Patents by Inventor Wen-Chen Wei

Wen-Chen Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6404635
    Abstract: The invention herein relates to a heat sink device fastening structure, comprises of a press-fastening member and a retaining member, wherein the press-fastening member with resilience, the retaining holes set respectively on the lateral sides of the press-fastening member to be hooked to the hook feet of the CPU holder, a through hole set on the longer and horizontal portion, a hook panel set on the top end of the retaining hole on the longer side; a press-holding portion set on the retaining member with a T-shaped reverse hook bent downwardly from the center of the bottom end and a retaining groove formed downwardly from the bottom end to be respectively and reversely fastened with the through hole and the hook panel by using the positional difference; so as to finish the assembly by affixing the heat sink device firmly to the CPU.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: June 11, 2002
    Inventor: Wen-Chen Wei
  • Patent number: 6336498
    Abstract: A leaf piece structure for a heat dissipater is mainly constructed by punch pressing the heat dissipation pieces into heat dissipation poles arranged in a plurality of rows; the dissipation poles are staggered fore and aft in rows with intervals to substantially increase the contact area with the air; the retaining portions are formed by bending the two sides and the bottom end respectively in the same direction; the bottom end is thus defined as a heat conducting piece; the retaining tenons are mounted on the front portions of the retaining slots on the retaining portion to be aligned and retained correspondingly with all the heat dissipation leaves for assembling a heat dissipater.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: January 8, 2002
    Inventor: Wen-Chen Wei
  • Patent number: 6266245
    Abstract: A heat dissipation fixture seating structure consisting of mounting components that mount a heat dissipation fixture onto a computer central processing unit (CPU), with the mounting componentry of the invention herein comprised of a holddown component and a lifter link component. The holddown component has a catch seat at one end and limiter sections are formed in the catch seat. A hook seat is situated at the other end and slots are formed in the hook seat. Additionally, inward facing latch hooks are formed at the two bottom ends of the holddown component. The lifter link component has a vertically surfaced adjustment saddle at one end; a threaded hole is tapped into the adjustment saddle and forked adjustment arms extend in parallel from its two sides, with a curved shank hook formed at the bottom end of each adjustment arm. The curved shank hooks engage into the slots of the hook seat, while the opposite extent of the forked adjustment arms fit into and are retained in position by the limiter sections.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: July 24, 2001
    Inventor: Wen-Chen Wei
  • Patent number: 6210068
    Abstract: A computer central processing unit (CPU) heat dissipation device latching structure utilized to attach a heat dissipation device to a computer CPU. The latching structure consists of tensile latch element unitarily fabricated such that the rectangular tensile latch element is curved in shape and has a number of fastening holes formed. The directional orientation and angular disposition of the fastening holes differ to allow for rotational alignment with the mounting holes of the CPU board, while also providing for alignment with and coupling to its mounting pins. A press section is disposed on one side to enable the easy rotation of the tensile latch element such that structure of the present invention is capable of simply and rapidly achieving a tight union between the heat dissipation device and the computer CPU.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: April 3, 2001
    Inventor: Wen-Chen Wei