Patents by Inventor Wen Fu

Wen Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240241560
    Abstract: A computing device permits distribution of power received from an external power source to one or more subsystems of the computing device. The computing device receives input requesting a power control operation and, responsive to the input, interrupts the distribution of the power to at least one of the subsystems.
    Type: Application
    Filed: January 16, 2023
    Publication date: July 18, 2024
    Inventors: Hsuan Wei-Yi, Yi-Hsin Huang, Ying-Chi Chou, Wen-Fu Tsai
  • Publication number: 20240244938
    Abstract: A display device includes a first substrate, a light emitting unit and a first micro lens unit. The light emitting unit is arranged on the first substrate to provide a light. The first micro lens unit is arranged on the light emitting unit to adjust the traveling direction of the light, wherein there is a distance from the light emitting surface of the light emitting unit to a position of half the height of the first micro lens unit, the first micro lens unit has an arc surface, the first micro lens unit has a height, and the arc surface has a curvature radius, and the distance and the curvature radius satisfy the relationship: 0.5H?D?3R1, where D represents the distance, H represents the height, and R1 represents the curvature radius.
    Type: Application
    Filed: December 14, 2023
    Publication date: July 18, 2024
    Inventors: Wen-Tse LI, Shih-Fu LIAO, I-An YAO
  • Patent number: 12041863
    Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming said resistive random access memory (RRAM) structure is also provided.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: July 16, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240212131
    Abstract: An improved method of defect classification is disclosed. An improve method comprises obtaining an inspection image, obtaining layout data associated with the image, obtaining a probability map derived from the layout data, wherein the probability map identifies a probability of a first type of defect occurring in a region of the layout data, identifying a defect in the inspection image occurring at a first location, and classifying the defect based on the probability map and the first location.
    Type: Application
    Filed: February 17, 2022
    Publication date: June 27, 2024
    Applicant: ASML Netherlands B.V.
    Inventors: Hairong LEI, Wei FANG, Yung Wen FU
  • Publication number: 20240210379
    Abstract: A system for monitoring cells, which includes a device for monitoring cell-substrate impedance, the device having a plurality of wells on a nonconductive substrate, where each of the plurality of wells has an electrode array fabricated on the substrate for measurement of cell-substrate impedance; an impedance analyzer that measures cell-substrate impedance from the plurality of wells; electronic circuitry with multiple analogue-to-digital conversion channels, where the electronic circuitry electrically connects the electrode arrays to the impedance analyzer such that the electrode arrays are electrically monitored at millisecond time resolution; and a software program that analyzes the measured cell-substrate impedance.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 27, 2024
    Inventors: Xiaobo Wang, Yama A. Abassi, Biao Xi, Wen Fu Zhang, Xiao Xu
  • Publication number: 20240204019
    Abstract: An optical package structure includes a light transmittable member, a bonding structural member, and an optical element. The bonding structural member includes a first bonding layer and a second bonding layer to form a light-scattering structure. The first bonding layer is connected to a bonding surface of the light transmittable member. An inner side of the first bonding layer includes a plurality of first protruded portions. An inner side of the second bonding layer includes a plurality of second protruded portions. The second protruded portions and the first protruded portions are arranged in a staggered manner. The bonding structural member includes the first bonding layer or the light-absorption member. The light-absorption member is filled in concaved portions of the first bonding layer. The optical element is connected to the bonding structural member, and is spaced apart from the light transmittable member.
    Type: Application
    Filed: September 3, 2023
    Publication date: June 20, 2024
    Inventors: CHIEN-HUNG LIN, BAE-YINN HWANG, WEN-FU YU, WEI-LI WANG
  • Publication number: 20240204020
    Abstract: An optical package structure and a method for manufacturing the same are provided. The optical package structure includes an optical element, a bonding structural member, and a light transmittable member. The bonding structural member is bonded to a surface of the optical element. The bonding structural member includes a first bonding layer, a light-absorption layer, and a second bonding layer. The first bonding layer and the second bonding layer are made of an opaque material. The light-absorption layer is disposed between the first bonding layer and the second bonding layer. The light transmittable member is bonded to the bonding structural member and spaced apart from the optical element. The light-absorption layer is configured to absorb light emitted to the bonding structural member.
    Type: Application
    Filed: September 25, 2023
    Publication date: June 20, 2024
    Inventors: CHIEN-HUNG LIN, BAE-YINN HWANG, WEN-FU YU, WEI-LI WANG
  • Publication number: 20240161505
    Abstract: Provided is behavior image sensor system, including a first image capturing unit and a control unit. The first image capturing unit is used for capturing a moving image. The control unit is electrically connected to the first image capturing unit, receives the moving image, and calculates a moving track of a moving object in the moving image, thereby determining whether the moving track of the moving object conforms to a particularly dangerous behavior pattern. As such, the behavior image sensor system does not need to capture a static image of a static object completely and determine a behavior pattern of the static object, so that the behavior image sensor system may reduce the quantity of data a lot and is suitable for all kinds of environment.
    Type: Application
    Filed: August 9, 2023
    Publication date: May 16, 2024
    Inventors: Hsu-Wen Fu, Jun-Wen Chung, Chia-Hao Chang
  • Publication number: 20240157217
    Abstract: A golf teaching method and a golf teaching system are provided. The golf teaching method includes: configuring image capturing devices and golf simulator to capture swing images and corresponding simulator data records, when a user performs a golf swing; configuring an expert model that includes expert motion information and corresponding correction suggestion information; configuring a computing device to perform an analysis process on the swing images and the simulator data records to divide the golf swing into user motions according to stages and obtaining records of user motion information corresponding to the plurality of stages, and to compare the user motion information with the corresponding expert motion information in each stage through the expert model, and to provide the corresponding correction suggestion information according to a comparison result; and configuring a user interface to provide the correction suggestion information.
    Type: Application
    Filed: April 20, 2023
    Publication date: May 16, 2024
    Inventors: CHENG-HUNG TSAI, CHIA-YU JIH, CHIH-CHUNG CHIEN, LI-LIN LU, SHAO-JUN TAN, WEN-FU LAI
  • Publication number: 20240128233
    Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.
    Type: Application
    Filed: June 6, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-SHUAI CHANG, WEN-FU YU, BAE-YINN HWANG, WEI-LI WANG, CHIEN-HUNG LIN
  • Publication number: 20240128139
    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.
    Type: Application
    Filed: June 6, 2023
    Publication date: April 18, 2024
    Inventors: WEI-LI WANG, JYUN-HUEI JIANG, WEN-FU YU, BAE-YINN HWANG, CHIEN-HUNG LIN
  • Publication number: 20240128291
    Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.
    Type: Application
    Filed: June 6, 2023
    Publication date: April 18, 2024
    Inventors: CHIA-SHUAI CHANG, CHIEN-HUNG LIN, WEI-LI WANG, WEN-FU YU, BAE-YINN HWANG
  • Patent number: 11957851
    Abstract: A catheter for guiding a body fluid of a subject includes an elongated body, an adjusting mechanism, and a valve mechanism. Moreover, the elongated body further includes a first portion, a second portion and a flexible portion between the first and the second portions. The second portion includes a passageway for the body liquid. The valve mechanism closes to the inlet of the passageway. Furthermore, the flexible portion expands when the adjusting mechanism is in a first state to prevent the catheter from being removed from the subject, and the flexible portion retracts when the adjusting mechanism alters to a second state to allow the catheter to be removed from or inserted into the subject. Hence, the body fluid is directed to enter the passageway via the inlet and exit via the outlet when the adjusting mechanism is not in the second state.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: April 16, 2024
    Assignee: Flat Medical Inc.
    Inventors: Li-Yu Lin, Wen-fu Luo
  • Patent number: 11939302
    Abstract: The present disclosure provides compounds that are amylin receptor antagonist compounds, compositions that include the subject compounds, methods for preparing and using the amylin receptor antagonists, and compositions containing the amylin receptor antagonists for treating, preventing, or ameliorating Alzheimer's disease. Aspects of the present disclosure include a method of inhibiting activity of an amylin receptor by administering to a subject in need thereof a therapeutically effective amount of an amylin receptor antagonist.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: March 26, 2024
    Assignee: The Governors of the University of Alberta
    Inventors: James A. Nieman, Jack Jhamandas, Bing Bai, Alexandr Belovodskiy, Wen Fu, Mostofa Hena, Michael Houghton, Appan Srinivas Kandadai, Ryoichi Kimura, Kamlesh Kumar Sahu, D. Lorne Tyrrell
  • Publication number: 20240072500
    Abstract: An electrical connector includes an insulating body and a number of terminal groups. The insulating body includes a mating slot, a first notch and a second notch. The first notch and the second notch are symmetrically arranged on opposite sides of the mating slot. The terminal groups include a first conductive terminal, a second conductive terminal, a third conductive terminal and a fourth conductive terminal. Each conductive terminals includes a mating portion extending into the mating slot. With this arrangement, relatively more terminal groups can be provided, which is beneficial to improve the speed of data transmission. A connector assembly having the electrical connector is also disclosed.
    Type: Application
    Filed: February 24, 2023
    Publication date: February 29, 2024
    Applicant: SPEED TECH CORPORATION
    Inventors: Chung-Peng LIU, Wen-fu PON, Hui-Hsueh CHIANG
  • Patent number: 11907462
    Abstract: Systems and methods of automatic screen mapping are presented. In one exemplary embodiment, a method is performed by a controller device that is coupled to at least one of a set of display devices that are spatially arranged so that each display device is positioned adjacent to at least one other display device and wherein each display device includes a screen structure having a set of presence sensitive sensors. Each display device is operable, for each presence sensitive sensor of the corresponding screen structure, to detect a presence signal and to radiate a presence signal. The method includes receiving an indication that a second display device of the set of display devices has detected a presence signal radiated from a presence sensitive sensor of a first display device of the set of display devices so as to determine a spatial arrangement of the first and second display devices.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: February 20, 2024
    Assignee: Toshiba Global Commerce Solutions, Inc.
    Inventors: Wen Fu Tsai, Hawaii Xuan, Yi Hsin Huang, Ying Chi Chou
  • Patent number: 11906508
    Abstract: A system for monitoring cells, which includes a device for monitoring cell-substrate impedance, the device having a plurality of wells on a nonconductive substrate, where each of the plurality of wells has an electrode array fabricated on the substrate for measurement of cell-substrate impedance; an impedance analyzer that measures cell-substrate impedance from the plurality of wells; electronic circuitry with multiple analogue-to-digital conversion channels, where the electronic circuitry electrically connects the electrode arrays to the impedance analyzer such that the electrode arrays are electrically monitored at millisecond time resolution; and a software program that analyzes the measured cell-substrate impedance.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: February 20, 2024
    Assignee: AGILENT TECHNOLOGIES, INC.
    Inventors: Xiaobo Wang, Yama A. Abassi, Biao Xi, Wen Fu Zhang, Xiao Xu
  • Publication number: 20240045068
    Abstract: A LiDAR system includes a microcontroller, a laser light source, a lens module, and a receiver. The lens module includes a receiver lens module and a laser beam splitter module. The laser beam splitter module includes a diffractive optical element and a collimation lens assembly. The laser light source emits a plurality of laser beams with different wavelengths and includes a light coupler. The light coupler optically couples the laser beams into a collimated light signal. In a sensor shutter time of each subframe in a frame, a plurality of pixels of the receiver receive at least one reflective light signal of the laser light with different wavelengths to obtain a plurality of subframes of environmental images, and takes a distance value represented by the reflective light signals as a distance value of the pixels of the subframe, the microcontroller fuses the distance values of the pixels of the plurality of subframes of the environmental images as a final distance value of the frame.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 8, 2024
    Inventors: Jun-Wen Chung, Hsu-Wen Fu, Ping-Hung Yin
  • Publication number: 20240013183
    Abstract: A Projected Capacitive (PCAP) display including multiple arrays of conductive electrodes performs a dual function. In a first function, the PCAP display uses the conductive electrode arrays to generate an electrostatic field and determines the presence and position of a conductive object based on small changes it detects in the capacitance of that electrostatic field. In a second function, the PCAP display uses the same conductive electrode arrays to generate a magnetic field. As a user swipes the card across the surface of the PCAP display, it causes small changes in the generated magnetic field. The PCAP display retrieves the data magnetically encoded onto the magnetic stripe card based on the changes it detects in the magnetic field.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 11, 2024
    Inventors: Hsuan Wei-Yi, Yi-Hsin Huang, Ying-Chi Chou, Wen-Fu Tsai
  • Patent number: 11865228
    Abstract: The present invention discloses a bone void filler and a method for manufacturing the same by natural calcium-containing waste, which comprises steps of mixing 5-20 wt % of a calcium-containing waste powder, 5-20 wt % of acetic acid and a remaining weight percentage of water uniformly to obtain a mixing solution; adding 5-20 vol % of a diammonium hydrogen phosphate solution to the mixing solution to obtain a suspension; controlling a pH value of the suspension to obtain an alkaline solution; leaving the alkaline solution at room temperature for precipitation for 0.1 to 72 hours, centrifuging or suction filtrating the alkaline solution to obtain a precipitate, drying and grinding the precipitate to obtain hydroxyapatite; and mixing 30-60 wt % of a pore former and 30-60 wt % of the hydroxyapatite and a remaining weight percentage of a binder uniformly to form a mixture, compression molding the mixture in a mold and sintering the compression-molded mixture.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: January 9, 2024
    Assignee: National University Of Kaohsiung
    Inventors: Wen-Fu Ho, Hui-Chun Yu, Shih-Ching Wu, Hsueh-Chuan Hsu, Chi-Jen Chung, Shih-Kuang Hsu