Abstract: Method, system, device, and non-transitory computer-readable medium for presenting a conversation. A computer-implemented method may include: obtaining, via a first virtual participant, a first set of audio data associated with the first conversation while the first conversation occurs; transcribing the first set of audio data into a first set of text data while the first conversation occurs; obtaining a set of annotations associated with the set of text data while the first conversation occurs; identifying one or more topic transitions based at least in part upon the set of text data; generating a conversation summary based at least in part upon the one or more topic transitions; obtaining a first set of visual data associated with the conversation; and presenting the set of annotations, the conversation summary, and the first set of visual data embedded in the first set of text data to the first group of actual participants.

Abstract: A resistive random access memory structure includes a first inter-layer dielectric layer; a bottom electrode disposed in the first inter-layer dielectric layer; a capping layer disposed on the bottom electrode and on the first inter-layer dielectric layer; and a through hole disposed in the capping layer. The through hole partially exposes a top surface of the bottom electrode. A variable resistance layer is disposed within the through hole. A top electrode is disposed within the through hole and on the variable resistance layer. A second inter-layer dielectric layer covers the top electrode and the capping layer.

Abstract: A middle frame includes an inner frame, a blocking member, and a covering member. The inner frame includes an outer surface and an inner surface opposite the outer surface. The inner frame further comprises at least one mounting hole penetrating the outer surface and the inner surface, the at least one mounting hole comprises an opening at the outer surface. The covering member covers the outer surface, and the blocking member is disposed between the covering member and the outer surface so as to cover the opening of the at least one mounting hole at the outer surface. An electronic device including the middle frame and a method for manufacturing the middle frame are also provided.

Abstract: An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 ?m and less than or equal to 15 ?m.

Abstract: An optical device includes an electronic component, a light-permeable layer, and a ring-shaped adhesive layer that is sandwiched between the electronic component and the light-permeable layer. The ring-shaped adhesive layer surrounds an optical region of the electronic component and includes a plurality of light-weakening slots that are formed on an inner side surface thereof. The light-weakening slots are in a ring-shaped arrangement and surround the optical region. Each of the light-weakening slots has a slot opening having a slot width and a slot bottom spaced apart from the slot opening by a slot depth. A width of each of the light-weakening slots gradually decreases along a direction from the slot opening to the slot bottom, and a ratio of the slot width to the slot depth is within a range from 1:0.86 to 1:11.4, such that each of the light-weakening slots is configured to weaken light irradiated thereon.

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.

Abstract: An electric connecting cable includes an insulative seat, multiple terminals and multiple wires corresponding to the terminals. The terminals are buried in the insulative seat. Each terminal has a soldering leg. Each soldering leg penetrates out of the insulative seat. The soldering legs are arranged in a row. Each soldering leg is disposed with a concave soldering groove. Each soldering groove has a notch and a slope outward extended from an edge of the notch. Each wire has a soldering end. Each soldering end is accommodated in corresponding one of the soldering grooves. Each soldering end is separately soldered to corresponding one of the soldering legs. Each wire is extended along a longitudinal direction of corresponding one of the soldering legs soldered thereto.

Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming the resistive random access memory (RRAM) structure is also provided.

Abstract: A waterproof electrical connection device includes a waterproof casing, a socket assembly, a wire element, and a waterproof plug. The waterproof casing includes a wiring port. An inner surface of the waterproof casing includes an annular step surface facing the wiring port. The wiring port is covered by an end cover. The socket assembly is placed inside the waterproof casing. The waterproof plug is arranged in the wiring port to seal it. The wire element is connected to a connector of the socket assembly and passes through the waterproof casing via the waterproof plug. The waterproof plug has an inner end and an outer end opposite to the inner end. The inner end is arranged toward the socket assembly and includes a longitudinal ring rib. The end cover is fastened to the waterproof casing to press the outer end, so that the longitudinal ring rib presses the annular step surface.

Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.

Abstract: The present invention provides a surface light source projection device, which includes a light emitting module and a diffractive optical module. Wherein, the diffractive optical module has two micron diffractive layers, the micron diffractive layers include a plurality of micron structures, and the shape of the micron structures is set to be cone, disc or any combination of the above. The micron structures have an outer diameter, and the outer diameter of the micron structures is between 5 times and 200 times of the incident wavelength of the light beam output from the light emitting module. Thereby, the surface light source projection device capable of enduring heat accumulation generated after continuous irradiation of high-energy laser is provided to facilitate long-term irradiation and long-distance sensing.

Abstract: A bonding method and a bonding structure are provided. A device substrate is provided including a plurality of semiconductor devices, wherein each of the semiconductor devices includes a first bonding layer. A cap substrate is provided including a plurality of cap structures, wherein each of the cap structures includes a second bonding layer, the second bonding layer having a planar surface and a first protrusion protruding from the planar surface. The device substrate is bonded to the cap substrate by engaging the first protrusion of the second bonding layer of each of the cap structures with the corresponding first bonding layer of each of the semiconductor devices in the device substrate.

Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: Methods and systems for team cooperation with real-time recording of one or more moment-associating elements. For example, a method includes: delivering, in response to an instruction, an invitation to each member of one or more members associated with a workspace; granting, in response to acceptance of the invitation by one or more subscribers of the one or more members, subscription permission to the one or more subscribers; receiving the one or more moment-associating elements; transforming the one or more moment-associating elements into one or more pieces of moment-associating information; and transmitting at least one piece of the one or more pieces of moment-associating information to the one or more subscribers.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.

Abstract: This application discloses an electrode plate, an electrode assembly, a battery cell, a battery, and an electrical device. The electrode plate includes: a current collector, where the current collector includes a base film layer and metal layers, and the metal layers are disposed on the base film layer in a spaced-apart manner; and active material layers, where the active material layers are applied to the base film layer in a spaced-apart manner. Each active material layer at least partially covers a corresponding metal layer.

Abstract: A display panel, which belongs to the technical field of display devices. The display panel includes an opening area (20) provided with an opening: an active area (70) at least partially surrounding the opening area (20); and a first anti-crack area (40). The display panel in the first anti-crack area (40) further includes: at least one circle of anti-crack protective layer (41); the active area (70) includes at least one touch electrode layer (71); and the anti-crack protective layer (41) and at least one of the at least one touch electrode layer (71) are arranged in a same layer and with a same material. The anti-crack protective layer (41) of the display panel of the present disclosure may improve the anti-crack ability of the area surrounding the digging holes.

Abstract: An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.

Abstract: A resistive memory device includes a substrate; a dielectric layer disposed on the substrate; a conductive via disposed in the dielectric layer; and a memory stack structure disposed on the conductive via and the dielectric layer. The memory stack structure includes a bottom electrode layer, a resistive switching layer on the bottom electrode layer, and a top electrode layer on the resistive switching layer. The top electrode layer includes at least two physically separated sub-electrode portions.