Abstract: A control method and an electronic device utilizing the same are described. The control method, applied to an electronic device which contains at least one of a battery and a touch panel, including: detecting at least one of a temperature of the battery, a consumption rate of the battery, a display time of the touch panel and a touch frequency of the touch panel; and when at least one of the temperature of the battery, the consumption rate of the battery, the display time of the touch panel and the touch frequency of the touch panel meets at least one trigger condition, initiating a protection mechanism.

Abstract: A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.

Abstract: A stacked-type piezoelectric device includes a stack of piezoelectric layers, plural conductive layers, a first contact hole, a second contact hole, and plural insulating portions. The piezoelectric layers are disposed between the conductive layers. The first and second contact holes penetrate the piezoelectric layers and the conductive layers, and each of first and second contact holes is filled with a conductive material. Every insulating portion is formed at one conductive layer. Two adjacent insulating portions are respectively formed at the outer rims of the first and second contact holes, to electrically isolate the conductive layer (in which the insulating portion is formed) from the conductive material in the contact hole.

Abstract: A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.

Abstract: An electronic device comprises a microphone array, a signal processor and a game controller. The microphone array comprises at least a first microphone unit for capturing at least a first acoustic signal and a second microphone unit for capturing at least a second acoustic signal. The signal processor processes the first and second acoustic signals and obtains at least one characteristic from the first and second acoustic signals. The game controller updates at least one parameter of a game in accordance with the at least one characteristic; thereby controlling a process of the game.

Abstract: A numerical engineering model system is installed in a computer server and remotely operated by a local device via a network, which includes a user interface showing an operating page and receiving the numerical parameters, an analyzing module having at least one engineering model presented as the numerical parameters and a corresponding picture, a database storing the inputted numerical parameters and the picture, an engineering software means processing the inputted numerical parameters, and building, simulating and analyzing a 2D/3D model, and then storing the 2D/3D model, a simulating result and an analyzing result in the database. It is convenient for the users to remotely operate the system via any computer with network function. It simplifies the design procedures and reduces the design cost and design time because the engineering model is presented as numerical parameters and the corresponding picture. Furthermore, it is easy to understand and operate by common users without engineering knowledge.

Abstract: A stacked-type piezoelectric device includes a stack of piezoelectric layers, plural conductive layers, a first contact hole, a second contact hole, and plural insulating portions. The piezoelectric layers are disposed between the conductive layers. The first and second contact holes penetrate the piezoelectric layers and the conductive layers, and each of first and second contact holes is filled with a conductive material. Every insulating portion is formed at one conductive layer. Two adjacent insulating portions are respectively formed at the outer rims of the first and second contact holes, to electrically isolate the conductive layer (in which the insulating portion is formed) from the conductive material in the contact hole.

Abstract: A strain sensor is provided including a substrate, and a sensing layer, including cobalt, provided on the substrate. A first electrode is coupled to the sensing layer, and a tunnel layer including aluminum oxide is provided on the sensing layer. In addition, a pinned layer, also including cobalt, is provided on the tunnel layer. An exchange biasing layer is provided on the pinned layer, and a second electrode is coupled to the exchange biasing layer. The strain sensor is configured such that, over a range of values of strain applied to the sensor, a resistance of the sensor is a linear function of the strain. A related method is also disclosed.

Abstract: A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.

Abstract: A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.

Abstract: A solid tunable micro optical device for an micro-optical system is provided. The sold tunable micro optical device includes a first annular piece, a micro-lens with a spherical surface configured on the first annular piece, and a deforming device coupled to the first annular piece for deforming the micro-lens.

Abstract: An apparatus for providing a file to a target device comprises a communication controller and a processor. The processor acquires download status indicating that a portion of the file has been successfully programmed in nonvolatile memory of the target device, determines a resuming point of the file according to the acquired download status, and transmits a portion of the file from the determined resuming point to the target device via the communication controller. The portion of file is programmed in the nonvolatile memory of the target device.

Abstract: A thin film transistor (TFT) array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of thin film transistors, a plurality of pixel electrodes, and a plurality of pairs of repair pads is provided. A plurality of pixel regions are defined by the scan lines and the data lines over the substrate. The thin film transistors are disposed in the pixel regions and driven by the scan lines and the data lines. Each pixel electrode is disposed in the region, and is electrically connected to the thin film transistor. The repair pads are disposed under the data line. In addition, the repairing process includes welding the defective data line with the quasi-welding repair pad, and then forming a repair line to reconnect the defective data line.

Abstract: An artwork of light-emitting display ornament for use in a ceiling lamp, palace lamp, wall lamp, desk lamp, floor lamp, or pot plant-shaped lighting fixture is disclosed to include a bionic-shaped light-transmissive solid member made out of a light-transmissive stone or fogged glass in the shape of a fruit of flower bud and having a ball hole, and a light emitting diode mounted in the ball hole and controllable to emit light through the bionic-shaped light-transmissive solid member.

Abstract: A combination lampshade includes a center hub, a plurality of lampshade elements that are respectively abutted against one another by fastening respective pins into respective pin holes and secured together by swivel hooks at each lampshade element, and an annular retainer fastened to the center hub to secure the lampshade elements around the center hub.

Abstract: A strain sensor is provided including a substrate, and a sensing layer, including cobalt, provided on the substrate. A first electrode is coupled to the sensing layer, and a tunnel layer including aluminum oxide is provided on the sensing layer. In addition, a pinned layer, also including cobalt, is provided on the tunnel layer. An exchange biasing layer is provided on the pinned layer, and a second electrode is coupled to the exchange biasing layer. The strain sensor is configured such that, over a range of values of strain applied to the sensor, a resistance of the sensor is a linear function of the strain. A related method is also disclosed.

Abstract: A switching device of input and output interfaces of computer systems includes a plurality of primary ports for electrically connecting transmission interfaces of the plurality of the computer systems, a plurality of secondary port for electrically connecting transmission interfaces of a plurality of input devices, a hub device coupled between the plurality of primary ports and the plurality of secondary ports, an audio decoding unit coupled to the hub device, for decoding audio signals, a control unit coupled to the hub device, for controlling the hub device, so as to couple a primary port of the plurality of primary ports to the plurality of secondary ports and the audio decoding unit, and an audio output port coupled to the audio decoding unit, for outputting decoded results of the audio decoding unit.

Abstract: An expandable multi-computer switching device includes a master switching module and a slave switching module. The master switching module includes a transmission interface, a plurality of ports coupled to the transmission interface, a hub device coupled between the transmission interface and the plurality of ports, and a master control unit coupled to the hub device. The slave switching module includes a first transmission interface coupled to the transmission interface, a second transmission interface coupled to an interface of a computer system, a third transmission interface coupled to the first transmission interface, a switch module coupled between the first transmission interface and the second transmission interface, and a slave control unit coupled to the first transmission interface and the switch module, for turning on the switch module to couple the first transmission interface to the second transmission interface according to the control signal outputted from the master control unit.

Abstract: A system for the sharing of electronic peripheral equipments, wherein the system allows various industry standard electronic devices to share at least one electronic peripheral equipment. The aforesaid system comprises: a main server and a peripherals sharing interface that is installed in the main server, wherein the peripherals sharing interface has at least one signal input port and one signal output port, and the signal input port comprises at least a video input port, a mouse port and a keyboard port.

Abstract: A thin film transistor (TFT) array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of thin film transistors, a plurality of pixel electrodes, and a plurality of pairs of repair pads is provided. A plurality of pixel regions are defined by the scan lines and the data lines over the substrate. The thin film transistors are disposed in the pixel regions and driven by the scan lines and the data lines. Each pixel electrode is disposed in the region, and is electrically connected to the thin film transistor. The repair pads are disposed under the data line. In addition, the repairing process includes welding the defective data line with the quasi-welding repair pad, and then forming a repair line to reconnect the defective data line.