Abstract: An optical identification module including a sensor and a collimator is provided. The sensor has a plurality of sensing regions. The collimator is disposed on the plurality of sensing regions, and the collimator includes a transparent substrate, a first light shielding layer, and a plurality of microlenses. The first light shielding layer includes a plurality of first openings. The plurality of microlenses are disposed on a first surface of the transparent substrate, and the plurality of microlenses correspond to the plurality of first openings respectively.

Abstract: A magnetic electric connector and its magnetic terminal. The magnetic electric connector comprises a male connector and a receptacle which are adapted to each other. The male connector comprises an insulator and several first magnetic terminals. The first magnetic terminal comprises a first magnet and a first metallic conducting layer fixed to the outer surface of the first magnet. The receptacle comprises a bench insulator and several second magnetic terminals. The second magnetic terminal comprises a second magnet and a second metallic conducting layer fixed to the outer surface of the second magnet. When the male connector and receptacle are butted, the first magnetic terminal of male connector is adsorbed on the second magnetic terminal of receptacle, forming electrical conduction, implementing charging or transmitting data, they can be localized and fastened without an additional fixing structure, guaranteeing a stable butting of male connector and receptacle.

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

Abstract: Systems, apparatuses and methods may provide for technology to improve an appearance of objects that enter a viewable area of a 360-degree video. The technology may include a head mounted display (HMD), a viewport comprising a viewable area within the HMD, and a memory to store objects of interest not currently in the viewable area.

Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

Abstract: A fingerprint sensing device including a light guide cover plate, a light source, an image sensor, and a light output element is provided. The light guide cover plate includes a flat plate portion and a light entering portion. The flat plate portion has a first surface and a second surface opposite to each other. The light entering portion is located at the second surface, and has an inclined light incident surface inclined with respect to the first surface and the second surface. The light source is configured to emit a light beam. The light beam is transmitted to the light entering portion and the flat plate portion in sequence via the inclined light incident surface. The light output element is disposed on the second surface, and guides the light beam in the flat plate portion to the image sensor.

Abstract: A chip package includes a circuit board, a chip and an underfill. The circuit board includes a substrate, first circuit lines and second circuit lines. Each of the first circuit lines includes an inner lead and a first line fragment that are disposed on a chip mounting area and an underfill covering area of the substrate, respectively. The second circuit lines are disposed on the chip mounting area and not located between the adjacent inner leads so as to form a wider space between the adjacent first line fragments. The wider space enables the underfill to flow to between the circuit board and the chip and prevents air bubbles from being embedded in the underfill filled between the circuit board and the chip.

Abstract: The present application provides methods and systems for launching an unmanned aerial vehicle (UAV). An exemplary system for launching a UAV includes a detector configured to detect acceleration of the UAV in a launch mode. The exemplary system may also include a memory storing instructions and a processor configured to execute the instructions to cause the system to: obtain a signal configured to notify the UAV to enter the launch mode, determine whether the acceleration of the UAV satisfies a condition corresponding to threshold acceleration in the launch mode, and responsive to the determination that the acceleration of the UAV satisfies the condition, turn on a motor of the UAV.

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

Abstract: A system of reducing power consumed by a large screen display panel may comprise a display divided into a plurality of segments. A gaze tracker identifies a gaze region where a viewer(s) is looking to increase a refresh rate for segments identified in the gaze region with relation to segments outside of the gaze region. The shading rate of segments outside of the gaze region may also be lowered to save even more power.

Abstract: A flexible circuit board includes a flexible substrate and a stiffening structure, a stiffening area is defined on a bottom surface of the flexible substrate, and the stiffening structure includes a first stiffener and a second stiffener. The first stiffener is disposed on the stiffening area of the bottom surface and the second stiffener is disposed on the first stiffener such that the first stiffener is located between the flexible substrate and the second stiffener. The flexible substrate is protected from punch damage caused by stress concentrations because a cutting line of the flexible substrate only passes through the first stiffener.

Abstract: A flip chip interconnection includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board, the solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit on the inner bonding area. The T-shaped circuit unit has a main part, a connection part and a branch part, the connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to prevent solder short caused by solder overflow on the branch part.

Abstract: An embodiment of an electronic processing system may include a 2D frame which corresponds to a projection of a 360 video space, and a component predictor to predict an encode component for a first block of a 2D frame based on encode information from a neighboring block which is neighboring to the first block of the 2D frame only in the 360 video space, a prioritizer to prioritize transmission for a second block of the 2D frame based on an identified region of interest, and/or a format detector to detect a 360 video format of the 2D frame based on image content. A 360 video capture device may include a contextual tagger to tag 360 video content with contextual information which is contemporaneous with the captured 360 video content. Other embodiments are disclosed and claimed.

Abstract: A tire is disclosed, including a plurality of blocks, each has an outer surface bulging outward and two lateral walls. An extension line is defined on the surface of each flat segment of each block. Each extension line has a first point on the flat segment. A first horizontal reference line is defined by connecting two first points. A second horizontal reference line is defined on the outer surface with two ends thereof contacting the outer surface. The second horizontal reference line is 0.85 times as long as the first horizontal reference line. A vertical distance between the outer surface and the second horizontal reference line is 0.2-0.8 mm. Whereby, the tire could provide good drainage performance and adequate grip.

Abstract: A system for monitoring cell-substrate impedance of excitable cells at millisecond time resolution and methods of assessing cell beating by monitoring cell-substrate impedance of beating cells at millisecond time resolution.

Abstract: A circuit board electrically connected to a chip includes a substrate and a circuit layer. A first conductive line of the circuit layer includes a main line and a branch lead connected with each other. The branch lead provided to increase lead quantity for bonding with the chip includes an extension part and a bonding part which is used for bonding a bump of the chip. During thermal compression, gaps existing between the extension part and the main line and between the bonding part and the main line can prevent solder on the main line from flowing toward the bump and overflowing from the branch lead.

Abstract: A chip package includes a circuit board, a chip and an underfill. A solder resist layer formed on the circuit board is modified in edge profile so as to reduce required amount of the underfill. The fewer underfill is still enough to be filled between the circuit board and the chip, and still can cover circuit lines that are not covered by the solder resist layer to protect the circuit lines from oxidation.

Abstract: Systems, apparatuses and methods may include technology to bundle on demand video frames together in clusters having similar encode times based on predicted performance determined by weighted heuristics.

Abstract: The disclosure illustrates a curve-shaped mask, a curved device having color resist pattern and method for manufacturing the same. The curved device includes a curved substrate and at least two color resist layers. The at least two color resist layers are formed on the curved substrate, and construct a visible pattern together. The curved device is manufactured by a curve-shaped mask, which is a metal-containing material layer formed on the curved substrate and is visible.

Abstract: Systems, apparatuses and methods may provide for technology to improve an appearance of objects that enter a viewable area of a 360-degree video. The technology may include a head mounted display (HMD), a viewport comprising a viewable area within the HMD, and a memory to store objects of interest not currently in the viewable area.