Patents by Inventor Wen Chen

Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11928117
    Abstract: Embodiments of the present invention relate to methods, systems, and computer program products for managing a plurality of live comments. A plurality of live comments is obtained for a video, the plurality of live comments being associated with a plurality of fragments in the video, respectively. A plurality of features are extracted from the plurality of live comments, respectively. A knowledge base is generated for the plurality of live comments based on the plurality of features. With these embodiments, the live comments may be managed in an effective way. Further, the knowledge base may provide answers to a user query.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Wen Wang, Yi Chen Zhong, Kun Yan Yin, De Shuo Kong, Lu Yu, Yi Ming Wang
  • Patent number: 11930056
    Abstract: An embodiment for automatically controlling peripheral devices based on online meeting participant information. The embodiment may detect participants of an online meeting and generate a participant information table. The embodiment may generate a participant group table including one or more preliminary participant groups based on the participant information. The embodiment may generate and send audio through peripheral devices associated with at least one participant in each of the one or more preliminary participant groups to identify the participants in physically shared meeting spaces. The embodiment may update the participant group table to include confirmed participant groups based on the identified participants in the physically shared meeting spaces. The embodiment may determine a presenter for each of the confirmed participant groups and update the participant information.
    Type: Grant
    Filed: February 15, 2023
    Date of Patent: March 12, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jing Ren, Jing Wen Chen, Zhao Yu Wang, Xizhuo Zhang, Yi Jie Ma
  • Patent number: 11929019
    Abstract: A method for processing a static pattern in an image and a circuit system are provided. In the method, each of frames of a video is divided into multiple areas. Several algorithms are used to calculate a static pattern index of every area. The static pattern index is used as a reference for determining if the area covers part or entire of a static pattern. An index threshold can be used to check the areas that are determined as the static pattern initially. A time threshold is then used to confirm the areas with the static pattern in every frame. Image data of the areas which are determined as the static patterns can then be adjusted, such as having brightness of the area that is determined as part or entire of the static patterns decreased, for preventing the display panel from negative effects of the static pattern.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: March 12, 2024
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Cheng-Yueh Chen, Ju-Wen Tseng
  • Patent number: 11927861
    Abstract: A display panel and a display device are disclosed, relating to the display technical field. The display panel comprises a display layer and a light control layer which are laminated, the light control layer comprises a plurality of light control pixel areas, the light control pixel areas comprise a thin film transistor, the display layer comprises a plurality of display pixel areas, and the display pixel areas comprise a green sub-pixel; the orthographic projection of the green sub-pixel on the light control pixel area is close to the area where the thin film transistor is located.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: March 12, 2024
    Assignees: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Renhui Yu, Wen Zha, Xin Chen, Hongzhou Xie, Shangtao Zheng, Meizhen Chen, Ying Tian, Zengrong Li, Ye Hu, Qingna Hou, Kai Diao
  • Publication number: 20240079270
    Abstract: A method of forming a semiconductor device includes forming an opening in a dielectric layer, and forming a barrier layer in the opening. A combined liner layer is formed over the barrier layer by first forming a first liner layer over the barrier layer, and forming a second liner layer over the first liner layer, such that the first liner layer and the second liner layer intermix. A conductive material layer is formed over the combined liner layer, and a thermal process is performed to reflow the conductive material layer.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Huei-Wen Hsieh, Kai-Shiang Kuo, Cheng-Hui Weng, Chun-Sheng Chen, Wen-Hsuan Chen
  • Publication number: 20240077479
    Abstract: A detection system and method for the migrating cell is provided. The system is configured to detect a migrating cell combined with an immunomagnetic bead. The system includes a platform, a microchannel, a magnetic field source, a coherent light source and an optical sensing module. The microchannel is configured to allow the migrating cell to flow in it along a flow direction. The magnetic field source is configured to provide magnetic force to the migrating cell combined with the immunomagnetic bead. The magnetic force includes at least one magnetic force component and the magnetic force component is opposite to the flow direction of the microchannel. The coherent light source is configured to provide the microchannel with the coherent light. The optical sensing module is configured to receive the interference light caused by the coherent light being reflected by the sample inside the microchannel.
    Type: Application
    Filed: August 10, 2023
    Publication date: March 7, 2024
    Applicant: DeepBrain Tech. Inc
    Inventors: Han-Lin Wang, Chia-Wei Chen, Yao-Wen Liang, Ting-Chun Lin, Yun-Ting Kuo, You-Yin Chen, Yu-Chun Lo, Ssu-Ju Li, Ching-Wen Chang, Yi-Chen Lin
  • Patent number: 11923440
    Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming semiconductor fins on a substrate. A first dummy gate is formed over the semiconductor fins. A recess is formed in the first dummy gate, and the recess is disposed between the semiconductor fins. A dummy fin material is formed in the recess. A portion of the dummy fin material is removed to expose an upper surface of the first dummy gate and to form a dummy fin. A second dummy gate is formed on the exposed upper surface of the first dummy gate.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Yao Lin, Chen-Ping Chen, Kuei-Yu Kao, Hsiao Wen Lee, Chih-Han Lin
  • Patent number: 11924444
    Abstract: Method and apparatus for constrained de-blocking filter are disclosed. One method receives input data related to a current block in a current picture at a video encoder side or a video bitstream corresponding to compressed data including the current block in the current picture at a video decoder side, and determines a first boundary associated with the current block, wherein the first boundary corresponds to one vertical boundary or one horizontal boundary of the current block. The method then applies de-blocking process to a reconstructed current block corresponding to the current block to result in a filtered-reconstructed current block, using a plurality of first reference samples at a same side of the first boundary, and replaces a first set of the first reference samples by one or more padding values. The method then generates a filtered decoded picture including the filtered-reconstructed current block.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 5, 2024
    Assignee: HFI INNOVATION INC.
    Inventors: Chia-Ming Tsai, Chih-Wei Hsu, Ching-Yeh Chen, Tzu-Der Chuang, Yu-Wen Huang
  • Patent number: 11924411
    Abstract: A method and a computing device are provided for video coding. The method may include deriving parameter ? and parameter ? for a CCLM mode by using a predetermined number of neighboring reconstructed luma samples and chroma samples in a CU; and generating a final chroma predictor for the chroma samples of the CU by using the parameter ? and the parameter ?.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: March 5, 2024
    Assignee: Beijing Dajia Internet Information Technology Co., Ltd.
    Inventors: Yi-Wen Chen, Xianglin Wang, Xiaoyu Xiu
  • Patent number: 11918702
    Abstract: Described herein are new methods for making lung bud organoids (LBOs) that have the capacity of developing into branching airways and alveolar structures that a least partially recapitulate human lung development from mammalian, preferably human, pluripotent stem cells including embryonic stem cells (ESCs) and induced pluripotent stem cells (IPSC), either by culturing branched LBO in a 3D matrix or by transplanting the LBO under the kidney capsule of immune deficient mice. Branched LBOs contain pulmonary endoderm and mesoderm compatible with pulmonary mesenchyme, and undergo branching morphogenesis. Also described are LBOs harboring certain mutations that induce a fibrotic phenotype, and methods of making same. The mutated (B)LBOs can be used for screening agents that may treat pulmonary fibrosis.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: March 5, 2024
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Hans-Willem Snoeck, Ya-Wen Chen
  • Publication number: 20240067855
    Abstract: A liquid alloy thermal paste comprises: a liquid alloy and a trace element, the liquid alloy and the trace element are stirred and reformed to a paste-like liquid alloy mixture that is viscous and does not flow easily, and the liquid alloy mixture is used as the liquid alloy thermal paste.
    Type: Application
    Filed: August 31, 2023
    Publication date: February 29, 2024
    Applicant: COOLER MATERIALS TECHNOLOGY INC.
    Inventors: Po-Wen CHENG, Jech-Wei CHEN
  • Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Publication number: 20240071950
    Abstract: Integrated circuit packages and methods of forming the same are discussed. In an embodiment, a device includes: a package substrate; a semiconductor device attached to the package substrate; an underfill between the semiconductor device and the package substrate; and a package stiffener attached to the package substrate, the package stiffener includes: a main body extending around the semiconductor device and the underfill in a top-down view, the main body having a first coefficient of thermal expansion; and pillars in the main body, each of the pillars extending from a top surface of the main body to a bottom surface of the main body, each of the pillars physically contacting the main body, the pillars having a second coefficient of thermal expansion, the second coefficient of thermal expansion being less than the first coefficient of thermal expansion.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Wen-Yi Lin, Kuang-Chun Lee, Chien-Chen Li, Chien-Li Kuo, Kuo-Chio Liu
  • Publication number: 20240073502
    Abstract: A camera module comprises a supporting member for supporting a sensor chip to move relative to a lens for correcting camera shake, a plurality of bulges is provided between the supporting member and a bottom plate. The bulges provide a reduced resistance to sliding on the supporting member. An electronic device using the module is also disclosed.
    Type: Application
    Filed: November 2, 2022
    Publication date: February 29, 2024
    Inventors: ZHUANG-ZHUANG JING, SHIN-WEN CHEN, JING-WEI LI, SHUAI-PENG LI, CONG CAO
  • Publication number: 20240071362
    Abstract: In example implementations, a computing device is provided. The computing device includes a system management bus, a controller communicatively coupled to the system management bus, a noise generating component communicatively coupled to the controller, a noise cancellation codec communicatively coupled to the system management bus, and a speaker communicatively coupled to the noise cancellation codec. The operating parameters of the noise generating component are provided to the controller. The noise cancellation codec is to receive the operating parameters of the noise generating component from the controller via the system management bus and to generate a noise cancellation signal based on the operating parameters. The speaker outputs the noise cancellation signal to cancel noise generated by the noise generating component.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Chao-Wen Cheng, Tsung Yen Chen, Wen Shih Chen, Mo-Hsuan Lin, Juiching Chang
  • Publication number: 20240071281
    Abstract: A display device includes a display panel and a circuit. For a first sub-pixel, the circuit obtains a corresponding second sub-pixel. The circuit calculates a first compensation value according to the grays levels of the first sub-pixel and the second sub-pixel, and calculates a second compensation value according to the polarity states of the first sub-pixel and the second sub-pixel and the difference between the gray levels of the two sub-pixels. The circuit also calculates a gain according to the position of the first sub-pixel, compensates the gray level to the first sub-pixel according to the first compensation value, the second compensation value and the gain to obtain an output gray level, and drives the first sub-pixel according to the output gray level.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 29, 2024
    Inventors: Cheng-Hsun LEE, Tsai Hsing CHEN, Cheng Che TSAI, Ching-Wen WANG
  • Publication number: 20240071854
    Abstract: Some implementations described herein a provide a multi-die package and methods of formation. The multi-die package includes a dynamic random access memory integrated circuit die over a system-on-chip integrated circuit die, and a heat transfer component between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, which may correspond to a dome-shaped structure, may be on a surface of the system-on-chip integrated circuit die and enveloped by an underfill material between the system-on-chip integrated circuit die and the dynamic random access memory integrated circuit die. The heat transfer component, in combination with the underfill material, may be a portion of a thermal circuit having one or more thermal conductivity properties to quickly spread and transfer heat within the multi-die package so that a temperature of the system-on-chip integrated circuit die satisfies a threshold.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Inventors: Wen-Yi LIN, Kuang-Chun LEE, Chien-Chen LI, Chien-Li KUO, Kuo-Chio LIU
  • Publication number: 20240069304
    Abstract: A voice coil motor held immobile by magnetic attraction when not in use for photography purposes includes a base, a magnet fixed thereto, a carrier, a magnetic member, and a coil. The magnetic member is fixed to the carrier and is attracted by a permanent magnetic field (first MF) of the magnet on the base. The coil is fixed to the carrier and the magnetic member. When the voice coil motor is powered on, the coil generates a second magnetic field (second MF) opposing the first MF. The second MF reduces or eliminates the attractive force of the first MF of the magnet, to separate the carrier and its fittings and allow them to work freely. A lens module and an electronic device are further provided.
    Type: Application
    Filed: September 30, 2022
    Publication date: February 29, 2024
    Inventors: YU-SHUAI LI, SHIN-WEN CHEN, KUN LI, JIAN-CHAO SONG, WU-TONG WANG, DING FENG
  • Patent number: 11914941
    Abstract: Systems, methods, and devices are described herein for integrated circuit (IC) layout validation. A plurality of IC patterns are collected which include a first set of patterns capable of being manufactured and a second set of patterns incapable of being manufactured. A machine learning model is trained using the plurality of IC patterns. The machine learning model generates a prediction model for validating IC layouts. The prediction model receives data including a set of test patterns comprising scanning electron microscope (SEM) images of IC patterns. Design violations associated with an IC layout are determined based on the SEM images and the plurality of IC patterns. A summary of the design violations is provided for further characterization of the IC layout.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Rachid Salik, Chin-Chang Hsu, Cheng-Chi Wu, Chien-Wen Chen, Wen-Ju Yang
  • Patent number: 11916126
    Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Hsin Hsu, Huan-Chi Ma, Chien-Wen Yu, Shih-Min Chou, Nien-Ting Ho, Ti-Bin Chen