Abstract: The present disclosure relates to a method of deploying a big data cluster. In the present disclosure, a deployment interface is provided, to provide a big data cluster deployment function through the deployment interface. The method includes: in response to a node creation operation in the deployment interface, displaying a to-be-deployed node in a temporary resource pool region in the deployment interface; in response to a drag-and-drop operation on the to-be-deployed node in the temporary resource pool region, displaying the to-be-deployed node in a physical pool in the deployment resource pool region in the deployment interface; and in response to a start deployment operation in the deployment interface, according to the physical pool where the to-be-deployed node is located, creating a container corresponding to the to-be-deployed node on a server corresponding to the physical pool, where the container is configured to provide a big data cluster service.

Abstract: The present disclosure relates to a data processing method and apparatus, a device and a medium. In the present disclosure, by obtaining the attribute data of the operation object corresponding to the node displayed on the target node in the program code and associating the obtained attribute data with the corresponding node, the attribute data associated with the node can be modified directly based on the operation data corresponding to the drag-and-drop operation when dragging and dropping the node on the target node, without the need to search for the operation object, such that through a simple operation process, dragging and dropping the node can be displayed, enabling the node to be displayed at the position where the drag-and-drop operation ends based on the modified attribute data.

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

Abstract: An electronic device and a lens control method of optical image stabilization thereof are provided. The method is adapted to the electronic device. The electronic device includes a lens, and the method includes the following steps. An accumulated deviation angle of the electronic device is obtained according to a driving signal. A compensation angle is determined according to the accumulated deviation angle of the electronic device. The lens is controlled to move according to compensation angle.

Abstract: A method for fabricating semiconductor device includes the steps of first providing a substrate having a first region and a second region, forming a first bottom barrier metal (BBM) layer on the first region and the second region, forming a first work function metal (WFM) layer on the first BBM layer on the first region and the second region, and then forming a diffusion barrier layer on the first WFM layer.

Abstract: A hinge mechanism includes an inner hinge, a rotating assembly that can rotate relative to the inner hinge, and an outer hinge. The inner hinge is connected to the outer hinge, and the rotating assembly is located between the inner hinge and the outer hinge. The rotating assembly includes a first swing arm, a second swing arm, and a linkage structure, and the first swing arm and the second swing arm may rotate relative to the inner hinge. The linkage structure includes a rotating member, a first translation member, and a second translation member. The first swing arm and the second swing arm can drive the first translation member and the second translation member to move reversely, and the rotating member can move synchronously with the first translation member and the second translation member.

Abstract: A method includes forming isolation regions extending into a semiconductor substrate. A semiconductor strip is between the isolation regions. The method further includes recessing the isolation regions so that a top portion of the semiconductor strip protrudes higher than top surfaces of the isolation regions to form a semiconductor fin, measuring a fin width of the semiconductor fin, generating an etch recipe based on the fin width, and performing a thinning process on the semiconductor fin using the etching recipe.

Abstract: A hinge mechanism includes a main shaft, a rotating module, a first door plate, and a second door plate. The rotating module includes a first rotating component, a second rotating component, a first housing fastening bracket, and a second housing fastening bracket. The first rotating component includes a first support arm, a first connecting member, and a first door plate fastening bracket. The first connecting member is separately and rotatably connected to the first support arm and the first door plate fastening bracket, and the first connecting member is rotatably or slidably connected to the main shaft. The second rotating component includes a second support arm, a second connecting member, and a second door plate fastening bracket. The second connecting member is rotatably connected to the second support arm and the second door plate fastening bracket, and the second connecting member is rotatably or slidably connected to the main shaft.

Abstract: A non-volatile memory device includes at least one memory cell, and the at least one memory cell includes a substrate, a stacked structure, a tunneling dielectric layer, a floating gate, a control gate structure, and an erase gate structure. The stacked structure is disposed on the substrate, and includes a gate dielectric layer, an assist gate, and an insulation layer stacked in order. The tunneling dielectric layer is disposed on the substrate at one side of the stacked structure. The floating gate is disposed on the tunneling dielectric layer and includes an uppermost edge and a curved sidewall. The control gate structure covers the curved sidewall of the floating gate. The erase gate structure covers the floating gate and the control gate structure, and the uppermost edge of the floating gate is embedded in the erase gate structure.

Abstract: The present disclosure relates to a copolymer and a polymersome for targeted delivery of biomolecules to a living organism. The exemplary copolymer comprises an initiator block, a propagator block, and a linkage connecting the initiator block and the propagator block. The initiator block comprises a glycan head configured to provide a targeted delivery, and the propagator block comprises a functional moiety configured to provide desired properties for the polymersome.

Abstract: A low-temperature smoking body and a preparation method thereof are disclosed. The low-temperature smoking body includes tobacco particles. The tobacco particle includes a particle body and a shell wrapped on the particle body. A carrier is distributed in the particle body and/or the shell. The carrier includes at least one of a raw tobacco material, a non-tobacco material, and a porous material. The carrier carries a smoking agent, and the smoking agent includes a tobacco extract and/or an atomizer. In addition, a preparation method of the low-temperature smoking body is further disclosed. The low-temperature smoking body has better smoking stability and uniformity, and the tobacco particles having core-shell structures can effectively solve the problem of liquid leakage.

Abstract: The present application provides a rocker device, the rocker device includes a supporting base, a rocker, a deviating element, and a reset assembly. The rocker is provided with a pressing part. The deviating element includes a first end and a second end opposite to each other, and the first end is in contact with the pressing part. The reset assembly is disposed on the second end. When the pressing part presses the first end of the deviating element, the second end of the deviating element deviates, and the reset assembly drives the second end of the deviating element to reset. The assembly of the rocker device in the present application is simple, reducing a frictional resistance between the deviating element and the supporting base, thereby improving usage experience.

Abstract: A method for detecting Global Navigation Satellite System (GNSS) spoofing is provided. The method includes receiving signals at a GNSS receiver; processing the signals to determine a calculated position; searching a list of distance measuring equipment (DME) transponders around the calculated position to select a set of DME transponders; sorting the set of DME transponders based on a respective distance between the calculated position and a respective position of each of the DME transponders; selecting a subset of the DME transponders based on the sorting; for each of the subset of the DME transponders, incrementing a counter when a difference between a real slant range, determined by communicating with the DME transponder, and an expected slant range based on height, position and known location of the DME transponder, exceeds a first threshold; and when the counter is greater than a second threshold, indicating that the position is spoofed.

Abstract: This application provides a hinge mechanism and an electronic device. One example hinge mechanism includes a base, and a first rotating assembly and a second rotating assembly that are respectively disposed on two sides of the base. When the first rotating assembly and the second rotating assembly rotate toward each other, a length of the hinge mechanism may be increased; or when the first rotating assembly and the second rotating assembly rotate opposite to each other, a length of the hinge mechanism may be shortened, and a support surface for supporting a flexible display can be formed.

Abstract: A method and a device for encoding or decoding based on an inter-frame prediction. The method includes steps of: determining a temporal motion vector prediction value of a to-be-processed coding unit, where the temporal motion vector prediction value is a temporal motion vector prediction value of a sub-block, a temporal motion vector of which is obtainable through prediction, in sub-blocks adjacent to the to-be-processed coding unit and/or sub-blocks in the to-be-processed coding unit; determining a motion vector residual prediction value of the to-be-processed coding unit according to the temporal motion vector prediction value; determining a motion vector of a sub-block in the to-be-processed coding unit according to the temporal motion vector prediction value and the motion vector residual prediction value and performing a motion compensation according to the motion vector of the sub-block in the to-be-processed coding unit to determine a prediction block of the to-be-processed coding unit.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A wafer processing system (1) is provided. The system (1) includes a processing tool (10) comprising at least one grinding member (16) used to remove material from a wafer substrate (80). The system (1) also includes an electrolyte supply line (361) used to supply an electrolyte to the wafer substrate (80). The system (1) further includes a holding module (20) for holding the wafer substrate (80). The holding module (20) includes a conductive base (21) and a conductive porous member (22) positioned on the top surface of the conductive base (21). A vacuum source (53) fluidly communicated with fluid channel (214) formed in the conductive base (21) to create a vacuum to hold the wafer substrate (80) on the conductive porous member (22).

Abstract: A work piece processing system includes a grinding wheel (12) configured to remove material from a work piece in a grinding process. The grinding wheel (12) includes a conductive layer (122) surrounding a rotation axis of the grinding wheel (12) and a number of grinding members (123) positioned at an outer surface of the conductive layer (122). The system also includes a holding module (20) and an electrolyte supply line (365). In addition, the system includes an actuator assembly (30) for driving a rotation of the grinding wheel (12) and a rotation of the holding module (20), and a power supply module (45) to apply current to the conductive layer (122) and the holding module (20). The work piece processing system uses electrochemical removal to reduce grinding damage and improve machining efficiency. A work piece processing method is also provided.

Abstract: A spatial light modulation unit includes a first electrode, a second electrode and a super-aligned carbon nanotube-paraffin composite structure. The first electrode is spaced apart and insulated from the first electrode. The super-aligned carbon nanotube-paraffin composite structure is electrically connected to the first electrode and the second electrode. The super-aligned carbon nanotube-paraffin composite structure includes a super-aligned carbon nanotube structure and a paraffin layer overlapped with each other.

Abstract: Provided is a display module. The display module includes: a display panel, a first printed circuit board, and a flexible printed circuit board; wherein the display panel is electrically connected to the first printed circuit board, the first printed circuit board is disposed at a back of the display panel, and the flexible printed circuit board includes a first connecting portion, a second connecting portion, and a flexible connecting structure, wherein the flexible connecting structure includes a plurality of stacked connecting bands, two ends of the flexible connecting structure are connected to the first connecting portion and the second connecting portion respectively, the first connecting portion is connected to the first printed circuit board, and the second connecting portion is configured to be connected to the host.