Abstract: A MEMS pump includes a first substrate, a first oxide layer, a second substrate, a second oxide layer, a third substrate and a piezoelectric element sequentially stacked to form the entire structure of the MEMS pump. The first substrate has a first thickness and at least one inlet aperture. The first oxide layer has at least one fluid inlet channel and a convergence chamber, wherein the fluid inlet channel communicates with the convergence chamber and the inlet aperture. The second substrate has a second thickness and a through hole, and the through hole is misaligned with the inlet aperture and communicates with the convergence chamber. The second oxide layer has a first chamber with a concave central portion. The third substrate has a third thickness and a plurality of gas flow channels, wherein the gas flow channels are misaligned with the through hole.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: The present disclosure provides a control method of a fluid device. The control method includes the steps of (a) providing the fluid device, which includes a plurality of flow guiding units manufactured by a micro-electro-mechanical-system process; (b) dividing the flow guiding units into a plurality of groups, which are electrically connected to and controlled by a control module; and (c) generating a driving signal by the control module for a corresponding one of the groups, wherein the control module generates a high level signal to a specific one of the groups, so that the flow guiding units of the specific one of the groups are driven to transport fluid, and thereby controlling the fluid device to discharge a specific amount of fluid.

Abstract: A micro-electromechanical fluid control device includes at least one flow guiding unit. The at least one flow guiding unit includes an inlet plate, a substrate, a resonance membrane, an actuating membrane and an outlet plate sequentially stacked. A first chamber is defined between the resonance membrane and the actuating membrane and a second chamber is defined between the actuating membrane and the outlet plate. While the piezoelectric membrane of the flow guiding unit drives the actuating membrane, a fluid is inhaled into the convergence chamber via the inlet of the inlet plate, transported into the first chamber via the central aperture of the resonance membrane, transported into the second chamber via a vacant space of the actuating membrane, and discharged out from the outlet of the outlet plate, so as to control the fluid to flow.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: An actuating and sensing module includes a substrate, at least one sensor and at least one actuating device. The at least one sensor is disposed on the substrate. The at least one actuating device is disposed on the substrate, and has at least one guiding channel between the actuating device and the substrate. The at least one guiding channel is disposed on one side of the at least one sensor. When the at least one actuating device is enabled, a fluid is transferred to the at least one sensor through the at least one guiding channel, so that the fluid is sensed by the at least one sensor.

Abstract: An actuating and sensing module includes a chip, at least one sensor and at least one actuating device. The at least one sensor is deposited on the chip. The at least one actuating device is packaged on the chip and has at least one guiding channel disposed on one side of the at least one sensor. When the at least one actuating device is enabled, a fluid is transferred to the at least one sensor through the at least one guiding channel, so that the fluid is sensed by the at least one sensor.

Abstract: An electronic cigarette includes a power supply device, an atomizer, a liquid storage structure, a fluid transportation device, a sensing unit, a casing and a mouthpiece. The atomizer includes an electric heater and a liquid conduit. The liquid storage structure includes a liquid container for storing a cigarette liquid. The fluid transportation device is in communication with the liquid container and the liquid conduit. The cigarette liquid is transferred to the liquid conduit through the fluid transportation device. The sensing unit includes an airflow sensor and an air pressure sensor for adjusting the speeds of atomizing the cigarette liquid and providing the cigarette liquid. After an airflow is fed into an entrance of the casing, the airflow passes through an airflow chamber and the sensing unit along an airflow path. The mouthpiece seals an end of the casing and in communication with the airflow path.

Abstract: An inkjet chip of printing module of a rapid prototyping apparatus and a control circuit thereof are disclosed. The inkjet chip has a length and a width to define a total area including an unwiring area and a wiring area. The unwiring area has at least three liquid supply slots in parallel with each other and respectively connected to one of the ink chambers of the modular ink cartridge. The wiring area has a control circuit. The control circuit includes a plurality of liquid ejectors. Each liquid ejector has a heating resistor, a driving transistor, and a nozzle. The control circuit is connected to receive a power signal, a printing data signal, a preheating data signal, a preheating control signal, a reverse preheating control signal, a heating control signal, and a reverse heating control signal and connected with the common connection node for controlling the liquid ejector.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: An inkjet chip of printing module of a rapid prototyping apparatus and a control circuit thereof are disclosed. The inkjet chip has a length and a width to define a total area including an unwiring area and a wiring area. The unwiring area has at least three liquid supply slots in parallel with each other and respectively connected to one of the ink chambers of the modular ink cartridge. The wiring area has a control circuit. The control circuit includes a plurality of liquid ejectors. Each liquid ejector has a heating resistor, a driving transistor, and a nozzle. The control circuit is connected to receive a power signal, a printing data signal, a preheating data signal, a preheating control signal, a reverse preheating control signal, a heating control signal, and a reverse heating control signal and connected with the common connection node for controlling the liquid ejector.

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.

Abstract: The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.