Patents by Inventor Wen Huang

Wen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120128060
    Abstract: An apparatus and method for deriving a motion vector predictor or a motion vector predictor candidate or a motion vector or a motion vector candidate for a current block are disclosed. In video coding systems, the spatial and temporal redundancy is exploited using spatial and temporal prediction to reduce the information to be transmitted or stored. Motion Vector Prediction (MVP) has been used to further conserve the bitrate associated with motion vector coding. The MVP technique being developed for the current HEVC only considers the motion vector having the same reference list and the same reference picture index as the current block to be an available spatial motion vector predictor candidate. It is desirable to develop a MVP scheme that can improve the availability of the motion vector predictor candidate based on motion vectors from the spatially neighboring block.
    Type: Application
    Filed: March 14, 2011
    Publication date: May 24, 2012
    Applicant: MEDIATEK INC.
    Inventors: Jian-Liang Lin, Yu-Pao Tsai, Yu-Wen Huang, Shaw-Min Lei
  • Publication number: 20120126262
    Abstract: The present disclosure relates to methods for fabricating LEDs by patterning and etching an n-doped epitaxial layer to form regions of roughened surface of the n-doped layer and mesa structures adjacent to the roughened surface regions before depositing an active layer and the rest of the epitaxial layers on the mesa structures. The method includes growing epitaxial layers of an LED including an un-doped layer and an n-doped layer on a wafer of growth substrate. The method also includes patterning the n-doped layer to form a first region of the n-doped layer and a mesa region of the n-doped layer adjacent to the first region. The method further includes etching the first region of the n-doped layer to create a roughened surface. The method further includes growing additional epitaxial layers of the LED including an active layer and a p-doped layer on the mesa region of the n-doped layer.
    Type: Application
    Filed: November 18, 2010
    Publication date: May 24, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Wen Huang, Hsing-Kuo Hsia, Ching-Hua Chiu
  • Publication number: 20120128067
    Abstract: An apparatus and method for video coding and decoding with constrained PU partition are disclosed. In the High Efficient Video Coding (HEVC) system, rate-distortion function or other performance criterion usually is evaluated for various CU partition and PU partition during the encoding process in order to select a configuration with best possible performance. The PU design in the current HEVC development results in some redundancy that causes rate-distortion function or other performance criterion repeatedly evaluated for same PU configuration. Accordingly, constrained PU partition is developed to eliminate or reduce the redundancy in processing. Furthermore, necessary syntax to convey the information related to constrained PU partition between an encoder and a decoder is developed.
    Type: Application
    Filed: January 25, 2011
    Publication date: May 24, 2012
    Applicant: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Shan Liu, Yu-Wen Huang, Yung-Chang Chang, Shaw-Min Lei
  • Publication number: 20120129282
    Abstract: Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a wafer. The wafer has light-emitting diode (LED) devices formed thereon. The method includes immersing the wafer into a polymer solution that has a surface tension lower than that of acetic acid. The polymer solution contains a liquid polymer and phosphor particles. The method includes lifting the wafer out of the polymer solution at a substantially constant speed. The method includes drying the wafer. The above processes form a conformal coating layer at least partially around the LED devices. The coating layer includes the phosphor particles. The coating layer also has a substantially uniform thickness.
    Type: Application
    Filed: November 22, 2010
    Publication date: May 24, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsing-Kuo Hsia, Chih-Kuang Yu, Hung-Yi Kuo, Hung-Wen Huang
  • Patent number: 8184199
    Abstract: The invention provides an image processing apparatus for processing an interlaced video which includes a judging module, a determining module and a processing module. The judging module is used for judging if a pixel in the kth frame among P frames of the interlaced video relates to a moving object. If the result judged by the determining module is YES, the determining module determines one between two pixels adjacent to the judged pixel in the frame as an edge pixel relative to an edge of the moving object. The first processing module is used for calculating a gray scale of the edge pixel determined by the determining module in an average way.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: May 22, 2012
    Assignee: Quanta Computer Inc.
    Inventors: Yi-Ming Huang, Tung-Lin Hsieh, Yu-Wen Huang, Hsin-Hung Lee, Chin-Kang Chang
  • Publication number: 20120119184
    Abstract: A vertical light emitting diode (VLED) die includes a p-type confinement layer, an active layer on the p-type confinement layer configured to emit light, and an n-type confinement structure having at least one etch stop layer configured to protect the active layer. A method for fabricating a vertical light emitting diode (VLED) die includes the steps of: providing a carrier substrate; forming an n-type confinement structure on the carrier substrate having at least one etch stop layer; forming an active layer on the n-type confinement structure; forming a p-type confinement layer on the active layer; and removing the carrier substrate.
    Type: Application
    Filed: November 12, 2010
    Publication date: May 17, 2012
    Inventors: Kung-Hsieh Hsu, Yao-Kuo Wang, Wen-Huang Liu, Chuong Anh Tran
  • Publication number: 20120114034
    Abstract: In the current high efficiency video coding development, each LCU has its own quantization parameter (QP) and the difference between a current QP and a reference QP is transmitted instead of the QP value itself. Since the LCU is much larger than the macroblock of AVC/H.264, using one delta QP per LCU may cause rate control unable to adapt to the bitrate quickly enough. Consequently there is a need to adopt delta QP in units smaller than LCU to provide more granular rate control. Furthermore, it is desirable to develop a system that is capable of facilitating more flexible delta QP. Accordingly, adaptive quantization parameter processing is disclosed where a QP minimum CU size for incorporating or deriving a delta QP is indicated selectively in the slice level or in the sequence/picture level. In one variation, the delta QP is incorporated or derived only if nonzero quantized transform coefficients exist in a leaf CU that is larger than the QP minimum CU size.
    Type: Application
    Filed: February 1, 2011
    Publication date: May 10, 2012
    Applicant: MEDIATEK INC.
    Inventors: Yu-Wen Huang, Ching-Yeh Chen, Chih-Ming Fu, Chih-Wei Hsu, Yu-Lin Chang, Tzu-Der Chuang, Shaw-Min Lei
  • Publication number: 20120106622
    Abstract: In the H.264/AVC standard, one of the new characteristics is the possibility of dividing an image in regions called slice groups. The use of slice groups provides various possible advantages such as prioritized transmission, error resilient transmission, and etc. The slice groups can be formed by flexible macroblock ordering (FMO), where each picture can be divided into slice groups in different scan patterns of the macroblocks. In the high efficiency video coding (HEVC) under development, a more flexible block structure, called coding unit (CU), is used as the unit to process video data. The picture is first divided into largest CUs (LCUs) and each LCU is adaptively split into smaller CUs using a quadtree until leaf CUs are reached. In the current HEVC development, there is neither slice nor slice group structure being considered. The LCU size used for HEVC is 16 times as large as the macroblock size used in the H.264/AVC standard.
    Type: Application
    Filed: January 5, 2011
    Publication date: May 3, 2012
    Applicant: MEDIATEK INC.
    Inventors: Yu-Wen Huang, Ching-Yeh Chen, Chih-Ming Fu, Chih-Wei Hsu, Shaw-Min Lei
  • Publication number: 20120104409
    Abstract: A seed layer for growing a group III-V semiconductor structure is embedded in a dielectric material on a carrier substrate. After the group III-V semiconductor structure is grown, the dielectric material is removed by wet etch to detach the carrier substrate. The group III-V semiconductor structure includes a thick gallium nitride layer of at least 100 microns or a light-emitting structure.
    Type: Application
    Filed: September 8, 2011
    Publication date: May 3, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jung-Tang CHU, Ching-Hua CHIU, Hung-Wen HUANG, Yea-Chen LEE, Hsing-Kuo HSIA
  • Publication number: 20120106652
    Abstract: An apparatus and method for video coding based on flexible slice structure are disclosed. In the recent high efficiency video coding (HEVC) development, the slice may contain multiple LCUs instead of macroblocks. The LCU size being considered is 64×64 pixels which is much larger than the macroblock size of 16×16 pixels. Compared with the macroblock aligned slice for H.264, the LCU-aligned slice for HEVC does not provide enough granularities for dividing video frames. Consequently, a flexible slice structure is developed where slice partition is based on smaller coding units. In the flexible slice structure, the first LCU and the last LCU of the slice are allowed to be a fractional LCU, which is derived from a whole LCU using quadtree partition. Syntax elements are also developed to enable conveyance of flexible slice structure between an encoder and a decoder efficiently.
    Type: Application
    Filed: December 13, 2010
    Publication date: May 3, 2012
    Applicant: MEDIATEK INC.
    Inventors: Yu-Wen Huang, Chih-Ming Fu, Ching-Yeh Chen, Chih-Wei Hsu, Shaw-Min Lei
  • Publication number: 20120106624
    Abstract: An apparatus and method for video coding having intra-slice deblocking, intra-slice adaptive loop filter, and intra-slice adaptive offset are disclosed. In a video coding system, a picture is often divided into slices and each slice is independently processed so that errors or missing data from one slice cannot propagate to any other slice within the picture. In the recent high efficiency video coding (HEVC) development, deblock filtering (DF), adaptive loop filter (ALF) and adaptive offset (AO) may be applied to reconstructed slices. When the processing is applied across slice boundaries, it may rely on pixels outside the current slice and cause dependency of the current slice on other slice(s). Consequently, the DF/ALF/AO processing on a reconstructed slice may have to wait until the reconstructed slices that it is dependent from complete the DF/ALF/AO processing. To overcome the slice boundary issue, intra-slice DF/ALF/AO is developed that does not rely on any pixel outside the currently slice.
    Type: Application
    Filed: December 24, 2010
    Publication date: May 3, 2012
    Applicant: MEDIATEK INC.
    Inventors: Yu-Wen Huang, Chih-Ming Fu, Ching-Yeh Chen, Chih-Wei Hsu, Shan Liu, Shaw-Min Lei
  • Publication number: 20120097985
    Abstract: A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die.
    Type: Application
    Filed: October 21, 2010
    Publication date: April 26, 2012
    Inventors: Wen-Huang Liu, Chung-Che Dan, Yuan-Hsiao Chang, Hung-Jen Kao, Chen-Fu Chu, Hao-Chun Cheng
  • Publication number: 20120096992
    Abstract: A socket for driving a fastener, which head are or have become damaged to enable a wrenching tool to drive, includes a hole defining an inner peripheral edge. The inner peripheral edge defines a plurality of engaging sides and slots. Each engaging side includes first, second, and third sections, and the first section extends from one slot and approaches to a center of the hole, and the second section extends from the first section and away from the center of the hole, and the third section extends from the second section and towards and connects to another slot.
    Type: Application
    Filed: October 26, 2010
    Publication date: April 26, 2012
    Inventor: Ping-Wen Huang
  • Publication number: 20120091466
    Abstract: A light emitting diode (LED) system includes a substrate, an application specific integrated circuit (ASIC), and at least one light emitting diode (LED) that includes a Group-III nitride based material such as GaN, InGaN, AlGaN, AlInGaN or other (Ga, In or Al) N-based materials. The light emitting diode (LED) system can also include a polymer lens, and a phosphor layer on the lens or light emitting diode (LED) for producing white light. In addition, multiple light emitting diodes (LEDs) can be mounted on the substrate, and can have different colors for smart color control lighting. The substrate and the application specific integrated circuit (ASIC) are configured to provide an integrated LED circuit having smart functionality. In addition, the substrate is configured to compliment and expand the functions of the application specific integrated circuit (ASIC), and can also include built in integrated circuits for performing additional electrical functions.
    Type: Application
    Filed: December 2, 2011
    Publication date: April 19, 2012
    Applicant: SemiLEDS Optoelectronics Co.
    Inventors: Trung Tri Doan, Tien Wei Tan, Wen-Huang Liu, Chen-Fu Chu, Yung Wei Chen
  • Patent number: 8158893
    Abstract: An EMI/ESD protection module is disposed between a first metal connecting member and a second metal connecting member. The EMI/ESD protection module includes a first conductive member, a second conductive member and a resilient member. The first conductive member is electrically connected to the first metal connecting member. The second conductive member is movably connected to the first conductive member and electrically connected to the second metal connecting member. The resilient member is disposed between the first and second conductive members.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: April 17, 2012
    Assignee: Transcend Information, Inc.
    Inventors: Chung-Won Shu, Chih-Heng Chiu, Din-Ji Tzou, Chung-Wen Huang
  • Patent number: 8154044
    Abstract: A light emitting diode and method for fabricating the same are provided. The light emitting diode comprises a lead frame. A first material body is formed on the lead frame, wherein the first material body comprises a tip, an inner surface and an outer surface. A second material body is formed on the lead frame to completely cover the outer surface of the first material body. Particularly, the first material body comprises hydrophilic polymer and the second material body comprises hydrophobic polymer.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: April 10, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventor: Wen Huang Wang
  • Patent number: 8155455
    Abstract: An image capturing system comprises a storage device and a transcoder module coupled to the storage device. The storage device stores image data of a captured still image compressed by a first coding format configured. The transcoder module transcodes the image data compressed by the first coding format into output image data compressed by a second coding format and outputting the output image data to an external device when the external device requests the captured still image.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: April 10, 2012
    Assignee: Mediatek Inc.
    Inventors: Yu-Wen Huang, Chih-Hui Kuo
  • Publication number: 20120082244
    Abstract: In a block-based motion compensated system, coding noises may arise due to lossy operations. Adaptive loop filter (ALF) is a technique used to improve the quality. A pixel adaptive (PA) ALF method was developed that uses the Sum-modified Laplacian Measure (SLM) to classify pixels and applies a respective ALF filter to each pixel according to the SLM. While the PA ALF achieves better performance over a conventional single filter (SF) based ALF, the PA ALF causes higher complexity and consumes more power due to the high complexity and per-pixel filter switching. Accordingly region based ALF scheme is disclosed which allows adaptive filter selection on a region by region basis and does not require per-pixel filter switching. In one embodiment according to the present invention, a picture is divided into M×N regions. The region based ALF also allows region merging for the M×N regions to improve performance.
    Type: Application
    Filed: July 6, 2011
    Publication date: April 5, 2012
    Applicant: MEDIATEK INC.
    Inventors: Ching-Yeh Chen, Chih-Ming Fu, Chia-Yang Tsai, Yu-Wen Huang, Shaw-Min Lei
  • Publication number: 20120082241
    Abstract: A method and apparatus for processing in-loop reconstructed video using an in-loop filter is disclosed. In the recent HEVC development, adaptive loop filtering (ALF) is being adopted to process in-loop reconstruction video data, where ALF can be selectively turned ON or OFF for each block in a frame or a slice. An advanced ALF is disclosed later that allows a choice of multiple filter sets that can be applied to the reconstructed video data adaptively. In the present disclosure, pixels of the in-loop reconstructed video data are divided into a plurality of to-be-filtered regions, and an in-loop filter from a filter set is determined for each to-be-filtered region based on a rate-distortion optimization procedure. According to one embodiment of the present invention, computation of cost function associated with the rate-distortion optimization procedure is related to correlation values associated with original video data and the in-loop reconstructed video data.
    Type: Application
    Filed: August 24, 2011
    Publication date: April 5, 2012
    Applicant: MEDIATEK INC.
    Inventors: Chia-Yang Tsai, Chih-Ming Fu, Ching-Yeh Chen, Yu-Wen Huang, Shaw-Min Lei
  • Patent number: 8148733
    Abstract: Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: April 3, 2012
    Assignee: Semileds Optoelectronics Co., Ltd.
    Inventors: Wen-Huang Liu, Chen-Fu Chu, Jiunn-Yi Chu, Chao-Chen Cheng, Hao-Chun Cheng, Feng-Hsu Fan, Yuan-Hsiao Chang