in any proper and ventilating area for evenly and rapidly diffusing the heat so as to achieve the effect of space utilization and best heat dissipation.

Abstract: A heat sink device retainer structure includes one press member and a retaining member; the said press member bends downwardly to form a press portion with resilience; one end thereof bends downwardly to form a retaining hole; two sides of the bottom portion at the other end extend to form a pair of opposite fastening panels; an insert hole is disposed on the said fastening panel and the tail end thereof outwardly forms an opening; a wrench portion is disposed at the upper end of the said retaining member; the wrench portion bends downwardly to form an upper body; the lower end of the upper body extends as a support for connecting a lower retaining body; a retaining hole is disposed on the lower retaining body; two convex blocks are disposed on two sides of the said support and inserted correspondingly into the insert holes for positioning.

Abstract: An improved structure computer heat dissipater, the heat sink base of which has four lateral walls of appropriate length with a plurality of draft guide ducts cut inward through them. The cut surfaces thereof are utilized as flow direction separators set to a particular angular arrangement to create a predetermined air flow path. Disposed on the bottom plate are thermal dissipation protuberances that collect the concentrated thermal energy developed by the heat generating electronic component in a computer. The air stream drawn in by the fan conveys the heat absorbed by the thermal dissipation protuberances along the air path formed by the flow direction separators and rapidly discharges it through the draft guide ducts.

Abstract: An improved computer heat dissipation structure, mainly comprises of a heat dissipation base with four sides folded upwards from the base plate to form four side walls with a receiving slot at the center; air outlets set respectively on the four side walls; the base plate connected with the air outlets being cut respectively with proper width and folded upwards to form a plurality of conduct current partitions; the cut planes of the conduct current partitions in different angles according to the direction of the wind thus to make the air current inducted by the fan to rapidly diffuse the heat sources absorbed by the base plate towards the air outlets through the wind channels formed by the interference of the conduct current partitions.

Abstract: The invention herein relates to a heat sink device fastening structure, comprises of a press-fastening member and a retaining member, wherein the press-fastening member with resilience, the retaining holes set respectively on the lateral sides of the press-fastening member to be hooked to the hook feet of the CPU holder, a through hole set on the longer and horizontal portion, a hook panel set on the top end of the retaining hole on the longer side; a press-holding portion set on the retaining member with a T-shaped reverse hook bent downwardly from the center of the bottom end and a retaining groove formed downwardly from the bottom end to be respectively and reversely fastened with the through hole and the hook panel by using the positional difference; so as to finish the assembly by affixing the heat sink device firmly to the CPU.