Abstract: Systems and methods for switching between a power supply mode and an electronic load mode are disclosed. For switching from the power supply mode to the electronic load mode, the method comprises the steps of: deactivating a power element; activating a current control module and a phase-locked loop to obtain a voltage phase of a device under test; calculating a turn-on amount of the power element according to a current setting value and the voltage phase; and causing the power element to generate a load current for the device under test. For switching from the electronic load mode to the power supply mode, the method comprises the steps of: deactivating the power element; activating a voltage control module; calculating the turn-on amount of the power element according to a voltage setting value; and causing the power element to input a corresponding voltage to the device under test.

Abstract: Example computing devices are disclosed herein that include a housing member that is to be placed on a support surface. The housing member includes an internal cavity and a biasing member mounted within the internal cavity. The biasing member is to engage with an inner surface of the internal cavity to deform the inner surface.

Abstract: In some examples, a computing device can include a housing including a corner, the corner comprising a first surface and a second surface, and an inner frame including a chamfered corner to interface with the corner of the housing to form a cavity between the first surface, the second surface, and the chamfered corner, a first gasket to interface with the first surface of the housing, and a second gasket to interface with the second surface of the housing, where the cavity includes a structural adhesive and the first gasket and the second gasket fluidically seal the cavity.

Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 ?m and 300 ?m. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: The present invention provides a voltage control method for controlling a power supply. The voltage control method comprises the following steps: obtaining a present output voltage value associated with a present gain value; obtaining a predetermined output voltage value associated with a predetermined duty ratio; calculating a target gain value, corresponding to the predetermined duty ratio, according to a gain value formula; performing a weight calculation on the present gain value and the target gain value for generating a buffer gain value; and setting an output voltage command according to the buffer gain value. Wherein the buffer gain value is between the present gain value and the target gain value.

Abstract: In one example, a device includes a service door with a leaf spring fastener. The device also includes a base of the device including a hook. The hook is disposed in the base such that the hook is to engage the leaf spring fastener in response to the leaf spring fastener being compressed via a screw being tightened on the service door to the base.

Abstract: An enclosure for a portable electronic device may include a base portion with a curved wall that extends from the base portion to form an inner concavity. An engagement feature on the base portion may retain a resilient member that extends along an inner contour of the inner concavity of the wall.

Abstract: A wristband pulse diagnosis instrument including two pulse diagnosis instrument units is provided. Each of the two pulse diagnosis instrument units includes a wristband body, a pressure sensor, a first adjusting mechanism, and a second adjusting mechanism. A connecting member is disposed at each of two sides of the wristband body, and the connecting members are used to selectively connect the two pulse diagnosis instrument units to each other. The pressure sensor is movably disposed on the wristband body via the first adjusting mechanism and the second adjusting mechanism. A depthwise movement of the pressure sensor is adjusted by the first adjusting mechanism for the pressure sensor to move to three pulse positions of floating, medium, and deep, and a lateral movement of the pressure sensor is adjusted by the second adjusting mechanism for the pressure sensor to move to three pulse positions of distal, mid, and proximal.

Abstract: The invention introduces a method for diagnosing tongues based on deep learning, performed by processing unit of a tablet computer, including: obtaining a shooting photo through a camera module of the tablet computer; inputting the shooting photo to a convolutional neural network (CNN) to obtain classification results of categories, which are associated with a tongue of the shooting photo; and displaying a screen of a tongue-diagnosis application on a display panel of the tablet computer, where the screen includes the classification results of the categories.

Abstract: The invention introduces a method for remotely diagnosing tongues based on deep learning, performed by processing unit, including: obtaining a medical-treatment request and medical-record information containing a shooting photo from a client apparatus over a network; inputting the shooting photo to a plurality of partial-detection convolutional neural networks (CNNs) to obtain a plurality of classification results of a plurality of categories, which are associated with a tongue of the shooting photo; displaying a screen of a remote tongue-diagnosis application on a display unit, which contains the classification results of the categories; obtaining a medical advice corresponding to the classification results of the categories; and replying with the medical advice to the client apparatus over the network.

Abstract: In one example, an electronic device may include a power adapter having a connector plug. Further, the electronic device may include a housing and a connector port disposed on a side of the housing to receive the connector plug of the power adapter. The connector port may include an electromagnet disposed on a mating end of the connector port and a first conductive contact disposed on the mating end and electrically connected to the electromagnet. When the connector port being mated with the connector plug, the first conductive contact may receive power from a second conductive contact of the connector plug and energize the electromagnet to produce magnetic attraction with a magnetic element in the connector plug.

Abstract: Example computing devices are disclosed herein that include a housing member that is to be placed on a support surface. The housing member includes an internal cavity and a biasing member mounted within the internal cavity. The biasing member is to engage with an inner surface of the internal cavity to deform the inner surface.

Abstract: A MEMS device comprising a substrate comprising a die and a plurality of side-walls disposed upon the MEMS die, a proof-mass coupled to the substrate, the proof-mass is configured to be displaced within a first plane that is parallel to the die, wherein the proof-mass is configured to contact at least a sidewall, wherein the proof-mass is configured to adhere to the side-wall as a result of stiction forces, a driving circuit configured to provide a driving voltage in response to a driving signal indicating that the proof-mass is adhered to the side-wall, and an actuator coupled to the driving circuit disposed upon the side-wall, wherein the actuator is configured to receive a driving voltage and to provide an actuator force to the proof mass within the first plane in a direction away from the side-wall in response to the driving voltage, wherein the actuator force exceeds the stiction forces.

Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.

Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.