Patents by Inventor Wen-Chia Liao
Wen-Chia Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230111542Abstract: A bidirectional GaN FET with a single gate formed by integrating a single-gate bidirectional GaN FET in parallel with a bidirectional device formed of two back-to-back GaN FETs with a common source. The single-gate bidirectional GaN FET occupies most of the integrated circuit die, such that the integrated device has a low channel resistance, while also capturing the advantages of a back-to-back bidirectional GaN FET device.Type: ApplicationFiled: October 7, 2022Publication date: April 13, 2023Inventors: Wen-Chia Liao, Jianjun Cao, Robert Beach, Zhikai Tang, Edward Lee
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Patent number: 11296195Abstract: A semiconductor device includes a substrate, an active layer, a source electrode, a drain electrode, a p-type doped layer, a gate electrode, a passivation layer, and a field plate. The active layer is disposed on the substrate. The source electrode, the drain electrode and the p-type doped layer are disposed on the active layer. The p-type doped layer is disposed between the source electrode and the drain electrode, and has a first thickness. The gate electrode is disposed on the p-type doped layer. The passivation layer covers the gate electrode and the active layer. The field plate is disposed on the passivation layer and is electrically connected to the source electrode. The field plate includes a field dispersion portion disposed between the gate electrode and the drain electrode. The passivation layer between the field dispersion portion and the active layer has a second thickness smaller than the first thickness.Type: GrantFiled: September 30, 2020Date of Patent: April 5, 2022Assignee: DELTA ELECTRONICS, INC.Inventor: Wen-Chia Liao
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Patent number: 11127845Abstract: A semiconductor structure is provided, which includes a semiconductor device, a first conductive layer, and a gate runner. The semiconductor device includes an upper surface, a gate terminal, a source terminal, and a drain terminal. The first conductive layer is deposited on the upper surface and coupled to the source terminal. The gate runner is overlapped with the first conductive layer and coupled to the gate terminal. The gate runner and the first conductive layer are configured to contribute a parasitic capacitance between the gate terminal and the source terminal.Type: GrantFiled: December 7, 2018Date of Patent: September 21, 2021Assignee: DELTA ELECTRONICS, INC.Inventors: Wen-Chia Liao, Ying-Chen Liu, Chen-Ting Chiang
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Patent number: 11101349Abstract: A lateral power semiconductor device with a metal interconnect layout for low on-resistance. The metal interconnect layout includes first, second, and third metal layers, each of which include source bars and drain bars. Source bars in the first, second, and third metal layers are electrically connected. Drain bars in the first, second, and third metal layers are electrically connected. In one embodiment, the first and second metal layers are parallel, and the third metal layer is perpendicular to the first and second metal layers. In another embodiment, the first and third metal layer are parallel, and the second metal layer is perpendicular to the first and third metal layers. A nonconductive layer ensures solder bumps electrically connect to only source bars or only drain bars. As a result, a plurality of available pathways exists and enables current to take any of the plurality of available pathways.Type: GrantFiled: August 29, 2019Date of Patent: August 24, 2021Assignee: Efficient Power Conversion CorporationInventors: Wen-Chia Liao, Jianjun Cao, Fang Chang Liu, Muskan Sharma
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Publication number: 20210013312Abstract: A semiconductor device includes a substrate, an active layer, a source electrode, a drain electrode, a p-type doped layer, a gate electrode, a passivation layer, and a field plate. The active layer is disposed on the substrate. The source electrode, the drain electrode and the p-type doped layer are disposed on the active layer. The p-type doped layer is disposed between the source electrode and the drain electrode, and has a first thickness. The gate electrode is disposed on the p-type doped layer. The passivation layer covers the gate electrode and the active layer. The field plate is disposed on the passivation layer and is electrically connected to the source electrode. The field plate includes a field dispersion portion disposed between the gate electrode and the drain electrode. The passivation layer between the field dispersion portion and the active layer has a second thickness smaller than the first thickness.Type: ApplicationFiled: September 30, 2020Publication date: January 14, 2021Inventor: Wen-Chia LIAO
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Patent number: 10854720Abstract: A semiconductor device includes a substrate, an active layer, a source electrode, a drain electrode, a p-type doped layer, a gate electrode, a passivation layer, and a field plate. The active layer is disposed on the substrate. The source electrode, the drain electrode and the p-type doped layer are disposed on the active layer. The p-type doped layer is disposed between the source electrode and the drain electrode, and has a first thickness. The gate electrode is disposed on the p-type doped layer. The passivation layer covers the gate electrode and the active layer. The field plate is disposed on the passivation layer and is electrically connected to the source electrode. The field plate includes a field dispersion portion disposed between the gate electrode and the drain electrode. The passivation layer between the field dispersion portion and the active layer has a second thickness smaller than the first thickness.Type: GrantFiled: January 30, 2019Date of Patent: December 1, 2020Assignee: DELTA ELECTRONICS, INC.Inventor: Wen-Chia Liao
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Patent number: 10833185Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, a source pad, a drain pad, and a source external connecting element. The source electrode, the drain electrode, and the gate electrode are disposed on an active region of the active layer. The source pad is electrically connected to the source electrode and includes a body portion, a plurality of branch portions, and a current diffusion portion. The body portion is at least partially disposed on the active region of the active layer. The current diffusion portion interconnects the body portion and the branch portions. A width of the current diffusion portion is greater than a width of the branch portion and less than a half of a width of the body portion. The source external connecting element is disposed on the body portion and spaced from the current diffusion portion.Type: GrantFiled: August 15, 2017Date of Patent: November 10, 2020Assignee: DELTA ELECTRONICS, INC.Inventors: Wen-Chia Liao, Ying-Chen Liu, Chen-Ting Chiang
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Patent number: 10680090Abstract: A semiconductor structure is provided, which includes a semiconductor device, a first conductive layer, and a gate runner. The semiconductor device includes an upper surface, a gate terminal, a source terminal, and a drain terminal. The first conductive layer is deposited on the upper surface and coupled to the source terminal. The gate runner is overlapped with the first conductive layer and coupled to the gate terminal. The gate runner and the first conductive layer are configured to contribute a parasitic capacitance between the gate terminal and the source terminal.Type: GrantFiled: July 20, 2017Date of Patent: June 9, 2020Assignee: DELTA ELECTRONICS, INC.Inventors: Wen-Chia Liao, Ying-Chen Liu, Chen-Ting Chiang
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Publication number: 20200075726Abstract: A lateral power semiconductor device with a metal interconnect layout for low on-resistance. The metal interconnect layout includes first, second, and third metal layers, each of which include source bars and drain bars. Source bars in the first, second, and third metal layers are electrically connected. Drain bars in the first, second, and third metal layers are electrically connected. In one embodiment, the first and second metal layers are parallel, and the third metal layer is perpendicular to the first and second metal layers. In another embodiment, the first and third metal layer are parallel, and the second metal layer is perpendicular to the first and third metal layers. A nonconductive layer ensures solder bumps electrically connect to only source bars or only drain bars. As a result, a plurality of available pathways exists and enables current to take any of the plurality of available pathways.Type: ApplicationFiled: August 29, 2019Publication date: March 5, 2020Inventors: Wen-Chia Liao, Jianjun Cao, Fang Chang Liu, Muskan Sharma
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Patent number: 10573736Abstract: A semiconductor device including an active layer made of III-V group semiconductors, a source electrode and a drain electrode disposed on the active layer, a gate electrode disposed on or above the active layer and between the source electrode and the drain electrode, an interlayer dielectric covering the source electrode, the drain electrode, and the gate electrode and having a plurality of inter-gate via holes. The semiconductor device further includes an inter-source layer, an inter-drain layer, and an inter-gate layer disposed on the interlayer dielectric. The semiconductor device further includes an inter-gate plug filled in the inter-gate via hole and electrically connected to the gate electrode and the inter-gate layer, and a gate field plate being separated from the gate electrode and electrically connected to the gate electrode through the inter-gate layer.Type: GrantFiled: September 25, 2019Date of Patent: February 25, 2020Assignee: DELTA ELECTRONICS, INC.Inventors: Li-Fan Lin, Chun-Chieh Yang, Wen-Chia Liao, Ching-Chuan Shiue, Shih-Peng Chen
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Publication number: 20200020791Abstract: A semiconductor device including an active layer made of III-V group semiconductors, a source electrode and a drain electrode disposed on the active layer, a gate electrode disposed on or above the active layer and between the source electrode and the drain electrode, an interlayer dielectric covering the source electrode, the drain electrode, and the gate electrode and having a plurality of inter-gate via holes. The semiconductor device further includes an inter-source layer, an inter-drain layer, and an inter-gate layer disposed on the interlayer dielectric. The semiconductor device further includes an inter-gate plug filled in the inter-gate via hole and electrically connected to the gate electrode and the inter-gate layer, and a gate field plate being separated from the gate electrode and electrically connected to the gate electrode through the inter-gate layer.Type: ApplicationFiled: September 25, 2019Publication date: January 16, 2020Inventors: Li-Fan LIN, Chun-Chieh YANG, Wen-Chia LIAO, Ching-Chuan SHIUE, Shih-Peng CHEN
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Patent number: 10468516Abstract: A semiconductor device including an active layer made of III-V group semiconductors, a source electrode and a drain electrode disposed on the active layer, a gate electrode disposed on or above the active layer and between the source electrode and the drain electrode, an interlayer dielectric covering the source electrode, the drain electrode, and the gate electrode and having a plurality of inter-gate via holes. The semiconductor device further includes an inter-source layer, an inter-drain layer, and an inter-gate layer disposed on the interlayer dielectric. The semiconductor device further includes an inter-gate plug filled in the inter-gate via hole and electrically connected to the gate electrode and the inter-gate layer, and a gate field plate being separated from the gate electrode and electrically connected to the gate electrode through the inter-gate layer.Type: GrantFiled: July 23, 2018Date of Patent: November 5, 2019Assignee: DELTA ELECTRONICS, INC.Inventors: Li-Fan Lin, Chun-Chieh Yang, Wen-Chia Liao, Ching-Chuan Shiue, Shih-Peng Chen
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Publication number: 20190172915Abstract: A semiconductor device includes a substrate, an active layer, a source electrode, a drain electrode, a p-type doped layer, a gate electrode, a passivation layer, and a field plate. The active layer is disposed on the substrate. The source electrode, the drain electrode and the p-type doped layer are disposed on the active layer. The p-type doped layer is disposed between the source electrode and the drain electrode, and has a first thickness. The gate electrode is disposed on the p-type doped layer. The passivation layer covers the gate electrode and the active layer. The field plate is disposed on the passivation layer and is electrically connected to the source electrode. The field plate includes a field dispersion portion disposed between the gate electrode and the drain electrode. The passivation layer between the field dispersion portion and the active layer has a second thickness smaller than the first thickness.Type: ApplicationFiled: January 30, 2019Publication date: June 6, 2019Inventor: Wen-Chia LIAO
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Publication number: 20190109221Abstract: A semiconductor structure is provided, which includes a semiconductor device, a first conductive layer, and a gate runner. The semiconductor device includes an upper surface, a gate terminal, a source terminal, and a drain terminal. The first conductive layer is deposited on the upper surface and coupled to the source terminal. The gate runner is overlapped with the first conductive layer and coupled to the gate terminal. The gate runner and the first conductive layer are configured to contribute a parasitic capacitance between the gate terminal and the source terminal.Type: ApplicationFiled: December 7, 2018Publication date: April 11, 2019Inventors: Wen-Chia LIAO, Ying-Chen LIU, Chen-Ting CHIANG
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Patent number: 10229978Abstract: A semiconductor device includes a substrate, an active layer, a source electrode, a drain electrode, a p-type doped layer, a gate electrode, a passivation layer, and a field plate. The active layer is disposed on the substrate. The source electrode, the drain electrode and the p-type doped layer are disposed on the active layer. The p-type doped layer is disposed between the source electrode and the drain electrode, and has a first thickness. The gate electrode is disposed on the p-type doped layer. The passivation layer covers the gate electrode and the active layer. The field plate is disposed on the passivation layer and is electrically connected to the source electrode. The field plate includes a field dispersion portion disposed between the gate electrode and the drain electrode. The passivation layer between the field dispersion portion and the active layer has a second thickness smaller than the first thickness.Type: GrantFiled: May 29, 2015Date of Patent: March 12, 2019Assignee: DELTA ELECTRONICS, INC.Inventor: Wen-Chia Liao
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Publication number: 20190027593Abstract: A semiconductor structure is provided, which includes a semiconductor device, a first conductive layer, and a gate runner. The semiconductor device includes an upper surface, a gate terminal, a source terminal, and a drain terminal. The first conductive layer is deposited on the upper surface and coupled to the source terminal. The gate runner is overlapped with the first conductive layer and coupled to the gate terminal. The gate runner and the first conductive layer are configured to contribute a parasitic capacitance between the gate terminal and the source terminal.Type: ApplicationFiled: July 20, 2017Publication date: January 24, 2019Inventors: Wen-Chia LIAO, Ying-Chen LIU, Chen-Ting CHIANG
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Publication number: 20190006504Abstract: A semiconductor device including an active layer made of III-V group semiconductors, a source electrode and a drain electrode disposed on the active layer, a gate electrode disposed on or above the active layer and between the source electrode and the drain electrode, an interlayer dielectric covering the source electrode, the drain electrode, and the gate electrode and having a plurality of inter-gate via holes. The semiconductor device further includes an inter-source layer, an inter-drain layer, and an inter-gate layer disposed on the interlayer dielectric. The semiconductor device further includes an inter-gate plug filled in the inter-gate via hole and electrically connected to the gate electrode and the inter-gate layer, and a gate field plate being separated from the gate electrode and electrically connected to the gate electrode through the inter-gate layer.Type: ApplicationFiled: July 23, 2018Publication date: January 3, 2019Inventors: Li-Fan LIN, Chun-Chieh YANG, Wen-Chia LIAO, Ching-Chuan SHIUE, Shih-Peng CHEN
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Patent number: 10084076Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, an interlayer dielectric, an inter-source layer, an inter-source plug, an inter-drain layer, an inter-drain plug, an inter-gate layer, and an inter-gate plug. The active layer is made of III-V group semiconductors. The source electrode, the drain electrode, and the gate electrode are disposed on the active layer. The gate electrode is disposed between the source electrode and the drain electrode. The interlayer dielectric covers the source electrode, the drain electrode, and the gate electrode. The inter-source layer, the inter-drain layer, and the inter-gate layer are disposed on the interlayer dielectric. The inter-source plug is electrically connected to the source electrode and the inter-source layer. The inter-drain plug is electrically connected to the drain electrode and the inter-drain layer. The inter-gate plug is electrically connected to the gate electrode and the inter-gate layer.Type: GrantFiled: October 18, 2016Date of Patent: September 25, 2018Assignee: DELTA ELECTRONICS, INC.Inventors: Li-Fan Lin, Chun-Chieh Yang, Wen-Chia Liao, Ching-Chuan Shiue, Shih-Peng Chen
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Publication number: 20180026125Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, a source pad, a drain pad, and a source external connecting element. The source electrode, the drain electrode, and the gate electrode are disposed on an active region of the active layer. The source pad is electrically connected to the source electrode and includes a body portion, a plurality of branch portions, and a current diffusion portion. The body portion is at least partially disposed on the active region of the active layer. The current diffusion portion interconnects the body portion and the branch portions. A width of the current diffusion portion is greater than a width of the branch portion and less than a half of a width of the body portion. The source external connecting element is disposed on the body portion and spaced from the current diffusion portion.Type: ApplicationFiled: August 15, 2017Publication date: January 25, 2018Inventors: Wen-Chia LIAO, Ying-Chen LIU, Chen-Ting CHIANG
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Patent number: 9793370Abstract: A semiconductor device includes a substrate, a channel layer, a spacer layer, a barrier layer, and an oxidized cap layer. The channel layer is disposed on or above the substrate. The spacer layer is disposed on the channel layer. The barrier layer is disposed on the spacer layer. The oxidized cap layer is disposed on the barrier layer. The oxidized cap layer is made of oxynitride.Type: GrantFiled: May 26, 2015Date of Patent: October 17, 2017Assignee: DELTA ELECTRONICS, INC.Inventor: Wen-Chia Liao