Abstract: A lamp socket having a double-deck center contact strip includes a socket body having an inner hollow provided with a metal threaded sleeve for receiving a lamp. The socket body is provided inside with a curve-shaped center contact strip having one side fixed on the socket body, and the other side turning upward and located in the center of the threaded sleeve but separating from the threaded sleeve. The double-deck center contact strip is composed of a copper and a steel contact strip, the copper contact strip located on top for contacting with the contact under a lamp and conducting elasticity, while the steel contact strip positioned under the copper contact strip for reinforcing the elasticity of the center contact strip, thus maintaining good contact between the lamp socket and the lamp for conducting electricity well, prolonging service life and ensuring safety.

Abstract: A snorkel diving mask allowing nasal breathing of a user includes a mask body having a pair of transparent portions for the eyes, a nose portion situated between the transparent portions, a resilient peripheral edge for watertight engagement with the facial skin of the user around the eyes and the nose, and a head band for maintaining the watertight engagement of the resilient peripheral edge with the facial skin. The diving mask further has a pair of air admitting hoses extending from opposite side areas of the mask body, an air exiting hose extending from the nose portion of the mask body (10), and a breather in connection and in fluid communication with the hoses. Therefore, the user can breathe in and out nasally when the breather is above the surface of water.

Abstract: An electrical luminescent lamp processing process includes the step of using a machine tool to process a design in the back electrode layer of an electrical luminescent lamp, the step of cutting contact holes in an electrically insulative layer subject to a predetermined design and then adhering the electrically insulative layer to the back electrode layer, and the step of adhering a conductor layer to the electrically insulative layer opposite to the back electrode layer over the contact holes for transmitting electricity to the design in the back electrode layer.

Abstract: A method and apparatus for automatically tuning the output line rate thereof and a display controller provided with the same. The display controller of the present invention provides a display controller having a line buffer, an input means, an output means, a status detector, and an auto-tune control means. The input means is employed to write line data into the line buffer at an input line rate, and the output means is employed to read the written line data from the line buffer at an output line rate. The status detector is coupled to the input means and the output means for generating a status signal indicating whether the input line rate and the output line rate are unbalanced. The auto-tune control means is used to adjust the output line rate in response to the status signal so as to balance the input line rate and the output line rate.

Abstract: The present invention provides a display controller for scaling an input source image. The display controller dynamically adjusts the output clock so line buffer requirement is reduced to a minimum to balance input and output image timing for image scaling or non-scaling to destination devices. The present invention supports up-scaling and down-scaling or bypass. The blocks of the line buffer operates in a continuous and cyclical manner according to the status signal generated by the line buffer status detector and the output clock. As a result, any buffer overrun or underrun condition will be immediately corrected by the timing and therefore the number of blocks of line buffer are greatly reduced.

Abstract: A new method is provided for mounting high-density IC semiconductor devices. A layer of epoxy is deposited over the first surface of a metal panel. One or more thin film interconnect layers are then created on top of the epoxy layer. The BUM technology allows for the creation of a succession of layers over the thin film layers. The combined layers of thin film and BUM form the interconnect substrate. One or more cavities are created in the second surface of the metal panel; openings through the layer of epoxy are created where the layer of epoxy is exposed. One or more IC semiconductor die are inserted into the cavities, are electrically connected to the openings that have been created in the layer of epoxy. Openings are created in the bottom BUM layer; solder balls are inserted and attached to this BUM layer for the completion of the Ball Grid Array (BGA) package.

Abstract: A system can produce a suitable voltage for powering the memory modules plugged into the memory module slots of a motherboard. A power-good signal is issued when the motherboard is powered up. A power safety device on the motherboard then issues a 2.5V to the memory module slot. If DDR DRAM type of memory modules are not detected after a while, the power safety device will turn off the 2,5V supply and provide a 3.3V, which is suitable for SDRAM type memory modules.This invention avoids sending a 3.3V to DDR DRAM modules, thereby burning the memory chip. The presence of DDR DRAM modules can be detected by a general-purpose purpose input/output port through accessing the recorded data in the EEPROM of the memory module. Alternatively, memory module type can be determined by sending out a low-current pulse signal to the memory module slot. Hence, a suitable voltage source is automatically provided to power the memory modules in the slots.

Abstract: A lamp stand with multi-stage light modulation includes plural resistors annularly arranged to form a circular space. The resistors have terminals soldered on the outer walls of U-shaped contact blades, with an empty position terminal provided in the circular space. A light-modulating controller extends in the lamp stand, having a rotor formed with plural slopes on an outer wall for rotor copper strips to rest thereon. A trigger diode is connected to the gate of a triac AC switch and a capacitor is connected to the trigger diode and the paralleled terminals of the resistors and to the main terminals of the triac AC switch. The light-modulating controller is rotated to let the rotor copper strips contact the contact strips of the resistors to turn on power and charge the capacitor. Different resistance values change the breakdown speed of the DIAC and control the gate of the TRIAC to change the voltage effective value of the lamp, thus reaching a goal of light modulating.

Abstract: A method is provided for mounting high-density wire bond semiconductor devices. A layer of dielectric is deposited over the first surface of a metal panel. One or more thin film interconnect layers are then created on top of the dielectric layer. The BUM technology allows for the creation of a succession of layers over the thin film layers. The combined layers of thin film and BUM form the interconnect substrate. One or more cavities are created in the second surface of the metal panel; openings through the layer of dielectric are created where the layer of dielectric is exposed. One or more wire bond semiconductor die are inserted into the cavities, are die bonded and wire bonded to the openings that have been created in the layer of dielectric. Openings are created in the bottom BUM layer; solder balls are inserted and attached to this BUM layer for the completion of the Ball Grid Array (BGA) package.

Abstract: A positioning device includes a surrounding wall integrally formed with a shell of a lighting unit. The surrounding wall includes a mounting wall area with left and right lateral edge portions which are in water-tight and detachable engagement with each other, and which include left and right abutment wall surfaces with cutout portions defining an inner surrounding clamping wall surface that confines an insert hole for receiving an insert member which wraps around a power supply cord. The insert member has a neck segment that is spaced apart from the clamping wall surface by a surrounding clearance which can accommodate thermal expansion of the mounting wall area and which can form a moisture barrier against intrusion of water vapor.

Abstract: A trace layout of a printed circuit board (PCB) is provided with a north bridge, at least a peripheral component interconnect (PCI) slot, and an accelerate graphics port (AGP) slot. The PCB includes at least a first trace layer and a second trace layer under the first trace layer. The AGP slot is mounted between the north bridge and the PCI slot. The PCB further includes a number of first traces, and a number of second traces. The first traces are used for connecting the north bridge to the PCI slot while the second traces are used to connect the north bridge to the AGP slot. Some of the first traces are on the second trace layer under the AGP slot, while the other of the first traces are on the first trace layer or the second trace layer and trace aside the AGP slot. Most of the second traces are on the first trace layer and the other of the second traces are on the second trace layer.

Abstract: A coupling device for interconnecting first and second slender members includes a positioning sleeve sleeved on one end of the first slender member and having a radial outward stop flange and a radial stop projection at opposite ends thereof. An externally threaded sleeve is sleeved and secured on one end of the second slender member, and has an externally threaded front-end portion. A nut member is sleeved on the positioning sleeve, and has a surrounding wall for engaging the externally threaded sleeve. A limiting member is sleeved between the nut member and the stop projection of the positioning sleeve, thereby arresting movement of the nut member from a fully tightened position.

Abstract: A system can produce a suitable voltage for powering the memory modules plugged into the memory module slots of a motherboard. A power-good signal is issued when the motherboard is powered up. A power safety device on the motherboard then issues a 2.5V to the memory module slot. If DDR DRAM type of memory modules are not detected after a while, the power safety device will turn off the 2.5V supply and provide a 3.3V, which is suitable for SDRAM type memory modules. This invention avoids sending a 3.3V to DDR DRAM modules, thereby burning the memory chip. The presence of DDR DRAM modules can be detected by a general-purpose input/output port through accessing the recorded data in the EEPROM of the memory module. Alternatively, memory module type can be determined by sending out a low-current pulse signal to the memory module slot. Hence, a suitable voltage source is automatically provided to power the memory modules in the slots.

Abstract: A new method is provided for mounting high-density wire bond semiconductor devices. A layer of dielectric is deposited over the first surface of a metal panel. One or more thin film interconnect layers are then created on top of the dielectric layer. The BUM technology allows for the creation of a succession of layers over the thin film layers. The combined layers of thin film and BUM form the interconnect substrate. One or more cavities are created in the second surface of the metal panel; openings through the layer of dielectric are created where the layer of dielectric is exposed. One or more wire bond semiconductor die are inserted into the cavities, are die bonded and wire bonded to the openings that have been created in the layer of dielectric. Openings are created in the bottom BUM layer; solder balls are inserted and attached to this BUM layer for the completion of the Ball Grid Array (BGA) package.

Abstract: A fuse coupler device includes one or two fuse couplers received in a housing and each having a socket formed on one end for engaging with a fuse member, a control ferrule includes an outer thread for threading with the fuse coupler, and a barrel is rotatably secured to the control ferrule. An electric wire has one end secured between the barrel and the fuse coupler by the control ferrule without additional fasteners and tools. The fuse member and the fuse coupler may be received in a housing, and a cap may be threaded to the housing for retaining the fuse member in the housing.