Abstract: The invention provides a syringe for detecting pressure change. The syringe includes a barrel defining a reservoir for receiving a constituent, a piston movable within the reservoir and a plunger. The barrel further includes a proximal end and a distal end with an outlet, an engaging member with a pair of fingers formed on an outer periphery of the barrel and a rib extending from the outer periphery of the barrel and disposed proximally to the engaging member. The plunger includes a first plunger part, a second plunger part and a baseplate supporting the first and second plunger parts. The first plunger part is partially received by the reservoir and slidably engaged with the piston. The second plunger part further includes at least one stop ledge to which the fingers of the engaging member releasably latch, and the stop ledge formed on a periphery of the second plunger part, and a compartment for accommodating a first biasing member with first and second ends.

Abstract: A waterproof structure of a socket connector includes a waterproof housing, a socket, a cable, and a waterproof plug. The waterproof housing includes a wiring opening. The inner surface of the waterproof housing incudes a ring step surface facing the wiring opening. The wiring opening is covered by an end cap. The socket is received in the waterproof housing. The cable is connected to the socket and passes the wiring opening. The waterproof plug wrapping the cable is arranged in the wiring opening to close the wiring opening. The waterproof plug has an inner and an outer end, the inner end faces the socket, and a longitudinal annular rib is arranged on the inner end. The end cover is fastened to the waterproof housing along the longitudinal direction of the waterproof plug to press the outer end to make the longitudinal ring rib press the ring step surface.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.

Abstract: The present disclosure relates to integrated chip structure. The integrated chip structure includes a lower insulating structure disposed over a lower dielectric structure surrounding one or more lower interconnects. A bottom electrode via is surrounded by one or more interior sidewalls of the lower insulating structure. The bottom electrode via includes a barrier surrounding a conductive core. A bottom electrode is arranged on the bottom electrode via, a data storage structure is over the bottom electrode, and a top electrode is over the data storage structure. The barrier includes a sidewall disposed along the one or more interior sidewalls of the lower insulating structure and a horizontally covering segment protruding outward from the sidewall to above a top surface of the lower insulating structure.

Abstract: Often when there is a glare on a display screen the user may be able to mitigate the glare by tilting or otherwise moving the screen or changing their viewing position. However, when driving a car there are limited options for overcoming glares on the dashboard, especially when you are driving for a long distance in the same direction. Embodiments are directed to eliminating such glare. Other embodiments are related to mixed reality (MR) and filling in occluded areas.

Abstract: A blood pressure measurement device includes a substrate, a protrusion portion, an image sensor, a first light source, a second light source, and a control and processing unit. The first light source projects a first light toward the base plat. A finger presses the protrusion portion, and the image sensor captures an image of a bright area. The processing unit calculates a number of light-receivable pixels of image sensor and compares with a number of pixels able to receive light of image sensor to obtain a ratio value, and determines whether the finger has enough pressure. The second light source projects a second light toward the substrate, penetrating the substrate and the finger skin to be reflected by a blood vessel. The image sensor captures an image of a changed volume of the blood vessel, and the control and processing unit calculates the systolic or diastolic pressure.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped supporting layer disposed on the sensor chip, and a light-permeable layer disposed on the ring-shaped supporting layer. The ring-shaped supporting layer has an inner surrounding surface and an outer surrounding surface that is opposite to the inner surrounding surface. At least one of the inner surrounding surface and the outer surrounding surface has a plurality of round-ended microstructures that are sequentially connected to each other and that surround a sensing region of the sensor chip. An end of each of the round-ended microstructures is a round-ended portion having a radius of less than 1 ?m. The light-permeable layer, the inner surrounding surface of the ring-shaped supporting layer, and the sensor chip jointly define an enclosed space.

Abstract: The present disclosure relates integrated chip structure. The integrated chip structure includes a lower insulating structure disposed over a lower dielectric structure surrounding one or more lower interconnects. A bottom electrode via surrounded by one or more interior sidewalls of the lower insulating structure. The bottom electrode via includes a barrier surrounding a conductive core. A bottom electrode is arranged on the bottom electrode via, a data storage structure is over the bottom electrode, and a top electrode is over the data storage structure. The barrier includes a sidewall disposed along the one or more interior sidewalls of the lower insulating structure and a horizontally covering segment protruding outward from the sidewall to above a top surface of the lower insulating structure.

Abstract: The present disclosure provides compounds that are amylin receptor antagonist compounds, compositions that include the subject compounds, methods for preparing and using the amylin receptor antagonists, and compositions containing the amylin receptor antagonists for treating, preventing, or ameliorating Alzheimer's disease. Aspects of the present disclosure include a method of inhibiting activity of an amylin receptor by administering to a subject in need thereof a therapeutically effective amount of an amylin receptor antagonist.

Abstract: A thermoconductive structure includes a waterproof casing, a socket and a thermoconductive plate. The socket is accommodated in the waterproof casing and includes a metal housing having an inserting opening and a side opening defined on a side of the inserting opening. The thermoconductive plate is movably disposed on the metal housing. One surface of the thermoconductive plate protrudes from an inner surface of the metal housing through the side opening. Another surface of the thermoconductive plate is provided with a soft thermoconductive element. The soft thermoconductive element is disposed between an inner surface of the waterproof casing and the thermoconductive plate. When a plug is inserted into the metal housing, the plug pushes the thermoconductive plate to make the soft thermoconductive element be compressed by the thermoconductive plate and the waterproof housing.

Abstract: An optical device includes an electronic component, a light-permeable layer, and a ring-shaped adhesive layer that is sandwiched between the electronic component and the light-permeable layer. The ring-shaped adhesive layer surrounds an optical region of the electronic component and includes a plurality of light-weakening slots that are formed on an inner side surface thereof. The light-weakening slots are in a ring-shaped arrangement and surround the optical region. Each of the light-weakening slots has a slot opening having a slot width and a slot bottom spaced apart from the slot opening by a slot depth. A width of each of the light-weakening slots gradually decreases along a direction from the slot opening to the slot bottom, and a ratio of the slot width to the slot depth is within a range from 1:0.86 to 1:11.4, such that each of the light-weakening slots is configured to weaken light irradiated thereon.

Abstract: A waterproof electrical connection device includes a waterproof casing, a socket assembly, a wire element, and a waterproof plug. The waterproof casing includes a wiring port. An inner surface of the waterproof casing includes an annular step surface facing the wiring port. The wiring port is covered by an end cover. The socket assembly is placed inside the waterproof casing. The waterproof plug is arranged in the wiring port to seal it. The wire element is connected to a connector of the socket assembly and passes through the waterproof casing via the waterproof plug. The waterproof plug has an inner end and an outer end opposite to the inner end. The inner end is arranged toward the socket assembly and includes a longitudinal ring rib. The end cover is fastened to the waterproof casing to press the outer end, so that the longitudinal ring rib presses the annular step surface.

Abstract: An electric connecting cable includes an insulative seat, multiple terminals and multiple wires corresponding to the terminals. The terminals are buried in the insulative seat. Each terminal has a soldering leg. Each soldering leg penetrates out of the insulative seat. The soldering legs are arranged in a row. Each soldering leg is disposed with a concave soldering groove. Each soldering groove has a notch and a slope outward extended from an edge of the notch. Each wire has a soldering end. Each soldering end is accommodated in corresponding one of the soldering grooves. Each soldering end is separately soldered to corresponding one of the soldering legs. Each wire is extended along a longitudinal direction of corresponding one of the soldering legs soldered thereto.

Abstract: The present invention provides a surface light source projection device, which includes a light emitting module and a diffractive optical module. Wherein, the diffractive optical module has two micron diffractive layers, the micron diffractive layers include a plurality of micron structures, and the shape of the micron structures is set to be cone, disc or any combination of the above. The micron structures have an outer diameter, and the outer diameter of the micron structures is between 5 times and 200 times of the incident wavelength of the light beam output from the light emitting module. Thereby, the surface light source projection device capable of enduring heat accumulation generated after continuous irradiation of high-energy laser is provided to facilitate long-term irradiation and long-distance sensing.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.

Abstract: A computing device permits distribution of power received from an external power source to one or more subsystems of the computing device. The computing device receives input requesting a power control operation and, responsive to the input, interrupts the distribution of the power to at least one of the subsystems.

Abstract: An improved method of defect classification is disclosed. An improve method comprises obtaining an inspection image, obtaining layout data associated with the image, obtaining a probability map derived from the layout data, wherein the probability map identifies a probability of a first type of defect occurring in a region of the layout data, identifying a defect in the inspection image occurring at a first location, and classifying the defect based on the probability map and the first location.

Abstract: A system for monitoring cells, which includes a device for monitoring cell-substrate impedance, the device having a plurality of wells on a nonconductive substrate, where each of the plurality of wells has an electrode array fabricated on the substrate for measurement of cell-substrate impedance; an impedance analyzer that measures cell-substrate impedance from the plurality of wells; electronic circuitry with multiple analogue-to-digital conversion channels, where the electronic circuitry electrically connects the electrode arrays to the impedance analyzer such that the electrode arrays are electrically monitored at millisecond time resolution; and a software program that analyzes the measured cell-substrate impedance.

Abstract: An optical package structure includes a light transmittable member, a bonding structural member, and an optical element. The bonding structural member includes a first bonding layer and a second bonding layer to form a light-scattering structure. The first bonding layer is connected to a bonding surface of the light transmittable member. An inner side of the first bonding layer includes a plurality of first protruded portions. An inner side of the second bonding layer includes a plurality of second protruded portions. The second protruded portions and the first protruded portions are arranged in a staggered manner. The bonding structural member includes the first bonding layer or the light-absorption member. The light-absorption member is filled in concaved portions of the first bonding layer. The optical element is connected to the bonding structural member, and is spaced apart from the light transmittable member.

Abstract: An optical package structure and a method for manufacturing the same are provided. The optical package structure includes an optical element, a bonding structural member, and a light transmittable member. The bonding structural member is bonded to a surface of the optical element. The bonding structural member includes a first bonding layer, a light-absorption layer, and a second bonding layer. The first bonding layer and the second bonding layer are made of an opaque material. The light-absorption layer is disposed between the first bonding layer and the second bonding layer. The light transmittable member is bonded to the bonding structural member and spaced apart from the optical element. The light-absorption layer is configured to absorb light emitted to the bonding structural member.