Patents by Inventor Wen Chi Chen
Wen Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10355459Abstract: In a busbar assembly, a first busbar subassembly includes a first transmission unit having a first transmission busbar with a uniform width, and a first output unit having a first output busbar with a uniform width. One of the first transmission unit and the first output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof. A second busbar subassembly includes a second transmission unit having a second transmission busbar with a uniform width, and a second output unit having a second output busbar with a uniform width. One of the second transmission unit and the second output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof.Type: GrantFiled: May 15, 2017Date of Patent: July 16, 2019Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology Corp.Inventors: Wei-Hao Liang, Sheng-Chan Tu, Po-Jen Hsu, Yi-Wei Chen, Wen-Chi Chen
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Patent number: 10305278Abstract: A voltage control system includes a first voltage converter, a second voltage converter and a voltage monitoring module. The first voltage converter is coupled to a first power source and configured to convert first electrical energy of the first power source into a first output voltage. The second voltage converter is coupled to a second power source and configured to convert second electrical energy of the second power source into a second output voltage. The voltage monitoring module is coupled to the first voltage converter and the second voltage converter. The voltage monitoring module is configured to regulate the first output voltage or the second output voltage by controlling the first voltage converter and the second voltage converter according to the first output voltage and the second output voltage.Type: GrantFiled: August 11, 2016Date of Patent: May 28, 2019Assignee: MSI COMPUTER (SHENZHEN) CO., LTD.Inventors: Chia-Sheng Chuang, Pei-Ching Kuo, Wen-Chi Chen
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Patent number: 10305290Abstract: A current regulation system includes a current regulation module and a current distribution module. The current regulation module is coupled to a first power source and a second power source. The current regulation module is configured to derive a first current from the first power source, and derive a second current from the second power source when coupled to a load. The current distribution module is coupled to the first power source, the second power source and the current regulation module. The current distribution module makes the current regulation module regulate the first current and the second current according to a first electric quantity of the first power source and second electric quantity of the second power source.Type: GrantFiled: August 11, 2016Date of Patent: May 28, 2019Assignee: MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chia-Sheng Chuang, Pei-Ching Kuo, Wen-Chi Chen
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Publication number: 20180048127Abstract: In a busbar assembly, a first busbar subassembly includes a first transmission unit having a first transmission busbar with a uniform width, and a first output unit having a first output busbar with a uniform width. One of the first transmission unit and the first output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof. A second busbar subassembly includes a second transmission unit having a second transmission busbar with a uniform width, and a second output unit having a second output busbar with a uniform width. One of the second transmission unit and the second output unit has a bent structure with a bend line perpendicular to a line of a lengthwise direction thereof.Type: ApplicationFiled: May 15, 2017Publication date: February 15, 2018Inventors: WEI-HAO LIANG, SHENG-CHAN TU, PO-JEN HSU, YI-WEI CHEN, WEN-CHI CHEN
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Publication number: 20170346298Abstract: A voltage control system includes a first voltage converter, a second voltage converter and a voltage monitoring module. The first voltage converter is coupled to a first power source and configured to convert first electrical energy of the first power source into a first output voltage. The second voltage converter is coupled to a second power source and configured to convert second electrical energy of the second power source into a second output voltage. The voltage monitoring module is coupled to the first voltage converter and the second voltage converter. The voltage monitoring module is configured to regulate the first output voltage or the second output voltage by controlling the first voltage converter and the second voltage converter according to the first output voltage and the second output voltage.Type: ApplicationFiled: August 11, 2016Publication date: November 30, 2017Applicant: MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chia-Sheng CHUANG, Pei-Ching KUO, Wen-Chi CHEN
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Publication number: 20170346297Abstract: A current regulation system includes a current regulation module and a current distribution module. The current regulation module is coupled to a first power source and a second power source. The current regulation module is configured to derive a first current from the first power source, and derive a second current from the second power source when coupled to a load. The current distribution module is coupled to the first power source, the second power source and the current regulation module. The current distribution module makes the current regulation module regulate the first current and the second current according to a first electric quantity of the first power source and second electric quantity of the second power source.Type: ApplicationFiled: August 11, 2016Publication date: November 30, 2017Applicant: MSI COMPUTER (SHENZHEN) CO.,LTD.Inventors: Chia-Sheng CHUANG, Pei-Ching KUO, Wen-Chi CHEN
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Patent number: 9755902Abstract: A server includes a first module that receives information from a plurality of systems. Each system of the plurality of systems includes functional units that are dynamically configurable during operation of the system. The information from each system of the plurality of systems includes performance data collected while executing a program when the functional units are configured according to a configuration setting respective to the system. The server also includes a second module that analyzes the received information to select a best-performing configuration setting of the configuration settings received from the plurality of systems. The server also includes a third module that provides a new configuration setting to the plurality of systems. The new configuration setting is a modification of the best-performing configuration.Type: GrantFiled: September 2, 2014Date of Patent: September 5, 2017Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.Inventors: Wen-Chi Chen, Rodney E. Hooker
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Patent number: 9575778Abstract: A system includes functional units that are dynamically configurable during operation of the system. The system also includes a first module that collects performance data while the system executes a program with the functional units configured according to a configuration setting. The system also includes a second module that sends information to a server. The information includes the performance data, the configuration setting and data from which the program may be identified. The system also includes a third module that instructs the system to re-configure the functional units with a new configuration setting received from the server while the program is being executed by the system. The new configuration setting is based on analysis by the server of the information sent by the system and of similar information sent by other systems that include the dynamically configurable functional units.Type: GrantFiled: September 2, 2014Date of Patent: February 21, 2017Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.Inventors: Wen-Chi Chen, Rodney E. Hooker
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Publication number: 20150341218Abstract: A server includes a first module that receives information from a plurality of systems. Each system of the plurality of systems includes functional units that are dynamically configurable during operation of the system. The information from each system of the plurality of systems includes performance data collected while executing a program when the functional units are configured according to a configuration setting respective to the system. The server also includes a second module that analyzes the received information to select a best-performing configuration setting of the configuration settings received from the plurality of systems. The server also includes a third module that provides a new configuration setting to the plurality of systems. The new configuration setting is a modification of the best-performing configuration.Type: ApplicationFiled: September 2, 2014Publication date: November 26, 2015Inventors: WEN-CHI CHEN, RODNEY E. HOOKER
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Publication number: 20150339132Abstract: A system includes functional units that are dynamically configurable during operation of the system. The system also includes a first module that collects performance data while the system executes a program with the functional units configured according to a configuration setting. The system also includes a second module that sends information to a server. The information includes the performance data, the configuration setting and data from which the program may be identified. The system also includes a third module that instructs the system to re-configure the functional units with a new configuration setting received from the server while the program is being executed by the system. The new configuration setting is based on analysis by the server of the information sent by the system and of similar information sent by other systems that include the dynamically configurable functional units.Type: ApplicationFiled: September 2, 2014Publication date: November 26, 2015Inventors: WEN-CHI CHEN, RODNEY E. HOOKER
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Publication number: 20150290272Abstract: The present invention provides a composition for use in the treatment of brain injury and cerebral stoke patients. The composition comprising an effective amount of Astragalus membranaceus extract and pharmaceutically acceptable carrier, excipients or salts. The brain injury includes the traumatic brain injury (TBI) and the acquired brain injury (ABI). The cerebral stoke includes the cerebral ischemia stroke and the cerebral hemorrhage stroke.Type: ApplicationFiled: April 9, 2015Publication date: October 15, 2015Inventors: Wen-Chi CHEN, Hsiao-Chien CHENG, Datsen George WEI
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Patent number: 9137928Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.Type: GrantFiled: June 26, 2013Date of Patent: September 15, 2015Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Wen-Chi Chen, Yi-Jen Lu, Ya-Tung I
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Patent number: 8933719Abstract: A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe heads. The locating plate may include fixed portions. Each sub-probe head may include corresponding sub-dies and probes inserted between the sub-dies, and each sub-probe head is assembled and fixed in the corresponding fixed portion. Therefore, the layout area of the probes in the vertical probe card can be respectively differentiated or segmented from the sub-probe heads in order to avoid mutual interference under repair process. In addition, a related method for assembling and aligning the above mentioned combined probe head is provided.Type: GrantFiled: July 25, 2011Date of Patent: January 13, 2015Assignee: MPI CorporationInventors: Chao-Ching Huang, Wen-Chi Chen, Chiu-Chu Chang
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Patent number: 8877560Abstract: A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.Type: GrantFiled: July 16, 2013Date of Patent: November 4, 2014Assignee: Lite-On Technology Corp.Inventors: Wen-Chi Chen, Ming-Feng Tang, Chung-Fu Wang
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Publication number: 20140022731Abstract: A method for assembling a heat generating element and a heat dissipating element includes: preparing a pressure sensitive element including a pressure sensitive layer and first and second release films connected to the pressure sensitive layer; separating the second release film from the pressure sensitive layer and then adhering a heat dissipating element to the pressure sensitive layer; forcing the first release film; separating the first release film from the pressure sensitive layer, and then adhering a heat generating element to the pressure sensitive layer; and fixedly attaching the heat generating element onto the pressure sensitive layer. A pressure sensitive element and a power supplying unit are also disclosed.Type: ApplicationFiled: July 16, 2013Publication date: January 23, 2014Inventors: WEN-CHI CHEN, MING-FENG TANG, CHUNG-FU WANG
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Publication number: 20140009891Abstract: The instant disclosure relates to a planar heat dissipation structure, which comprises a first electrically insulating and thermally conductive layer having a thermal conductivity coefficient greater than 0.5 W/mK and a metal layer chemically bonded to and in thermal contact with the first electrically insulating and thermally conductive layer. The planar heat dissipation structure forms a one-piece structure that is configurable from a substantially planar collapsed state to a folded three-dimensional state, and defines a base portion and at least one flap portion configured to be foldable with respect to the base portion thereon, such that the first electrically insulating and thermally conductive layer constitutes an inner surface of the planar heat dissipation structure to define a covering space. The instant disclosure also discloses an electronic device that utilizes said foldable planar heat dissipation structure.Type: ApplicationFiled: June 26, 2013Publication date: January 9, 2014Inventors: WEN-CHI CHEN, YI-JEN LU, YA-TUNG I
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Patent number: 8465307Abstract: The instant disclosure relates to a power supply unit that is compatible with different plug types and can be plugged to the power outlet at different directions. The power supply unit comprises a main body and a plug. The plug can be assembled to and connected electrically with the main body with ease. The power supply unit can be used more broadly in different regions and provide more options when plugging to the power outlet.Type: GrantFiled: November 3, 2011Date of Patent: June 18, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Shuo-Jen Shieh, Yi-Sheng Liu, Wen-Chi Chen
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Publication number: 20120322290Abstract: The instant disclosure relates to a power supply unit that is compatible with different plug types and can be plugged to the power outlet at different directions. The power supply unit comprises a main body and a plug. The plug can be assembled to and connected electrically with the main body with ease. The power supply unit can be used more broadly in different regions and provide more options when plugging to the power outlet.Type: ApplicationFiled: November 3, 2011Publication date: December 20, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: SHUO-JEN SHIEH, YI-SHENG LIU, WEN-CHI CHEN
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Publication number: 20120147565Abstract: A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.Type: ApplicationFiled: December 6, 2011Publication date: June 14, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GZ) CO., LTD.Inventors: Ya-Tung I, Wen-Chi Chen, Chien-Chung Hsu, Yi-Jen Lu, Pao-Hsiu Fan
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Publication number: 20120025859Abstract: A combined probe head being disposed in a space transformer of a vertical probe card is provided, in which the combined probe head is used for differentiating or segmenting a layout area of the probes in the vertical probe card. The combined probe head may include a locating plate and sub-probe heads. The locating plate may include fixed portions. Each sub-probe head may include corresponding sub-dies and probes inserted between the sub-dies, and each sub-probe head is assembled and fixed in the corresponding fixed portion. Therefore, the layout area of the probes in the vertical probe card can be respectively differentiated or segmented from the sub-probe heads in order to avoid mutual interference under repair process. In addition, a related method for assembling and aligning the above mentioned combined probe head is provided.Type: ApplicationFiled: July 25, 2011Publication date: February 2, 2012Inventors: Chao-Ching HUANG, Wen-Chi Chen, Chiu-Chu Chang