Patents by Inventor Wen Chi Chen
Wen Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240114698Abstract: A semiconductor device includes a substrate, a bottom electrode, a ferroelectric layer, a noble metal electrode, and a non-noble metal electrode. The bottom electrode is over the substrate. The ferroelectric layer is over the bottom electrode. The noble metal electrode is over the ferroelectric layer. The non-noble metal electrode is over the noble metal electrode.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tzu-Yu CHEN, Sheng-Hung SHIH, Fu-Chen CHANG, Kuo-Chi TU, Wen-Ting CHU, Alexander KALNITSKY
-
Publication number: 20240111178Abstract: A contact lens comprises an optical zone and a peripheral zone. The optical zone is used for vision correction. The peripheral zone surrounds the optical zone. The optical zone and the peripheral zone jointly define a geometric center and a horizontal axis passing through the geometric center. Two stabilization zones symmetrically arranged relative to the geometric center are formed in the peripheral zone. These stabilization zones gradually thicken relative to a base curved surface of the peripheral zone.Type: ApplicationFiled: September 19, 2023Publication date: April 4, 2024Inventors: Chih-Cheng CHEN, Hsien Sheng LIAO, Wen Chi YANG
-
Patent number: 11948920Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.Type: GrantFiled: August 30, 2021Date of Patent: April 2, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou
-
Publication number: 20240101784Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.Type: ApplicationFiled: September 5, 2023Publication date: March 28, 2024Inventors: Chien-Hsin Wu, Ying-Chi Huang, Ying-Feng Lin, Wen-Chang Chen, Ho-Ching Huang, Ru-Jong Jeng
-
Publication number: 20240071455Abstract: The present disclosure relates to an integrated chip structure. The integrated chip structure includes a first source/drain region and a second source/drain region disposed within a substrate. A select gate is over the substrate between the first source/drain region and the second source/drain region. A ferroelectric random access memory (FeRAM) device is over the substrate between the select gate and the first source/drain region. A transistor device is disposed on an upper surface of the substrate. The substrate has a recessed surface that is below the upper surface of the substrate and that is laterally separated from the upper surface of the substrate by a boundary isolation structure extending into a trench within the upper surface of the substrate. The FeRAM device is arranged over the recessed surface.Type: ApplicationFiled: November 10, 2023Publication date: February 29, 2024Inventors: Tzu-Yu Chen, Kuo-Chi Tu, Wen-Ting Chu, Yong-Shiuan Tsair
-
Publication number: 20240074119Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.Type: ApplicationFiled: May 9, 2023Publication date: February 29, 2024Inventors: Ren-Chun CHANG, Wei-Chih LIN, Sheng-Chi WU, Wen-Yin TSAI, Li-Hsiu CHEN
-
Publication number: 20230305341Abstract: An electronic device is provided with an active area and a peripheral area, and includes a first substrate, a second substrate, a sealant frame, a conductive member and a wall structure. The second substrate is arranged opposite to the first substrate. The sealant frame is arranged on the first substrate and surrounds the active area. The conductive member is arranged on the peripheral area, wherein part of the conductive member is arranged between the first substrate and the second substrate. The wall structure is arranged between the first substrate and the second substrate, wherein the wall structure is arranged between the sealant frame and the conductive member when viewed in a top view direction.Type: ApplicationFiled: February 28, 2023Publication date: September 28, 2023Inventors: Cheng-Shen PAN, Cheng-Min WU, Yu-Lin HSIEH, Heng-Cheng SONG, Wen-Chi CHEN
-
Patent number: 11402407Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.Type: GrantFiled: December 10, 2020Date of Patent: August 2, 2022Assignee: MPI CorporationInventors: Zhi-Wei Su, Tzung-Je Tzeng, Wen-Chi Chen, Huo-Kang Hsu, Hsueh-Chih Wu, Sheng-Wei Lin, Chin-Yi Lin, Che-Wei Lin, Jian-Kai Hong, Shu-Jui Chang
-
Publication number: 20210181237Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.Type: ApplicationFiled: December 10, 2020Publication date: June 17, 2021Inventors: Zhi-Wei SU, Tzung-Je TZENG, Wen-Chi CHEN, Huo-Kang HSU, Hsueh-Chih WU, Sheng-Wei LIN, Chin-Yi LIN, Che-Wei LIN, Jian-Kai HONG, Shu-Jui CHANG
-
Publication number: 20200272253Abstract: A pressure sensing mouse including a pressure plate, a main body, a chassis, a main circuit board, and a pressure sensing component disposed on the main circuit board is provided. A central portion of an inner side of the pressure plate extends downwardly to provide a pressure spring element that is in direct contact with the pressure sensing component throughout the main body. The pressure sensing mouse is used in a software game for a tapping force type. When the user taps the pressure sensing mouse with the palm of a hand, an object in a corresponding software game will correspondingly generate a pressed game display result in the screen, therefore, better gaming experiences can be provided for users.Type: ApplicationFiled: February 14, 2020Publication date: August 27, 2020Inventors: WEN-CHI CHEN, YING-HWA TANG, CHIA-JUI YEH
-
Patent number: 10602273Abstract: An audio playing apparatus and an audio transmission circuit are provided. The audio playing apparatus includes a first audio connector, a second audio connector, a player, and an audio transmission circuit. The second audio connector has a different interface specification than an interface specification of the first audio connector. The audio transmission circuit is coupled to the first audio connector, the second audio connector and the player. The audio transmission circuit detects a power pin of the first audio connector and a power pin of the second audio connector to obtain a determination result, and selects one of the first audio connector and the second audio connector as a target connector according to the determination result, so as to transmit an audio signal associated with the target connector to the player.Type: GrantFiled: October 3, 2018Date of Patent: March 24, 2020Assignee: VIA Technologies, Inc.Inventor: Wen-Chi Chen
-
Publication number: 20200068306Abstract: An audio playing apparatus and an audio transmission circuit are provided. The audio playing apparatus includes a first audio connector, a second audio connector, a player, and an audio transmission circuit. The second audio connector has a different interface specification than an interface specification of the first audio connector. The audio transmission circuit is coupled to the first audio connector, the second audio connector and the player. The audio transmission circuit detects a power pin of the first audio connector and a power pin of the second audio connector to obtain a determination result, and selects one of the first audio connector and the second audio connector as a target connector according to the determination result, so as to transmit an audio signal associated with the target connector to the player.Type: ApplicationFiled: October 3, 2018Publication date: February 27, 2020Applicant: VIA Technologies, Inc.Inventor: Wen-Chi Chen
-
Patent number: 10570629Abstract: An edge finishing structure includes a spring plate base and an edge trimmer strip. The spring plate base includes a hook-up seat, an intermediate plate extending from a lower end of the hook-up seat, and a stop plate connected to the intermediate plate. The spring plate base is also provided with at least one coupling unit. The edge trimmer strip has a bottom portion mounted on the hook-up seat and the intermediate plate. The bottom portion is formed with a positioning groove corresponding to the hook-up seat. As such, the spring plate base and the edge trimmer strip can be mounted to an external circumference of board member. Various advantages can be achieved, including easily mounting of the edge trimmer strip, causing no deterioration to an outside appearance of the edge trimmer strip, and enhancing flexibility of variation of stylish shaping on a top portion of the edge trimmer strip.Type: GrantFiled: December 27, 2018Date of Patent: February 25, 2020Assignees: SHAN YEUN CO., LTD., 2145677 ALBERTA LTD.Inventor: Wen-Chi Chen
-
Patent number: 10494820Abstract: A connector is provided for jointing two boards to have the boards mounted to and lapping over a beam. The connector has one side that is formed with an engagement slot for jointing one board and an opposite side formed with a mortise trough for jointing another board. The connector also includes a path-following hole penetrating therethrough in an up-down direction and a track channel formed in a bottom of the connector and having an opening facing downward. The engagement slot and the mortise trough have axial directions that are perpendicular to an axial direction of the track channel. The path-following hole has a bottom opening located in the center of the track channel. The connector is adjustable of the position thereof through sliding along the beam by means of the track channel for limited axial movement.Type: GrantFiled: December 19, 2018Date of Patent: December 3, 2019Assignees: SHAN YEUN CO., LTD., 2145677 ALBERTA LTD.Inventor: Wen-Chi Chen
-
Patent number: 10355459Abstract: In a busbar assembly, a first busbar subassembly includes a first transmission unit having a first transmission busbar with a uniform width, and a first output unit having a first output busbar with a uniform width. One of the first transmission unit and the first output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof. A second busbar subassembly includes a second transmission unit having a second transmission busbar with a uniform width, and a second output unit having a second output busbar with a uniform width. One of the second transmission unit and the second output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof.Type: GrantFiled: May 15, 2017Date of Patent: July 16, 2019Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Wei-Hao Liang, Sheng-Chan Tu, Po-Jen Hsu, Yi-Wei Chen, Wen-Chi Chen
-
Patent number: 10305278Abstract: A voltage control system includes a first voltage converter, a second voltage converter and a voltage monitoring module. The first voltage converter is coupled to a first power source and configured to convert first electrical energy of the first power source into a first output voltage. The second voltage converter is coupled to a second power source and configured to convert second electrical energy of the second power source into a second output voltage. The voltage monitoring module is coupled to the first voltage converter and the second voltage converter. The voltage monitoring module is configured to regulate the first output voltage or the second output voltage by controlling the first voltage converter and the second voltage converter according to the first output voltage and the second output voltage.Type: GrantFiled: August 11, 2016Date of Patent: May 28, 2019Assignee: MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Chia-Sheng Chuang, Pei-Ching Kuo, Wen-Chi Chen
-
Patent number: D884465Type: GrantFiled: December 27, 2018Date of Patent: May 19, 2020Assignees: SHAN YEUN CO., LTD., 2145677 ALBERTA LTD.Inventor: Wen-Chi Chen
-
Patent number: D885369Type: GrantFiled: August 27, 2018Date of Patent: May 26, 2020Assignee: VIA Technologies, Inc.Inventor: Wen-Chi Chen
-
Patent number: D906098Type: GrantFiled: December 19, 2018Date of Patent: December 29, 2020Assignees: SHAN YEUN CO., LTD., 2145677 ALBERTA LTD.Inventor: Wen-Chi Chen
-
Patent number: D1019023Type: GrantFiled: March 30, 2020Date of Patent: March 19, 2024Assignee: Amazon Technologies, Inc.Inventors: Michael Edward James Paterson, Chia-Wei Chan, Mei Hsuan Chen, Benjamin Wild, Matthew J. England, Wen-Yo Lu, James Siminoff, Mark Siminoff, Yen-Chi Tsai