Patents by Inventor Wen-Chih Chen
Wen-Chih Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10458893Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.Type: GrantFiled: August 24, 2016Date of Patent: October 29, 2019Assignee: Industrial Technology Research InstituteInventors: Chia-Wen Chiang, Cheng-Ta Ko, I-Hsing Lin, Hsiang-Hung Chang, Wen-Chih Chen
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Publication number: 20190109064Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.Type: ApplicationFiled: May 11, 2018Publication date: April 11, 2019Applicant: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin, Wei-Kuo Han
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Publication number: 20180346328Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.Type: ApplicationFiled: August 13, 2018Publication date: December 6, 2018Inventors: Ben LEE, Ming Hong KUO, Wen-Chih CHEN, Wensen TSAI
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Patent number: 10131539Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a second substrate over a first substrate, and a cavity is formed between the first substrate and the second substrate. The method includes forming a hole through the second substrate using an etching process, and the hole is connected to the cavity. The etching process includes a plurality of etching cycles, and each of the etching cycles includes an etching step, and the etching step has a first stage and a second stage. The etching time of each of the etching steps during the second stage is gradually increased as the number of etching cycles is increased.Type: GrantFiled: October 5, 2017Date of Patent: November 20, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chin-Han Meng, Chih-Hsien Hsu, Chia-Chi Chung, Yu-Pei Chiang, Wen-Chih Chen, Chen-Huang Huang, Zhi-Sheng Xu, Jr-Sheng Chen, Kuo-Chin Liu, Lin-Ching Huang
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Patent number: 10046966Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.Type: GrantFiled: April 4, 2017Date of Patent: August 14, 2018Assignee: MCUBE, INC.Inventors: Ben Lee, Ming Hong Kuo, Wen-Chih Chen, Wensen Tsai
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Publication number: 20180148324Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The method includes forming a second substrate over a first substrate, and a cavity is formed between the first substrate and the second substrate. The method includes forming a hole through the second substrate using an etching process, and the hole is connected to the cavity. The etching process includes a plurality of etching cycles, and each of the etching cycles includes an etching step, and the etching step has a first stage and a second stage. The etching time of each of the etching steps during the second stage is gradually increased as the number of etching cycles is increased.Type: ApplicationFiled: October 5, 2017Publication date: May 31, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chin-Han MENG, Chih-Hsien HSU, Chia-Chi CHUNG, Yu-Pei CHIANG, Wen-Chih CHEN, Chen-Huang HUANG, Zhi-Sheng XU, Jr-Sheng CHEN, Kuo-Chin LIU, Lin-Ching HUANG
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Publication number: 20170283256Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.Type: ApplicationFiled: April 4, 2017Publication date: October 5, 2017Inventors: Ben LEE, Ming Hong KUO, Wen-Chih CHEN, Wensen TSAI
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Publication number: 20170052103Abstract: A miniaturized particulate matter detector that includes a filter and a concentration detector is provided. The filter has a plurality of holes, and the concentration detector is correspondingly disposed under the filter. The concentration detector has a detected area used to detect a concentration of at least one miniaturized particulate matter. A manufacturing method of the filter is also provided.Type: ApplicationFiled: August 24, 2016Publication date: February 23, 2017Applicant: Industrial Technology Research InstituteInventors: Chia-Wen Chiang, Cheng-Ta Ko, I-Hsing Lin, Hsiang-Hung Chang, Wen-Chih Chen
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Patent number: 9552027Abstract: A control method and an electronic device utilizing the same are described. The control method, applied to an electronic device which contains at least one of a battery and a touch panel, including: detecting at least one of a temperature of the battery, a consumption rate of the battery, a display time of the touch panel and a touch frequency of the touch panel; and when at least one of the temperature of the battery, the consumption rate of the battery, the display time of the touch panel and the touch frequency of the touch panel meets at least one trigger condition, initiating a protection mechanism.Type: GrantFiled: November 19, 2013Date of Patent: January 24, 2017Assignee: MEDIATEK SINGAPORE PTE. LTD.Inventors: Wen-Chih Chen, Bang Fu, Shuaiqiang Ji, Shu-yuan Hu
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Publication number: 20160257559Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.Type: ApplicationFiled: March 13, 2015Publication date: September 8, 2016Inventors: Ben (Wen-Pin) Chuang, MH (Ming-Hong) Kuo, WJ (Wen-Chih) Chen, Tse-Hsi “Terrence” Lee
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Patent number: 9350128Abstract: An adapter includes a first electrical connector structure having a first terminal, a second electrical connector structure connected with the first electrical connector structure and having a second terminal electrically connected with the first terminal, a first metallic sleeve with substantial U-shape, and a second metallic sleeve with substantial U-shape. The first metallic sleeve and the second metallic sleeve are covered to a junction of the first electrical connector structure and the second electrical connector structure from two opposite sides of the first electrical connector structure and the second electrical connector structure and then engaged with each other to fix the first electrical connector structure and the second electrical connector structure together.Type: GrantFiled: April 3, 2015Date of Patent: May 24, 2016Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.Inventors: Wen-Chih Chen, Chuan-Hung Lin, Kuo-Chih Lin
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Patent number: 9308603Abstract: A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.Type: GrantFiled: April 3, 2013Date of Patent: April 12, 2016Assignee: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen
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Publication number: 20160043239Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.Type: ApplicationFiled: October 22, 2015Publication date: February 11, 2016Inventors: Hsiang-Hung Chang, Wen-Chih Chen, Chia-Wei Jui, Zhi-Cheng Hsiao, Cheng-Ta Ko, Rong-Shen Lee, Sheng-Shu Yang
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Patent number: 9143243Abstract: A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate.Type: GrantFiled: September 5, 2013Date of Patent: September 22, 2015Assignee: Industrial Technology Research InstituteInventors: Shin-Yi Huang, Wen-Chih Chen, Tao-Chih Chang
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Publication number: 20150097259Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Applicant: Industrial Technology Research InstituteInventors: Hsiang-Hung CHANG, Wen-Chih CHEN, Chia-Wei JUI, Zhi-Cheng HSIAO, Cheng-Ta KO, Rong-Shen LEE, Sheng-Shu YANG
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Publication number: 20140374629Abstract: A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate.Type: ApplicationFiled: September 5, 2013Publication date: December 25, 2014Applicant: Industrial Technology Research InstituteInventors: Shin-Yi Huang, Wen-Chih Chen, Tao-Chih Chang
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Publication number: 20140218316Abstract: A control method and an electronic device utilizing the same are described. The control method, applied to an electronic device which contains at least one of a battery and a touch panel, including: detecting at least one of a temperature of the battery, a consumption rate of the battery, a display time of the touch panel and a touch frequency of the touch panel; and when at least one of the temperature of the battery, the consumption rate of the battery, the display time of the touch panel and the touch frequency of the touch panel meets at least one trigger condition, initiating a protection mechanism.Type: ApplicationFiled: November 19, 2013Publication date: August 7, 2014Applicant: MediaTek Singapore Pte. Ltd.Inventors: Wen-Chih CHEN, Bang FU, Shuaiqiang JI, Shu-yuan HU
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Publication number: 20140134459Abstract: A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.Type: ApplicationFiled: April 3, 2013Publication date: May 15, 2014Applicant: Industrial Technology Research InstituteInventors: Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen
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Patent number: 8222800Abstract: A stacked-type piezoelectric device includes a stack of piezoelectric layers, plural conductive layers, a first contact hole, a second contact hole, and plural insulating portions. The piezoelectric layers are disposed between the conductive layers. The first and second contact holes penetrate the piezoelectric layers and the conductive layers, and each of first and second contact holes is filled with a conductive material. Every insulating portion is formed at one conductive layer. Two adjacent insulating portions are respectively formed at the outer rims of the first and second contact holes, to electrically isolate the conductive layer (in which the insulating portion is formed) from the conductive material in the contact hole.Type: GrantFiled: February 12, 2010Date of Patent: July 17, 2012Assignee: Industrial Technology Research InstituteInventors: Wen-Chih Chen, Tsung-Fu Tsai, Huan-Chun Fu
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Patent number: 8164187Abstract: A flip chip device made using LCD-COG (liquid crystal display-chip on glass) technique. The flip chip device comprises a substrate, at least one chip having active area with a plurality of compliant bumps thereon. The compliant bumps are centrally disposed in the center of the chip for electrically connecting the chip and the substrate. An adhesive is daubed on a joint area of the substrate and the chips for jointing the substrate and the chips. By limiting the position of the compliant bumps so that they are centrally disposed on the chips, the thermal warpage of the substrate is reduced.Type: GrantFiled: April 24, 2009Date of Patent: April 24, 2012Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corp., Hannstar Display Corp., Chi Mei Optoelectronics Corp., Industrial Technology Research Institute, Toppoly Optoelectronics Corp., Quanta Display Inc.Inventors: Wen-Chih Chen, Sheng-Shu Yang