Patents by Inventor Wen Chung

Wen Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10892213
    Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an adhesion layer and at least one outer via. The upper conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The lower conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The adhesion layer is interposed between the upper conductive structure and the lower conductive structure to bond the upper conductive structure and the lower conductive structure together. The outer via extends through at least a portion of the upper conductive structure and the adhesion layer, and electrically connected to the circuit layer of the lower conductive structure.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 12, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Li-Yu Hsieh, Yan Wen Chung
  • Publication number: 20200398248
    Abstract: Disclosed is a modified carbonaceous material, which includes hexagonal carbon networks in a layered stacking structure and acidic functional groups bonded to the hexagonal carbon networks and mainly existing at edges of the layered carbonaceous structure. Accordingly, the close proximity of acid moiety at the edges can resemble the center of hydrolysis enzymes, resulting in enhancement of hydrolytic efficiency. Additionally, the acid-functionalized carbonaceous material can also be applied in the capture and storage of carbon dioxide due to its unexpectedly higher capacity for CO2 molecular.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 24, 2020
    Inventors: Jia-Hui WANG, Hao-Ju CHOU, Po-Wen CHUNG
  • Publication number: 20200401009
    Abstract: An electrochromic element having a protection layer is disclosed which comprises a first base material, a first transparent conductive layer, a first electrochromic layer, a protection layer, an electrolytic layer, a second electrochromic layer, a second transparent conductive layer and a second base material arranged in order. The protection layer is made of tin oxide (SnOx) or nickel oxide (NiOx).
    Type: Application
    Filed: June 18, 2019
    Publication date: December 24, 2020
    Inventor: YI-WEN CHUNG
  • Patent number: 10865518
    Abstract: A paperless transfer printing method includes the following steps: (a) printing, by a printing machine, aqueous ink onto a transfer printing temporary carrier in a set pattern, wherein a surface of the transfer printing temporary carrier is made of an elastic polymer material and a surface tension of the aqueous ink is less than the critical surface tension of the transfer printing temporary carrier; (b) drying the to-be-transferred pattern on the transfer printing temporary carrier; (c) wetting the transfer printing temporary carrier by using an aqueous surface tension increasing liquid; and (d) separating the aqueous solution or the aqueous dispersion liquid from the transfer printing temporary carrier at a tight-contact position between the transfer printing temporary carrier and the fabric, so that an aqueous ink dye is transferred onto the fiber of the fabric.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: December 15, 2020
    Assignees: NEWTECH TEXTILE TECHNOLOGY DEVELOPMENT (SHANGHAI) CO., LTD.
    Inventor: Po-Wen Chung
  • Publication number: 20200388676
    Abstract: A semiconductor device includes a substrate and a conducting structure. The substrate has a first conductivity type and includes a first isolation region, a first implant region, and a second implant region. The first isolation region is disposed along the circumference of the substrate. The first implant region has the first conductivity type, and the second implant region has a second conductivity type that is the opposite of the first conductivity type. The conducting structure is disposed on the substrate, and at least a portion of the conducting structure is located on the first isolation region.
    Type: Application
    Filed: June 7, 2019
    Publication date: December 10, 2020
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Wen-Hua WEN, Chia-Shen LIU, Wen-Chung CHEN, Chrong-Jung LIN
  • Patent number: 10859143
    Abstract: The linear driving system comprises a motor, a screw shaft and a table. The motor comprises a rotor, a stator and a ball bearing. The stator comprises a shaft part and a spiral part. The shaft part and the spiral part jointly comprise an accommodation space. The spiral part comprises a first helical protrusion formed on the inner surface thereof. The screw shaft is coaxially coupled with the rotor. One end of the screw shaft comprises a second helical protrusion formed on the outer surface thereof, and the screw shaft is accommodated within the accommodation space. The table is fixed on the other end of the screw shaft. The first helical protrusion is engaged with the second helical protrusion. When the rotor is rotated, the rotor drives the screw shaft and the table to move forward or backward linearly in the direction of the axial of the rotor.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: December 8, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chi-Wen Chung, Chun-Chin Su
  • Publication number: 20200381369
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Huei-Shyong CHO
  • Publication number: 20200346201
    Abstract: Metal oxides-silica composite materials are synthesized by a co-precipitation method to serve as modified catalysts for converting ethanol into four-carbon hydrocarbons. The method includes mixing a liquid-phase silicon source and a metal precursor at different ratios so as to change the acid-base composition of the composite materials and thereby increase selectivity with respect to the four-carbon products.
    Type: Application
    Filed: June 27, 2019
    Publication date: November 5, 2020
    Inventors: Po-Wen CHUNG, Meng-Xun WU
  • Patent number: 10825588
    Abstract: Herein disclosed is a voltage dividing resistor comprising a resistance bar and a plurality of dividing connectors. The resistance bar has a first end and a second end and provides a first current path, which stretches from the first end to the second end along the resistance bar. The distance between the first end and the second end is less than the length of the first current path. The first and second ends are configured to be electrically connected to a power source. The dividing connectors are electrically connected to different locations on the first current path. Each of the dividing connectors has a contact pad. The resistance bar is not coplanar with the contact pads. A divided voltage is obtained from a pair of dividing connectors chosen from the plurality of dividing connectors.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: November 3, 2020
    Assignee: CHROMA ATE INC.
    Inventors: Chung-Lin Liu, Chien-Hsin Huang, Wen-Chung Chen
  • Patent number: 10824841
    Abstract: An under-screen fingerprint identification system includes an image sensing element, a display element, a translucent cover, and a Bragg polarization grating. The display element is disposed on the image sensing element. The translucent cover is disposed on the display element, and the display element is located between the translucent cover and the image sensing element. The translucent cover has a first surface and a second surface opposite to each other, and the first surface is farther away from the display element than the second surface. The Bragg polarization grating is disposed on the second surface of the translucent cover.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: November 3, 2020
    Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., LTD
    Inventors: Jun-Wen Chung, Ping-Hung Yin
  • Publication number: 20200340807
    Abstract: Embodiments disclosed herein relate generally to methods for measuring a characteristic of a substrate. In an embodiment, the method includes scanning over the substrate with a scanning probe microscope, the substrate having fins thereon, the scanning obtaining images showing respective fin top regions of the fins, the scanning probe microscope interacting with respective portions of sidewalls of the fins by a scanning probe oscillated during the scanning, selecting images obtained at a predetermined depth below the fin top regions to obtain a line edge profile of the fins, by a processor-based system, analyzing the line edge profile of the fins using power spectral density (PSD) method to obtain spatial frequency data of the line edge profile of the fins, and by the processor-based system, calculating line edge roughness of the fins based on the spatial frequency data.
    Type: Application
    Filed: July 13, 2020
    Publication date: October 29, 2020
    Inventors: Wei-Shan HU, Dong GUI, Jang Jung LEE, Che-Liang LI, Duen-Huei HOU, Wen-Chung LIU
  • Patent number: 10815336
    Abstract: A branched polymer, a preparation method thereof and a method for preparing a foam are provided. The branched polymer is a transesterification product of a composition, and the composition includes 100 parts by weight of polyethylene terephthalate and 0.5-2.0 parts by weight of polyol. The branched polymer has an inherent viscosity of from 1.2 dL/g to 1.6 dL/g, a number average molecular weight of from 75,000 g/mol to 90,000 g/mol, a polydispersity index from 3.0 to 6.0, a melt index from 0.8 g/10 min to 7.5 g/10 min, a shear viscosity from 800 Pa·s to 1900 Pa·s, and a melt strength from 30 cN to 80 cN.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: October 27, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An Wu, Wen-Chung Liang, Chin-Lang Wu, Shihn-Juh Liou
  • Publication number: 20200329964
    Abstract: An image processing method for image-based physiological measurement, includes converting at least one user's image signal into image data; determining at least one region of interest within the image data; analyzing image information inside the region of interest to generate physiological information of the user; determining a feedback control signal or a control signal to optimize the physiological information of the user; and adjusting an image sensing unit or an image signal processing unit according to the feedback control signal or the control signal.
    Type: Application
    Filed: July 2, 2019
    Publication date: October 22, 2020
    Inventors: Tsuey-Huey Shiue, Yi-Chiao Wu, Wen-Chung Chen, Kuan-Hung Chen
  • Patent number: 10792904
    Abstract: A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: October 6, 2020
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Ting-Chang Chang, Chih-Cheng Shih, Ming-Hui Wang, Wen-Chung Chen, Chih-Yang Lin
  • Patent number: 10790241
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 29, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen Hung Huang, Yan Wen Chung, Huei-Shyong Cho
  • Publication number: 20200303785
    Abstract: A battery module for use in a battery system is operable in a bottom mode, a top mode or a middle mode during an enabled state. The battery module includes a battery unit and a battery control circuit. The battery unit which includes at least one battery generates a battery unit voltage between a positive terminal and a negative terminal of the battery unit. The battery control circuit is powered by the battery unit voltage and is configured to control the battery unit. The battery control circuit includes an enable terminal, an upstream input terminal, an upstream output terminal, a downstream input terminal, and a downstream output terminal. When the enable terminal is at an operation enabling level, or when the upstream input terminal is at an upstream enabling level, the battery module enters the enabled state.
    Type: Application
    Filed: February 4, 2020
    Publication date: September 24, 2020
    Inventors: Wei-Hsu Chang, Hao-Wen Chung, Chung-Hui Yeh, Kuo-Chen Tsai
  • Publication number: 20200299249
    Abstract: This invention relates to a novel molten salt system in chemical transformation of saccharides and a method as well as an apparatus for multi carbon production by the molten salt system. It is found that an eutectic molten salt composition is advantageous for multi-carbon productions through chemical transformation under mild conditions. This invention further provides a method and an apparatus for preparing 5-hydroxymethylfurfural (HMF) and HMF-derived chemicals from saccharides by the said molten salt system.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Applicant: ACADEMIA SINICA
    Inventors: Po-Wen CHUNG, Prasenjit BHAUMIK, Hao-Ju CHOU
  • Publication number: 20200279815
    Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG, Huei-Shyong CHO
  • Patent number: 10763446
    Abstract: An organic thin film transistor includes a substrate, a source/drain layer that is located on the substrate and has a source region and a drain region, a first buffer layer that is located between the source region and the drain region, a semiconductor layer that is located on the source/drain layer and the first buffer layer, a gate insulating layer, and a gate electrode. The first buffer layer covers at least one portion of the source region and at least one portion of the drain region. The first buffer layer is located among the semiconductor layer, the source region, the drain region, and the substrate. The gate insulating layer covers the source/drain layer and the semiconductor layer. The gate electrode is located on the gate insulating layer, and a portion of the gate insulating layer is located between the gate electrode and the semiconductor layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: September 1, 2020
    Assignee: E Ink Holdings Inc.
    Inventors: Kuan-Yi Lin, Wen-Chung Tang, Po-Wei Chen, Yu-Lin Hsu
  • Publication number: 20200273722
    Abstract: A semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip electrically connected to the multi-layered circuit structure. The first insulating layer defines a first through hole extending through the first insulating layer. The first conductive layer includes a conductive pad disposed in the first through hole and a trace disposed on an upper surface of the first insulating layer. The multi-layered circuit structure is disposed on an upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 27, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Yan Wen CHUNG