Patents by Inventor Wen-Chieh Wang

Wen-Chieh Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10411088
    Abstract: A semiconductor device including a substrate and a shallow trench isolation (STI) structure is provided. The substrate has a first voltage area and a second voltage area. A top surface of the substrate in the second voltage area is higher than a top surface of the substrate in the first voltage area, and a trench is defined in the substrate in between the first and second voltage area. The STI structure is located in the substrate within the trench, wherein a first portion of the STI structure is located in the first voltage area, a second portion of the STI structure is located in the second voltage area, and a step height difference exist in between a bottom surface of the first portion of the STI structure in the first voltage area and a bottom surface of the second portion of the STI structure in the second voltage area.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: September 10, 2019
    Assignee: United Microelectronics Corp.
    Inventors: Chang-Po Hsiung, Ping-Hung Chiang, Shih-Chieh Pu, Chia-Lin Wang, Nien-Chung Li, Wen-Fang Lee, Shih-Yin Hsiao, Chih-Chung Wang
  • Patent number: 10388564
    Abstract: A memory device with a dielectric layer or an air gap between contacts and a method of making the same are disclosed. The method comprises a series of steps including forming a plurality of conductive lines having trenches therebetween; forming a contact layer in the trench; and forming a dielectric layer interposed in the contact layer and configured to divide the contact layer into two contacts. The method also comprises removing the dielectric layer to form a space and forming a cap layer over the two contacts to form an air gap therein. The method further comprises forming a second air gap between the conductive line and the two contacts.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: August 20, 2019
    Assignee: Micron Technology, Inc.
    Inventors: Tieh-Chiang Wu, Wen-Chieh Wang, Sheng-Wei Yang
  • Publication number: 20190252251
    Abstract: A memory device with a dielectric layer or an air gap between contacts and a method of making the same are disclosed. The method comprises a series of steps including forming a plurality of conductive lines having trenches therebetween; forming a contact layer in the trench; and forming a dielectric layer interposed in the contact layer and configured to divide the contact layer into two contacts. The method also comprises removing the dielectric layer to form a space and forming a cap layer over the two contacts to form an air gap therein. The method further comprises forming a second air gap between the conductive line and the two contacts.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Inventors: Tieh-Chiang Wu, Wen-Chieh Wang, Sheng-Wei Yang
  • Publication number: 20190244999
    Abstract: An image sensor device includes a pixel array, a control circuit, an interconnect structure, and a conductive layer. The pixel array is disposed on a device substrate within a pixel region. The control circuit disposed on the device substrate within a circuit region, the control circuit being adjacent and electrically coupled to the pixel array. The interconnect structure overlies and electrically connects the control circuit and the pixel array. The interconnect structure includes interconnect metal layers separated from each other by inter-metal dielectric layers and vias that electrically connect between metal traces of the interconnect layers. The conductive layer disposed over the interconnect structure and electrically connected to the interconnect structure by an upper via disposed through an upper inter-metal dielectric layer therebetween. The conductive layer extends laterally within outermost edges of the interconnect structure and within the pixel region and the circuit region.
    Type: Application
    Filed: April 18, 2019
    Publication date: August 8, 2019
    Inventors: Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin
  • Patent number: 10374643
    Abstract: A transmitter with compensating mechanism of pulling effect includes an output unit and a correction unit. The output unit mixes a first correction signal and a second correction signal according to an oscillating signal to generate a modulated signal, and to amplify the modulated signal to generate a first output signal. The correction unit analyzes the power of the first output signal to generate a first coefficient and a second coefficient, and generate the first correction signal and the second correction signal according to the first coefficient, the second coefficient, an in-phase data signal, and a quadrature data signal.
    Type: Grant
    Filed: December 26, 2016
    Date of Patent: August 6, 2019
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Wen-Shan Wang, Yuan-Shuo Chang, Chih-Chieh Wang
  • Patent number: 10361209
    Abstract: A manufacturing method of a semiconductor memory device includes following steps. Bit line structures and storage node contacts are formed on a semiconductor substrate. A first sidewall spacer is formed on sidewalls of each bit line structure. A conductive layer covering the bit line structures, the first sidewall spacer, and the storage node contacts is formed. A first patterning process is preformed to the conductive layer for forming stripe contact structures. Each stripe contact structure is elongated in the first direction and corresponding to the storage node contacts. The first sidewall spacer at a first side of each bit line structure is exposed by the first patterning process. The first sidewall spacer at a second side of each bit line structure is covered by the stripe contact structures. The first sidewall spacer exposed by the first patterning process is removed for forming first air spacers.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: July 23, 2019
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Ying-Chiao Wang, Li-Wei Feng, Chien-Ting Ho, Wen-Chieh Lu, Li-Wei Liu
  • Patent number: 10360339
    Abstract: Provided is an integrated circuit (IC) manufacturing method. The method includes receiving an IC design layout, wherein the IC design layout includes multiple IC regions and each of the IC regions includes an initial IC pattern. The method further includes performing a correction process to a first IC region, thereby modifying the initial IC pattern in the first IC region to result in a first corrected IC pattern in the first IC region, wherein the correction process includes location effect correction. The method further includes replacing the initial IC pattern in a second IC region with the first corrected IC pattern.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: July 23, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Chun Wang, Ching-Hsu Chang, Chun-Hung Wu, Cheng Kun Tsai, Feng-Ju Chang, Feng-Lung Lin, Ming-Hsuan Wu, Ping-Chieh Wu, Ru-Gun Liu, Wen-Chun Huang, Wen-Hao Liu
  • Publication number: 20190219061
    Abstract: A fan failure backup apparatus includes a first fan module and a second fan module. When a second control unit of the second fan module realizes that the first fan module is failed through a first control unit of the first fan module, and the second control unit realizes that the second fan module is not failed, the second control unit controls the second fan module to additionally enhance a pressure-flow characteristic of a second fan unit of the second fan module.
    Type: Application
    Filed: November 26, 2018
    Publication date: July 18, 2019
    Inventors: Wei-Shuo TSENG, Chia-Feng WU, Po-Hui SHEN, Chia-Huang WU, Chun-Chieh TSAI, Wen-Chih WANG
  • Publication number: 20190206982
    Abstract: A semiconductor memory device includes a semiconductor substrate, a first support layer, a first electrode, a capacitor dielectric layer, and a second electrode. The first support layer is disposed on the semiconductor substrate. The first electrode is disposed on the semiconductor substrate and penetrates the first support layer. The capacitor dielectric layer is disposed on the first electrode. The second electrode is disposed on the semiconductor substrate, and at least a part of the capacitor dielectric layer is disposed between the first electrode and the second electrode. The first support layer includes a carbon doped nitride layer, and a carbon concentration of a bottom portion of the first support layer is higher than a carbon concentration of a top portion of the first support layer.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Tzu-Chin Wu, Wei-Hsin Liu, Yi-Wei Chen, Chia-Lung Chang, Jui-Min Lee, Po-Chun Chen, Li-Wei Feng, Ying-Chiao Wang, Wen-Chieh Lu, Chien-Ting Ho, Tsung-Ying Tsai, Kai-Ping Chen
  • Patent number: 10324349
    Abstract: A reflectance-adjustable reflector including a phase modulation element and a first polarizer is provided. The phase modulation element includes a first substrate, a second substrate opposite to the first substrate, a phase modulation layer located between the first substrate and the second substrate, a first electrode layer located between the first substrate and the phase modulation layer, and a second electrode layer located between the second substrate and the phase modulation layer. Thicknesses of the first substrate and the second substrate are between 0.01 mm and 0.5 mm. The first polarizer is disposed on the first substrate. The first substrate is located between the first polarizer and the first electrode layer. A total thickness of the phase modulation element and the first polarizer is less than 1 mm. A reflectance-adjustable display device is also provided.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: June 18, 2019
    Assignee: Coretronic Corporation
    Inventors: Chong-Yang Fang, Wen-Chun Wang, Cheng-Chieh Liu
  • Publication number: 20190171941
    Abstract: An electronic device comprises a data transmitting interface configured to transmit data, a memory configured to store the data, a processor configured to execute an application program, and an accelerator coupled to the processor via a bus. According to an operation request transmitted from the processor, the accelerator reads the data from the memory, performs an operation to the data to generate computed data, and stores the computed data in the memory. The electronic device can improve computational efficiency. An accelerator and an accelerating method applicable to a neural network operation are also provided.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 6, 2019
    Inventors: Nhon-Toai QUACH, Chung-Chieh CHEN, Kong-Qiao WANG, Wen-Fu TSAI, Tzu-Wei YEH, Chung-Hao CHENG, Hui-Min LU
  • Patent number: 10290671
    Abstract: An image sensor device includes a first substrate, an interconnect structure, a conductive layer, a conductive via and a second substrate. The first substrate includes a first region including a pixel array and a second region including a circuit. The interconnect structure is over the pixel array or the circuit. The interconnect structure electrically connecting the circuit to the pixel array. The conductive layer is on the interconnect structure. The conductive via passes through the second substrate and at least partially embedded in the conductive layer. The second substrate is over the conductive layer.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: May 14, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-De Wang, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Jeng-Shyan Lin
  • Publication number: 20190081480
    Abstract: A clean-energy power supply system is coupled between a power supply and a load. A first power generation device is configured to provide a renewable voltage. A power transformation device transforms the renewable voltage according to a first selection signal to generate a first transformed voltage or a second transformed voltage. A switch selectively transmits the first transformed voltage and the external voltage provided by the power supply to the load or transmits the second transformed voltage to the load. When the external voltage is not less than a predetermined value, the power transformation device generates the first transformed voltage and the switch transmits the first transformed voltage and the external voltage. When the external voltage is less than the predetermined value, the power transformation device stops generating the first transformed voltage and generates the second transformed voltage and the switch transmits the second transformed voltage.
    Type: Application
    Filed: May 18, 2018
    Publication date: March 14, 2019
    Inventors: Ting-Kuan LI, Syuan-Yi LIN, Sung-Feng TSAI, Wen-Chieh WANG, Yen-Haw CHEN, Su-Ying LU
  • Patent number: 10110008
    Abstract: A micro grid stabilization device coupled to a DC bus and an AC bus in parallel is provided. A DC power generation apparatus provides power to the DC bus. An AC power generation apparatus provides power to the AC bus. A converter is coupled between the DC bus and the AC bus to transform the voltage of the DC bus and provide the transformed voltage to the AC bus. When the voltage of the DC bus or the AC bus is unstable, the micro grid stabilization device provides power to at least one of the DC bus and the AC bus to stabilize the power of the DC bus and the AC bus.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: October 23, 2018
    Assignee: CHUNG-HSIN ELECTRIC & MACHINERY MFG. CORPORATION
    Inventors: Ting-Kuan Li, Yen-Haw Chen, Chun-Der Chang, Wen-Chieh Wang, Sung-Feng Tsai, Jr-Rung Chen, Su-Ying Lu
  • Patent number: 10110012
    Abstract: A system and a control method of a mobile micro-grid are provided. The mobile micro-grid system includes a renewable energy source and a non-renewable energy source which are in a container. The control method includes supplying the renewable energy source as a primary power supply to an external load; and determining whether the electricity of the renewable energy source is sufficient. If the electricity of the renewable energy source is sufficient, then the renewable energy source provides electricity to the external load; if the electricity of the renewable energy source is not sufficient, then the renewable energy source and non-renewable energy source provide electricity to the external load. If an external power source, which is a renewable-energy-type power source, is connected to the mobile micro-grid system, then the renewable energy source and external power source work as the primary power supply.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: October 23, 2018
    Assignee: CHUNG-HSIN ELECTRIC & MACHINERY MFG. CORPORATION
    Inventors: Ting-Kuan Li, Yen-Haw Chen, Chun-Der Chang, Wen-Chieh Wang, Sung-Feng Tsai, Cheng-Shan Lin, Su-Ying Lu
  • Patent number: 10027294
    Abstract: A class-D amplifier includes a loop filter, a pulse-width modulation (PWM) circuit, an output circuit, and a common-mode control circuit. The loop filter receives an input signal of the class-D amplifier to generate a filtered signal. The PWM circuit converts a non-PWM signal into a PWM signal, wherein the non-PWM signal is derived from at least the filtered signal. The output circuit generates an output signal of the class-D amplifier according to the PWM signal. The common-mode control circuit monitors a common-mode level of the output signal to generate a common-mode control signal for PWM common-mode control.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: July 17, 2018
    Assignee: MEDIATEK INC.
    Inventors: Wen-Chieh Wang, Yu-Hsin Lin
  • Patent number: 9978795
    Abstract: A semiconductor structure includes a substrate, a plurality of image sensing devices formed in the substrate, at least a passivation layer formed on the substrate, a plurality of first metal patterns formed on the passivation layer, a plurality of gaps formed between the first metal patterns, an insulating layer lining the gaps, and a plurality of light-guiding structures respectively formed in the gaps. The light-guiding structures respectively include an anchor portion and a body portion, and bottom surfaces of the anchor portions being lower than top surfaces of the first metal patterns.
    Type: Grant
    Filed: January 8, 2017
    Date of Patent: May 22, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jy-Hwang Lin, Wen-Chieh Wang, Tien-Shang Kuo, Fu-Hsuan Chu, Hua-Wei Peng
  • Publication number: 20170366011
    Abstract: A system and a control method of a mobile micro-grid are provided. The mobile micro-grid system includes a renewable energy source and a non-renewable energy source which are in a container. The control method includes supplying the renewable energy source as a primary power supply to an external load; and determining whether the electricity of the renewable energy source is sufficient. If the electricity of the renewable energy source is sufficient, then the renewable energy source provides electricity to the external load; if the electricity of the renewable energy source is not sufficient, then the renewable energy source and non-renewable energy source provide electricity to the external load. If an external power source, which is a renewable-energy-type power source, is connected to the mobile micro-grid system, then the renewable energy source and external power source work as the primary power supply.
    Type: Application
    Filed: August 1, 2016
    Publication date: December 21, 2017
    Inventors: Ting-Kuan Li, Yen-Haw Chen, Chun-Der Chang, Wen-Chieh Wang, Sung-Feng Tsai, Cheng-Shan Lin, Su-Ying Lu
  • Publication number: 20170338657
    Abstract: A micro grid stabilization device coupled to a DC bus and an AC grid in parallel is provided. A DC power generation apparatus provides power to the DC bus. An AC power generation apparatus provides power to the AC grid. A converter is coupled between the DC bus and the AC grid to transform the voltage of the DC bus and provide the transformed voltage to the AC grid. When the voltage of the DC bus or the AC grid is unstable, the micro grid stabilization device provides power to at least one of the DC bus and the AC grid to stabilize the power of the DC bus and the AC grid.
    Type: Application
    Filed: August 11, 2016
    Publication date: November 23, 2017
    Inventors: Ting-Kuan LI, Yen-Haw CHEN, Chun-Der CHANG, Wen-Chieh WANG, Sung-Feng TSAI, Jr-Rung CHEN, Su-Ying LU
  • Publication number: 20170200722
    Abstract: A memory device with a dielectric layer or an air gap between contacts and a method of making the same are disclosed. The method comprises a series of steps including: forming a plurality of conductive lines having trenches therebetween; forming a contact layer in the trench; and forming a dielectric layer interposed in the contact layer and configured to divide the contact layer into two contacts. The method also comprises removing the dielectric layer to form a space and forming a cap layer over the contacts to form an air gap therein. The method further comprises forming a second air gap between the conductive fine and the contact.
    Type: Application
    Filed: January 12, 2016
    Publication date: July 13, 2017
    Inventors: Tieh-Chiang WU, Wen-Chieh WANG, Sheng-Wei YANG