Abstract: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.

Abstract: An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire.

Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including one ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing one single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 82% of a total area of the inkjet chip.

Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.

Abstract: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.

Abstract: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.

Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.

Abstract: The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.

Abstract: The present invention relates to an ink-jet chip, adaptive for a printing device, at least comprising: a plurality of ink-jet heating elements and an ink-jet signal generating circuit. The ink-jet signal generating circuit at least includes: a counter electrically connected with the printing device, for receiving a counter control signal and a pulse signal, and generating a plurality of counter signals corresponding to the counter control signal and the pulse signal; and a decoder electrically connected with the counter, for receiving and decoding the plurality of counter signals, for generating a plurality of address signals, and selecting a corresponding ink-jet heating element basing on the plurality of address signals.

Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.

Abstract: An energy storage device and a method of manufacturing the same are disclosed. The energy storage device includes a circuit board, a conductive cover disposed above the circuit board, a sealing structure, a metal coating layer, and an electrochemical cell. The sealing structure is disposed between the circuit board and the circumference of the conductive cover such that the circuit board, the conductive cover, and the sealing structure together form a sealed space where the electrochemical cell is disposed. The metal coating layer continuously covers a part of the conductive cover, an exposed portion of the sealing structure, and a part of the circuit board. Therefore, even if the energy storage device needs to be heated during a product assembly, the metal coating layer can keep the sealing structure structurally stable, and the electrolyte of the electrochemical cell will not leak; the whole energy storage device therefore can keeps undamaged.

Abstract: The present invention related to an ink-jet head, adaptive for an ink cartridge including two ink tanks, the ink-jet head includes: a nozzle board, having a plurality of nozzles; and an ink-jet chip, being used for controlling the ink-jetting and having a total area region consisting of a length and a width, wherein the total area region includes: a non-wiring region, where two ink flow channels being installed therein; and a wiring region, where an internal circuit being installed therein; wherein the internal circuit includes a plurality of ink-jet unit sets, and every ink-jet units of the plurality of ink-jet unit sets include a heater installed correspondingly to the nozzle; wherein the area of the wiring region of the ink-jet chip is less than 77% of the area of the total area region of the ink-jet chip.

Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including three ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing three single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 77% of a total area of the inkjet chip.

Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including one ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing one single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 82% of a total area of the inkjet chip.

Abstract: The present invention related to an ink-jet head, adaptive for an ink cartridge including at least one ink tank, the ink jet head includes: a nozzle board, having a plurality of nozzles; and an ink-jet chip, being used for controlling the ink-jetting and having a total area region consisting of a length and a width, wherein the total area region includes: a non-wiring region, where at least one ink flow channel being installed therein; and a wiring region, where an internal circuit being installed therein; wherein the internal circuit includes a plurality of ink-jet unit sets, and every ink-jet units of the plurality of ink-jet unit sets include a heater installed correspondingly to the nozzle; wherein the area of the wiring region of the ink-jet chip is less than 77% of the area of the total area region of the ink-jet chip.

Abstract: A method for fabricating a ceramic device is provided. A green sheet is adhered on an adhesive film. A photoresist film is then formed on the green sheet. A photolithographic process is carried out to form circuit trenches in the photoresist film. The circuit trenches are filled with metal paste, thereby forming a circuit pattern. The photoresist film is then removed.

Abstract: A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.

Abstract: The present invention relates to an ink-jet chip, adaptive for a printing device, at least comprising: a plurality of ink-jet heating elements and an ink-jet signal generating circuit. The ink-jet signal generating circuit at least includes: a counter electrically connected with the printing device, for receiving a counter control signal and a pulse signal, and generating a plurality of counter signals corresponding to the counter control signal and the pulse signal; and a decoder electrically connected with the counter, for receiving and decoding the plurality of counter signals, for generating a plurality of address signals, and selecting a corresponding ink-jet heating element basing on the plurality of address signals.

Abstract: The present invention relates to a printing system, which comprises: a data receiving and processing unit connected with the electronic device, for receiving a printing signal from the electronic device and processing the printing signal into a data signal; and an ink-jet head module including a control chip and an ink-jet heating chip. The control chip includes a wireless transmission module and a control circuit, wherein the wireless transmission module includes an antenna, a front-end processing unit, an instruction unit, a clock transmission unit, and a modulation and demodulation unit. Besides, the control circuit includes a control processing unit, a coding and decoding processing unit, and a memory device, to receive the data signal processed by the wireless transmission module and transform the processed data signal into a control signal. In addition, the ink-jet heating chip is connected with the control circuit for executing the ink-jet printing.

Abstract: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.