Patents by Inventor Wen-Chun Liu

Wen-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame structure for preventing the warping of semiconductor package body
    Patent number: 6078099
    Abstract: A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: June 20, 2000
    Assignee: Walsin Advanced Electronics LTD
    Inventors: Wen-Chun Liu, Jung-Jie Liou, Chih-Kung Huang