Patents by Inventor Wen-Hsiung Liao

Wen-Hsiung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8820893
    Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including one ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing one single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 82% of a total area of the inkjet chip.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: September 2, 2014
    Assignee: Microjet Technology Co., Ltd.
    Inventors: Hao Jan Mou, Ta Wei Hsueh, Ying Lun Chang, Rong Ho Yu, Hsien Chung Tai, Cheng Ming Chang, Wen Hsiung Liao, Yung Lung Han
  • Patent number: 8771436
    Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: July 8, 2014
    Assignee: Cyntec Co., Ltd.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Publication number: 20130271251
    Abstract: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.
    Type: Application
    Filed: August 10, 2012
    Publication date: October 17, 2013
    Applicant: Cyntec Co., Ltd.
    Inventors: Shih-Hsien Tseng, Wen-Hsiung Liao, Joseph D.S. Deng, Ian-Chun Cheng
  • Publication number: 20130229251
    Abstract: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.
    Type: Application
    Filed: March 29, 2013
    Publication date: September 5, 2013
    Applicant: CYNTEC CO., LTD.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Patent number: 8518190
    Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: August 27, 2013
    Assignee: Cyntec Co., Ltd.
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Publication number: 20130146341
    Abstract: The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.
    Type: Application
    Filed: December 13, 2011
    Publication date: June 13, 2013
    Applicant: CYNTEC CO., LTD.
    Inventors: DA-JUNG CHEN, WEN-HSIUNG LIAO, CHUN-FU HU
  • Patent number: 8408680
    Abstract: The present invention relates to an ink-jet chip, adaptive for a printing device, at least comprising: a plurality of ink-jet heating elements and an ink-jet signal generating circuit. The ink-jet signal generating circuit at least includes: a counter electrically connected with the printing device, for receiving a counter control signal and a pulse signal, and generating a plurality of counter signals corresponding to the counter control signal and the pulse signal; and a decoder electrically connected with the counter, for receiving and decoding the plurality of counter signals, for generating a plurality of address signals, and selecting a corresponding ink-jet heating element basing on the plurality of address signals.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: April 2, 2013
    Assignee: Microjet Technology Co., Ltd.
    Inventors: Wen Hsiung Liao, Rong Ho Yu, Cheng Ming Chang, Hsien Chung Tai
  • Publication number: 20120299687
    Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
    Type: Application
    Filed: July 30, 2012
    Publication date: November 29, 2012
    Inventors: Wen-Hsiung Liao, Roger Hsieh, Hideo Ikuta, Yueh-Lang Chen
  • Publication number: 20120263978
    Abstract: An energy storage device and a method of manufacturing the same are disclosed. The energy storage device includes a circuit board, a conductive cover disposed above the circuit board, a sealing structure, a metal coating layer, and an electrochemical cell. The sealing structure is disposed between the circuit board and the circumference of the conductive cover such that the circuit board, the conductive cover, and the sealing structure together form a sealed space where the electrochemical cell is disposed. The metal coating layer continuously covers a part of the conductive cover, an exposed portion of the sealing structure, and a part of the circuit board. Therefore, even if the energy storage device needs to be heated during a product assembly, the metal coating layer can keep the sealing structure structurally stable, and the electrolyte of the electrochemical cell will not leak; the whole energy storage device therefore can keeps undamaged.
    Type: Application
    Filed: April 12, 2012
    Publication date: October 18, 2012
    Inventors: Chung-Hsiung Wang, Chi-Feng Lin, Han-Yang Chung, Wen-Hsiung Liao
  • Publication number: 20120242752
    Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including one ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing one single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 82% of a total area of the inkjet chip.
    Type: Application
    Filed: December 29, 2011
    Publication date: September 27, 2012
    Inventors: Hao Jan MOU, Ta Wei Hsueh, Ying Lun Chang, Rong Ho Yu, Hsien Chung Tai, Cheng Ming Chang, Wen Hsiung Liao, Yung Lung Han
  • Publication number: 20120242726
    Abstract: The present invention related to an ink-jet head, adaptive for an ink cartridge including at least one ink tank, the ink jet head includes: a nozzle board, having a plurality of nozzles; and an ink-jet chip, being used for controlling the ink-jetting and having a total area region consisting of a length and a width, wherein the total area region includes: a non-wiring region, where at least one ink flow channel being installed therein; and a wiring region, where an internal circuit being installed therein; wherein the internal circuit includes a plurality of ink-jet unit sets, and every ink-jet units of the plurality of ink-jet unit sets include a heater installed correspondingly to the nozzle; wherein the area of the wiring region of the ink-jet chip is less than 77% of the area of the total area region of the ink-jet chip.
    Type: Application
    Filed: December 5, 2011
    Publication date: September 27, 2012
    Inventors: Hao Jan Mou, Ta Wei Hsueh, Ying Lun Chang, Rong Ho Yu, Hsien Chung Tai, Cheng Ming Chang, Wen Hsiung Liao, Yung Lung Han
  • Publication number: 20120242746
    Abstract: The present invention related to an inkjet printhead, adaptive for an ink cartridge including three ink-supplying tank, the inkjet printhead includes: a nozzle plate having a plurality of nozzles; and an inkjet chip for controlling ink jetting and having a total area region having a length and a width, the total area region including: a non-wiring region for installing three single ink-supplying flow channels; and a wiring region for installing an internal circuit including a plurality inkjet unit assembly, each inkjet unit of the inkjet unit assembly including a heater installed correspondingly to the nozzle; wherein an area of the wiring region of the inkjet chip is or less than 77% of a total area of the inkjet chip.
    Type: Application
    Filed: December 22, 2011
    Publication date: September 27, 2012
    Inventors: Hao Jan MOU, Ta Wei HSUEH, Ying Lun CHANG, Rong Ho YU, Hsien Chung TAI, Cheng Ming CHANG, Wen Hsiung LIAO, Yung Lung HAN
  • Publication number: 20120242763
    Abstract: The present invention related to an ink-jet head, adaptive for an ink cartridge including two ink tanks, the ink-jet head includes: a nozzle board, having a plurality of nozzles; and an ink-jet chip, being used for controlling the ink-jetting and having a total area region consisting of a length and a width, wherein the total area region includes: a non-wiring region, where two ink flow channels being installed therein; and a wiring region, where an internal circuit being installed therein; wherein the internal circuit includes a plurality of ink-jet unit sets, and every ink-jet units of the plurality of ink-jet unit sets include a heater installed correspondingly to the nozzle; wherein the area of the wiring region of the ink-jet chip is less than 77% of the area of the total area region of the ink-jet chip.
    Type: Application
    Filed: December 5, 2011
    Publication date: September 27, 2012
    Inventors: Hao Jan MOU, Ta Wei Hsueh, Ying Lun Chang, Rong Ho Yu, Hsien Chung Tai, Cheng Ming Chang, Wen Hsiung Liao, Yung Lung Han
  • Publication number: 20120231154
    Abstract: A method for fabricating a ceramic device is provided. A green sheet is adhered on an adhesive film. A photoresist film is then formed on the green sheet. A photolithographic process is carried out to form circuit trenches in the photoresist film. The circuit trenches are filled with metal paste, thereby forming a circuit pattern. The photoresist film is then removed.
    Type: Application
    Filed: January 19, 2012
    Publication date: September 13, 2012
    Inventors: Wen-Hsiung Liao, Wen-Yu Lin, Wei-Chien Chang
  • Patent number: 8183976
    Abstract: A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: May 22, 2012
    Assignee: Cyntec Co., Ltd.
    Inventors: Ta-Wen Lo, Wen-Hsiung Liao, Wu-Liang Chu, Yen-Ting Lin
  • Publication number: 20120081420
    Abstract: The present invention relates to a printing system, which comprises: a data receiving and processing unit connected with the electronic device, for receiving a printing signal from the electronic device and processing the printing signal into a data signal; and an ink-jet head module including a control chip and an ink-jet heating chip. The control chip includes a wireless transmission module and a control circuit, wherein the wireless transmission module includes an antenna, a front-end processing unit, an instruction unit, a clock transmission unit, and a modulation and demodulation unit. Besides, the control circuit includes a control processing unit, a coding and decoding processing unit, and a memory device, to receive the data signal processed by the wireless transmission module and transform the processed data signal into a control signal. In addition, the ink-jet heating chip is connected with the control circuit for executing the ink-jet printing.
    Type: Application
    Filed: September 7, 2011
    Publication date: April 5, 2012
    Inventors: Rong Ho YU, Wen Hsiung Liao, Hsien Chung Tai, Cheng Ming Chang
  • Publication number: 20120081471
    Abstract: The present invention relates to an ink-jet chip, adaptive for a printing device, at least comprising: a plurality of ink-jet heating elements and an ink-jet signal generating circuit. The ink-jet signal generating circuit at least includes: a counter electrically connected with the printing device, for receiving a counter control signal and a pulse signal, and generating a plurality of counter signals corresponding to the counter control signal and the pulse signal; and a decoder electrically connected with the counter, for receiving and decoding the plurality of counter signals, for generating a plurality of address signals, and selecting a corresponding ink-jet heating element basing on the plurality of address signals.
    Type: Application
    Filed: September 7, 2011
    Publication date: April 5, 2012
    Inventors: Wen Hsiung LIAO, Rong Ho YU, Cheng Ming CHANG, Hsien Chung TAI
  • Patent number: 8018318
    Abstract: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: September 13, 2011
    Assignee: Cyntec Co., Ltd.
    Inventors: Chung-Hsiung Wang, Hideo Ikuta, Wu-Liang Chu, Yen-Ting Lin, Chih Sheng Kuo, Wen-Hsiung Liao
  • Patent number: 7915993
    Abstract: An inductor includes a first core, a second core, a protruding structure, at least two gaps and a conducting wire. The first core has a protruding portion. The second core is disposed opposite to the first core. The protruding structure protrudes from the protruding portion of the first core and toward the second core. The at least two gaps are between the protruding portion of the first core and the second core. The conducting wire winds around at least one of the first and second cores. The conducting wire has a specific resistance value of 1.42 ??m or lower.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: March 29, 2011
    Assignee: Cyntec Co., Ltd.
    Inventors: Chun-Tiao Liu, Gwo-Tswin Wu, Roger Hsieh, Wen-Hsiung Liao
  • Publication number: 20110063072
    Abstract: A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.
    Type: Application
    Filed: May 13, 2010
    Publication date: March 17, 2011
    Applicant: CYNTEC CO., LTD.
    Inventors: Dar-Win Lo, Wen-Hsiung Liao, Wu-Liang Chu, Yen-Ting Lin