Patents by Inventor Wen-Ji Lan

Wen-Ji Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10431524
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: October 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Publication number: 20190212067
    Abstract: A multi-outlet-inlet laminated liquid-cooling heat dissipation structure includes a top plate, a bottom plate mated with the top plate, a substrate disposed between the top plate and the bottom plate and multiple communication passages. The substrate has an upper face, a lower face and at least one communication unit. The top plate and the upper face together define an upper liquid chamber. The bottom plate and the lower face together define a lower liquid chamber. The at least one communication unit passes through the substrate between the upper and lower faces to communicate with the upper and lower liquid chambers for a working fluid to flow through. Each communication passage has a communication opening in communication with the upper and lower liquid chambers as an inlet or an outlet of the working fluid.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190214329
    Abstract: A liquid heat dissipation system includes: a first thermal module having a first inlet, a first outlet and a first module liquid-containing space for a working fluid to flow, the first inlet and the first outlet communicating with the first module liquid-containing space, whereby the working fluid flows through the first inlet into the first module liquid-containing space; and a second thermal module having a second inlet, a second outlet and a second module liquid-containing space for the working fluid to flow. The second inlet and the second outlet communicate with the second module liquid-containing space, whereby the working fluid flows through the second inlet into the second module liquid-containing space. The first outlet is mated with the second inlet. The first inlet is connected to a heat-exchange module. The second outlet is connected to a pump. The heat-exchange module and the pump are connected to each other.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190212077
    Abstract: A water-cooling radiator structure with internal partition member includes a water-cooling radiator unit, which includes a first water-receiving plate defining a first inner space and having a water inlet and a water outlet fluid-communicable with the first inner space. A working fluid flows into the first inner space via the water inlet and leaves the first inner space via the water outlet. The first inner space is internally provided with at least one first partition member, which horizontally divides the first inner space into a plurality of independent water chambers, so that the working fluid sequentially flow through the water chambers.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190212076
    Abstract: A multi-outlet-inlet liquid-cooling heat dissipation structure includes a liquid-containing plate body assembly. The liquid-containing plate body assembly has an upper liquid-containing plate body having an upper liquid chamber, a lower liquid-containing plate body having a lower liquid chamber, a first communication tube communicating with the upper and lower liquid chambers for a working fluid to flow between the upper and lower liquid chambers and multiple communication passages. Each communication passage has a communication opening respectively in communication with the upper and lower liquid chambers as an inlet or an outlet of the working fluid.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190212066
    Abstract: A water-cooling radiator assembly with internal horizontal partition members and fluid disturbing members includes a liquid-receiving plate unit consisting of a first liquid-receiving plate having a first partition member provided therein to divide an inner space thereof into a first and a second liquid chamber communicable with at least one liquid inlet, and a second liquid-receiving plate having a second partition member provided therein to divide an inner space thereof into a fourth liquid chamber and a third liquid chamber communicable with at least one liquid outlet; a first flow disturbing member selectively arranged in any one of the first, second, third and fourth liquid chambers; and a communicating pipe unit including a first, a second and a third communicating pipe to communicate the second with the fourth liquid chamber, the fourth with the first liquid chamber, and the first with the third liquid chamber, respectively.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190215986
    Abstract: A water-cooling radiator assembly includes a liquid-receiving plate unit and a first flow-disturbing unit. The liquid-receiving plate unit includes a first and a second liquid-receiving plate. The first liquid-receiving plate internally defines a first liquid chamber and has at least one liquid inlet provided thereon to communicate with the first liquid chamber, and a working liquid flows into the first liquid chamber via the at least one liquid inlet. The second liquid-receiving plate internally defines a second liquid chamber and has at least one liquid outlet provided thereon to communicate with the second liquid chamber. At least one communicating pipe is communicably connected to between the first and the second liquid chamber; and the first flow-disturbing unit is selectively arranged in one of the first and the second liquid chamber.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190215987
    Abstract: A water-cooling radiator structure includes a water-cooling radiator unit, which includes a water-receiving plate internally defining a water chamber for a working fluid to flow therethrough. The water-receiving plate has an upper surface and a lower surface, from where heat carried by the working fluid flowing through the water chamber is dissipated into ambient air.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Patent number: 10123459
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second slope. The second radiating fin assembly is assembled with the first radiating fin assembly. At least one notch is formed on one side of the second radiating fin assembly corresponding to the protrusion section. The notch is formed with a third slope and a fourth slope. The third slope is in contact with the first slope. A gap is defined between the fourth and second slopes. An open space is defined between the first and second radiating fin assemblies in communication with the gap.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: November 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Patent number: 10119766
    Abstract: A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: November 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Yu-Min Lin, Wen-Ji Lan
  • Patent number: 10107557
    Abstract: An integrated heat dissipation device includes at least one first case, a second case and multiple third cases. The first and second cases respectively have a first case chamber and a second case chamber. Each third case has a third case chamber. Each third case is connected to the second case via a first heat pipe. The first case is connected to the corresponding third case via a second heat pipe passing through the second case. Accordingly, the working fluid in the third case chambers can flow through the respectively connected first and second heat pipes to the first and second case chambers to achieve the vapor-liquid circulation effect and dissipate the heat.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 23, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10107559
    Abstract: A heat dissipation component includes: a first main body having a first chamber; a second main body having a second chamber; a third main body having a third chamber; a first tubular body having a first flow way, two ends of the first tubular body being respectively connected with the first and second main bodies; and a second tubular body having a second flow way. The second tubular body is passed through the second main body and the first flow way. Two ends of the second tubular body are respectively connected with the first and third main bodies. A working fluid is filled in the first, second and third chambers.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 23, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Patent number: 10104807
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: October 16, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10077945
    Abstract: A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: September 18, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Publication number: 20180242475
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.
    Type: Application
    Filed: February 20, 2017
    Publication date: August 23, 2018
    Inventor: Wen-Ji Lan
  • Publication number: 20180242476
    Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second slope. The second radiating fin assembly is assembled with the first radiating fin assembly. At least one notch is formed on one side of the second radiating fin assembly corresponding to the protrusion section. The notch is formed with a third slope and a fourth slope. The third slope is in contact with the first slope. A gap is defined between the fourth and second slopes. An open space is defined between the first and second radiating fin assemblies in communication with the gap.
    Type: Application
    Filed: February 20, 2017
    Publication date: August 23, 2018
    Inventor: Wen-Ji Lan
  • Patent number: 10048017
    Abstract: A heat dissipation unit is provided and includes a casing and a heat pipe. The casing has a casing chamber which contains therein a working fluid. Casing capillaries are disposed on an inner wall of the casing chamber. The heat pipe has an open end and a closed end. A heat pipe chamber is defined between the open end and the closed end and communicates with the casing chamber through the open end. Heat pipe capillaries are disposed on an inner wall of the heat pipe chamber and are in capillary connection with the casing capillaries through the open end of the heat pipe.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: August 14, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10036596
    Abstract: A combination structure of heat dissipation module includes a heat dissipation set and at least one heat pipe, which is extended through the heat dissipation set. The heat dissipation set includes a first, a second, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe. The second and the third portion of the heat dissipation set are respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the third portion internally defines a receiving opening communicable with the third slots, so as to effectively remove heat through using the curved section of the heat pipe.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: July 31, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 9909815
    Abstract: An assembling structure of heat dissipation device includes at least one heat pipe, a first and a second radiating fin assembly. The heat pipe has a heat absorption section, at least one heat releasing section and a curved section between the heat absorption section and the heat releasing section. The heat releasing section is fitted in multiple perforations of the second radiating fin assembly. The curved section is fitted in multiple notches of the first radiating fin assembly. Each notch is defined with an open side and a closed side. The closed side extends along a curved outer side of the curved section and contacts and attaches to the curved outer side of the curved section. Accordingly, the utility ratio of the heat pipe is increased. Also, the heat dissipation area of the heat pipe is increased and the heat dissipation efficiency of the heat dissipation device is enhanced.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: March 6, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Patent number: 9897393
    Abstract: The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: February 20, 2018
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan