Patents by Inventor Wen Fu

Wen Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230318223
    Abstract: A thermoconductive structure includes a waterproof casing, a socket and a thermoconductive plate. The socket is accommodated in the waterproof casing and includes a metal housing having an inserting opening and a side opening defined on a side of the inserting opening. The thermoconductive plate is movably disposed on the metal housing. One surface of the thermoconductive plate protrudes from an inner surface of the metal housing through the side opening. Another surface of the thermoconductive plate is provided with a soft thermoconductive element. The soft thermoconductive element is disposed between an inner surface of the waterproof casing and the thermoconductive plate. When a plug is inserted into the metal housing, the plug pushes the thermoconductive plate to make the soft thermoconductive element be compressed by the thermoconductive plate and the waterproof housing.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 5, 2023
    Inventors: Ming-Jun XU, Wen-Fu LIAO, Yun-Chang YANG, Ming-Wei CHEN
  • Patent number: 11735946
    Abstract: A voltage stabilizing system of a switching direct current (DC) power supply equipment is provided. DC power outputted by battery modules and a rectifier is boosted, bucked, or boosted and bucked by a voltage stabilizer circuit, and is then distributed to a plurality of external electronic devices or the battery modules. The voltage stabilizer circuit includes a main voltage stabilizer circuit and one or more slave voltage stabilizer circuits. The main voltage stabilizer circuit controls the slave voltage stabilizer circuits, and distributes the DC power respectively to the main voltage stabilizer circuit and the slave voltage stabilizer circuits. Circuit boards of the main voltage stabilizer circuit and the slave voltage stabilizer circuits are pluggably installed in a machine cabinet of the switching direct current power supply equipment.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: August 22, 2023
    Assignee: C-TECH UNITED CORPORATION
    Inventor: Feng-Wen Fu
  • Publication number: 20230244008
    Abstract: The present invention provides a surface light source projection device, which includes a light emitting module and a diffractive optical module. Wherein, the diffractive optical module has two micron diffractive layers, the micron diffractive layers include a plurality of micron structures, and the shape of the micron structures is set to be cone, disc or any combination of the above. The micron structures have an outer diameter, and the outer diameter of the micron structures is between 5 times and 200 times of the Narrow half-wave width incident wavelength of the light beam output from the light emitting module. Thereby, the surface light source projection device capable of enduring heat accumulation generated after continuous irradiation of high-energy laser is provided to facilitate long-term irradiation and long-distance sensing.
    Type: Application
    Filed: April 27, 2022
    Publication date: August 3, 2023
    Inventors: Jun-Wen CHUNG, Hsu-Wen Fu, Lu-Lang HSU
  • Publication number: 20230238318
    Abstract: The present disclosure relates integrated chip structure. The integrated chip structure includes a lower insulating structure disposed over a lower dielectric structure surrounding one or more lower interconnects. A bottom electrode via surrounded by one or more interior sidewalls of the lower insulating structure. The bottom electrode via includes a barrier surrounding a conductive core. A bottom electrode is arranged on the bottom electrode via, a data storage structure is over the bottom electrode, and a top electrode is over the data storage structure. The barrier includes a sidewall disposed along the one or more interior sidewalls of the lower insulating structure and a horizontally covering segment protruding outward from the sidewall to above a top surface of the lower insulating structure.
    Type: Application
    Filed: April 21, 2022
    Publication date: July 27, 2023
    Inventors: Zhen Yu Guan, Sheng-Wen Fu, Hsun-Chung Kuang
  • Patent number: 11699404
    Abstract: Often when there is a glare on a display screen the user may be able to mitigate the glare by tilting or otherwise moving the screen or changing their viewing position. However, when driving a car there are limited options for overcoming glares on the dashboard, especially when you are driving for a long distance in the same direction. Embodiments are directed to eliminating such glare. Other embodiments are related to mixed reality (MR) and filling in occluded areas.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: July 11, 2023
    Assignee: Intel Corporation
    Inventors: Arthur J. Runyan, Richmond Hicks, Nausheen Ansari, Narayan Biswal, Ya-Ti Peng, Abhishek R. Appu, Wen-Fu Kao, Sang-Hee Lee, Joydeep Ray, Changliang Wang, Satyanarayana Avadhanam, Scott Janus, Gary Smith, Nilesh V. Shah, Keith W. Rowe, Robert J. Johnston
  • Publication number: 20230201417
    Abstract: A pharmaceutical composition for eardrum repair includes: collagen present in an amount of 8 wt % to 12 wt %; a forming agent present in an amount of 19 wt % to 22 wt %; and rest of a solvent, wherein the forming agent is a polymer of polyethylene oxide (PEO) and polypropylene oxide (PPO), polystyrene, polyethylene, polypropylene, polymethylmethacrylate, poly(N-isopropylacrylamide), poly[2-(dimethylamino)ethyl methacrylate] (pDMAEMA) hydroxypropylcellulose, poly(vinylcaprolactame), poly-2-isopropyl-2-oxazoline, polyvinyl methyl ether or a combination thereof.
    Type: Application
    Filed: December 27, 2021
    Publication date: June 29, 2023
    Inventors: Wen-Fu Lai, Li-Hsuan Chiu, Fu-Chen Kung
  • Publication number: 20230206444
    Abstract: The present disclosure relates to methods and systems for image analysis. The method may include obtaining a plurality of image sequences relating to a blood vessel. At least one of the plurality of image sequences may be acquired using a black blood imaging sequence. The method may also include determining a plurality of aligned image sequences by aligning, based on a reference image sequence of the plurality of image sequences, the plurality of image sequences, determining a target region based on the plurality of aligned image sequences, and determining one or more target parameters based on the target region.
    Type: Application
    Filed: December 27, 2022
    Publication date: June 29, 2023
    Applicant: SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD.
    Inventors: Saisai SU, Zhenhuan GONG, Jingdong LI, Wen FU
  • Patent number: 11670108
    Abstract: An image sensing device and a fingerprint sensing method are provided. The image sensing device is suitable for being installed in an electronic device. The image sensing device includes a light sensor and a controller. The controller is coupled to the light sensor. When the electronic device is operated in a sleep mode, the controller operates the light sensor in a light sensing mode. The controller determines whether a number of signal intensity changes of a photosensitive signal output by the light sensor exceeds a predetermined number of intensity changes within a predetermined length of time, so as to switch the operation of the light sensor in a fingerprint sensing mode.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: June 6, 2023
    Assignee: Guangzhou Tyrafos Semiconductor Technologies Co., LTD
    Inventors: Hsu-Wen Fu, Ping-Hung Yin
  • Patent number: 11656552
    Abstract: A device having color resists pattern and method for manufacturing are disclosed. The device includes a substrate, at least two color resist layers. The at least color resist layers are formed on the curved and construct a visible pattern, wherein at a boundary of the color resist pattern, the at least two color resist layers form a ramp structure and each of the at least two color resist layers contacts the substrate; and the ramp structure is formed in sequential order by one exposure process, one removal process and one baking process of the at least two color resist layers.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: May 23, 2023
    Inventors: Ming-An Hsu, Wen-Fu Lin
  • Publication number: 20230130050
    Abstract: A system for monitoring cells, which includes a device for monitoring cell-substrate impedance, the device having a plurality of wells on a nonconductive substrate, where each of the plurality of wells has an electrode array fabricated on the substrate for measurement of cell-substrate impedance; an impedance analyzer that measures cell-substrate impedance from the plurality of wells; electronic circuitry with multiple analogue-to-digital conversion channels, where the electronic circuitry electrically connects the electrode arrays to the impedance analyzer such that the electrode arrays are electrically monitored at millisecond time resolution; and a software program that analyzes the measured cell-substrate impedance.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 27, 2023
    Inventors: Xiaobo Wang, Yama A. Abassi, Biao Xi, Wen Fu Zhang, Xiao Xu
  • Publication number: 20230123106
    Abstract: A bioassay device includes a main body, a biomolecular image sensor and an electrical connection portion. The main body is formed with a sensor groove. The biomolecular image sensor is disposed in the sensor groove and includes an image sensor unit. The electrical connection portion is disposed at one side of the main body and electrically connected to the biomolecular image sensor. Such that, all of the units in bioassay are able to be disposed on the main body, and the bioassay device is a kit for bioassay.
    Type: Application
    Filed: May 9, 2022
    Publication date: April 20, 2023
    Inventors: Hsu-Wen Fu, Chun-I Shao, Hsiao-Wen Sun, Ping-Hung Yin
  • Publication number: 20230119978
    Abstract: The invention provides a biomolecular image sensor with a plurality of microstructures repeatedly arranged on a surface of an image sensing element, and method thereof for detecting biomolecule.
    Type: Application
    Filed: April 28, 2022
    Publication date: April 20, 2023
    Inventors: Ping-Hung Yin, Chun-I Shao, Hsiao-Wen Sun, Hsu-Wen Fu, Chang-Hsien Tsai, Lu-Lang Hsu
  • Publication number: 20230123442
    Abstract: The present invention provides a biomolecule image sensor in which detection molecules are deposed on a light receiving surface of an image sensing element, and method thereof for detecting biomolecule.
    Type: Application
    Filed: April 28, 2022
    Publication date: April 20, 2023
    Inventors: Ping-Hung Yin, Jun-Wen Chung, Chun-I Shao, Hsiao-Wen Sun, Hsu-Wen Fu, Chia-Hao Chang
  • Patent number: 11600100
    Abstract: An image sensing method, applicable to the anti-spoofing recognition of under screen optical fingerprint sensing, is provided, including: dividing the image sensor into sensing blocks, dividing the display area of the display device correspondingly according to the sensing area, and the display area including the light-emitting area; defining the luminous color of each display area and the color coordinate value of each luminous color; each sensing block sensing the light intensity of the image reflected to the sensing block from the display block emitting the light onto the reference object and the test object to be measured; calculating the anti-spoofing reference color information of the reference object and registering in the system; when sensing the fingerprint image, first obtaining the light intensity of each block, then calculating the color information of the test object; and finally, comparing the color information with the registered anti-spoofing reference color information.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 7, 2023
    Assignee: Guangzhou Tyrafos Semiconductor Tech. Co., Ltd.
    Inventors: Ping-Hung Yin, Jun-Wen Chung, Hua Chen, Fu-Kuo Lin, Hsu-Wen Fu
  • Publication number: 20230062742
    Abstract: The present invention relates to a two-stage sintering method for preparing a porous biphasic calcium phosphate ceramic from calcium-containing biological waste, wherein hydroxyapatite prepared from calcium-containing waste is mixed with a foaming agent to prepare a bone graft material having medicinal use through two-stage sintering.
    Type: Application
    Filed: July 27, 2022
    Publication date: March 2, 2023
    Applicant: Council of Agriculture, Executive Yuan
    Inventors: Wen-Fu Ho, Hsueh-Chuan Hsu, Shih-Ching Wu
  • Patent number: 11581283
    Abstract: A flip chip package includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board. The solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit is on the inner bonding area. The T-shaped circuit unit has a main part, a connection part, and a branch part. The connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to inhibit solder shorts caused by solder overflow on the branch part.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: February 14, 2023
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Yu-Chen Ma, Hsin-Hao Huang, Wen-Fu Chou, Gwo-Shyan Sheu
  • Publication number: 20230001050
    Abstract: The present invention discloses a bone void filler and a method for manufacturing the same by natural calcium-containing waste, which comprises steps of mixing 5-20 wt % of a calcium-containing waste powder, 5-20 wt % of acetic acid and a remaining weight percentage of water uniformly to obtain a mixing solution; adding 5-20 vol % of a diammonium hydrogen phosphate solution to the mixing solution to obtain a suspension; controlling a pH value of the suspension to obtain an alkaline solution; leaving the alkaline solution at room temperature for precipitation for 0.1 to 72 hours, centrifuging or suction filtrating the alkaline solution to obtain a precipitate, drying and grinding the precipitate to obtain hydroxyapatite; and mixing 30-60 wt % of a pore former and 30-60 wt % of the hydroxyapatite and a remaining weight percentage of a binder uniformly to form a mixture, compression molding the mixture in a mold and sintering the compression-molded mixture.
    Type: Application
    Filed: July 2, 2021
    Publication date: January 5, 2023
    Inventors: WEN-FU HO, HUI-CHUN YU, SHIH-CHING WU, HSUEH-CHUAN HSU, CHI-JEN CHUNG, SHIH-KUANG HSU
  • Publication number: 20220374623
    Abstract: An optical fingerprint identification structure is provided, including: a protective glass and an optical fingerprint identification module, wherein the optical fingerprint identification module is located under the protective glass. The protective glass of the present invention is of a thickness. The gap between the protective glass and the optical fingerprint identification module is an air gap. The optical fingerprint identification module further comprises: a receiving lens assembly, an image sensor module, a module housing, and a module housing extension, the receiving lens assembly is located at the top of the optical fingerprint identification module, that is, close to the air gap, and the image sensor module is located below the receiving lens assembly. As such, the size of the optical fingerprint identification structure is reduced, and is applicable to the side of device, so that the usable area on the front and back of the device is increased.
    Type: Application
    Filed: August 24, 2021
    Publication date: November 24, 2022
    Inventors: Hsu-Wen FU, Jun-Wen CHUNG, Yu-Heng CHEN, Yufan CHEN, Hung-Wen YANG
  • Patent number: 11502126
    Abstract: A method for fabricating an integrated circuit is provided. The method includes depositing an etch stop layer over an interconnect layer having a conductive feature; depositing a protective layer over the etch stop layer; depositing a first dielectric layer over the protective layer; etching a via opening in the first dielectric layer, wherein the protective layer has a higher etch resistance to etching the via opening than that of the first dielectric layer; etching a portion of the protective layer exposed by the via opening; etching a portion of the etch stop layer exposed by the via opening, such that the via opening exposes the conductive feature; forming a bottom electrode via in the via opening; and forming a memory stack over the bottom electrode via.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: November 15, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Harry-Hak-Lay Chuang, Sheng-Wen Fu, Jun-Yao Chen, Sheng-Huang Huang, Hung-Cho Wang
  • Publication number: 20220351537
    Abstract: An image sensing device and a fingerprint sensing method are provided. The image sensing device is suitable for being installed in an electronic device. The image sensing device includes a light sensor and a controller. The controller is coupled to the light sensor. When the electronic device is operated in a sleep mode, the controller operates the light sensor in a light sensing mode. The controller determines whether a number of signal intensity changes of a photosensitive signal output by the light sensor exceeds a predetermined number of intensity changes within a predetermined length of time, so as to switch the operation of the light sensor in a fingerprint sensing mode.
    Type: Application
    Filed: March 10, 2022
    Publication date: November 3, 2022
    Applicant: Guangzhou Tyrafos Semiconductor Technologies Co., LTD
    Inventors: Hsu-Wen Fu, Ping-Hung Yin