Patents by Inventor Wen-Ji Lan
Wen-Ji Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240402768Abstract: A method of mounting a heat dissipation device to a bare die heat source using fixing elements is disclosed. The fixing elements respectively include a screw, which has a spring fitted thereon and is disposed in a sleeve. Limiting units are provided on the sleeve for holding the spring in the sleeve in a compressed state. To mount the heat dissipation device to the bare die heat source, first use the fixing elements to preliminarily screw the heat dissipation device to a top of the heat source. Then, the springs compressed in the sleeves of all the fixing elements are elastically released synchronously to apply evenly distributed downward forces that push the heat dissipation device toward the bare die heat source stably.Type: ApplicationFiled: May 29, 2023Publication date: December 5, 2024Inventor: Wen-Ji Lan
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Publication number: 20240402767Abstract: A reworkable fixing element includes a screw having a spring fitted thereon, a screw head with two opposite cuts, and a retaining ring for stopping the screw from axially moving down any further; a sleeve disposed outside the screw and the spring, and including two opposite windows near an upper end thereof and a coupling zone located below the windows; a spring retaining ring fitted around the coupling zone and including two upward hooked arms extended through the windows to press the spring to a compressed state. The used fixing element has an elastically released spring but is reworkable using a reworking tool, which pushes the spring into the sleeve via the two cuts. Then, the hooked arms are allowed to extend through the windows to press on and hold the spring in the compressed state again, and the fixing element is ready for use a second time.Type: ApplicationFiled: May 29, 2023Publication date: December 5, 2024Inventor: Wen-Ji Lan
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Publication number: 20240401632Abstract: A heat dissipation unit includes a heat sink having a heat receiving zone and a screw fixing structure extended through each of four holes on the heat sink outside the heat receiving zone. The screw fixing structure includes a locating screw having a shank and a spring fitted around the shank; a hollow sleeve located outside the shank and the spring; and a spring stopper including two parallel elastic arms connected at one end and elastically disposed in the hollow sleeve to hold the spring in a compressed state. The spring stopper may be pushed downward to laterally push the two elastic arms open to move away from the spring, allowing the spring to release its elastic force upwardly. The four locating screws can synchronously and evenly apply their elastic force to the through holes outside the heat receiving zone, preventing the heat sink from damaging a contacted heat source.Type: ApplicationFiled: May 29, 2023Publication date: December 5, 2024Inventor: Wen-Ji Lan
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Publication number: 20240402769Abstract: A heat dissipation unit is connected to a bare die heat source by extending connecting elements through four predetermined corners on the heat dissipation unit. The connecting elements respectively include a screw having a spring fitted therearound; a sleeve defining a receiving space for receiving the screw and the spring therein, and having a window formed near an upper end thereof to radially communicate with the receiving space; and a turnable retaining ring fitted around the upper end of the sleeve and including a tongue curled toward a center of the turnable retaining ring and being extendable through the window into the receiving space to compress the spring. When all the turnable retaining rings are turned, the tongues can be moved away from the springs, allowing the springs to release their elastic force synchronously and push the heat dissipation unit toward the bare die heat source evenly for heat exchange.Type: ApplicationFiled: May 29, 2023Publication date: December 5, 2024Inventor: Wen-Ji Lan
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Publication number: 20240401633Abstract: A heat dissipation unit includes a main body and a plurality of fixing elements. The main body has a heat receiving zone and a plurality of through holes formed at four corners outside the heat receiving zone. The fixing elements are mounted in the through holes and respectively include a screw having a spring fitted thereon; a sleeve disposed outside the screw and the spring and having a pair of windows formed near an upper end; and a spring retaining ring fitted around the sleeve and having a pair of upward extended hooked arms extended through the windows to compress the spring in the sleeve. When the fixing elements have been assembled to the main body, the springs can be released at the same time and can therefore apply even downward forces synchronously for the main body to closely and evenly contact with a bare die heat source.Type: ApplicationFiled: May 29, 2023Publication date: December 5, 2024Inventor: Wen-Ji Lan
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Publication number: 20240402766Abstract: Fixing units for connecting a heat dissipation device to a heat source are pre-mounted to four points on the former and respectively include a spring loaded screw having a spring fitted thereon and stopped by a retaining ring from moving down out of the spring loaded screw; a screw sleeve having the spring loaded screw received therein and being provided at an upper open end with two diametrically opposite notches; and a spring retainer fitted around the upper open end of the screw sleeve and having a pair of upward retaining plates, which are extended through the notches to abut on and compress the spring. To connect the heat dissipation device to the heat source, simply apply an external force or use a tool to release the retaining plates from the springs, and the released springs synchronously provide even forces to push the heat dissipation device against the heat source.Type: ApplicationFiled: May 29, 2023Publication date: December 5, 2024Inventor: Wen-Ji Lan
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Publication number: 20230013442Abstract: A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the above arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.Type: ApplicationFiled: July 16, 2021Publication date: January 19, 2023Inventor: Wen-Ji Lan
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Patent number: 11137175Abstract: A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.Type: GrantFiled: July 16, 2019Date of Patent: October 5, 2021Assignee: Asia Vital Components Co., Ltd.Inventor: Wen-Ji Lan
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Patent number: 11069595Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages.Type: GrantFiled: July 16, 2019Date of Patent: July 20, 2021Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan
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Patent number: 11026346Abstract: A water-replenishing and gas-removing structure for water cooling device includes a flow-guiding main body having a water-receiving space as well as an inlet, an outlet, a first opening and a second opening, which are communicable with the water-receiving space. The first and the second valve member are located in the water-receiving space corresponding to the first and the second opening, respectively, for opening or closing them. The first and the second connecting member are connected at an end to the first and the second opening, respectively, and at another end to an external water-replenishing and an external gas-removing apparatus, respectively, via a pipe each. With these arrangements, cooling fluid can be replenished into and surplus gas can be removed from a water cooling device without the need of disassembling or reworking the water cooling device.Type: GrantFiled: April 23, 2018Date of Patent: June 1, 2021Inventor: Wen-Ji Lan
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Publication number: 20210088287Abstract: A water-cooling pump structure with check valves and a water-cooling module thereof including a first pump unit, a first check valve, a second pump unit, a second check valve, a first connector assembly, a second connector assembly, a pipe body assembly and a heat dissipation unit. The first and second check valves are respectively mounted at the first and second water outlets of the first and second pump units. By means of the arrangement of a first sealing member inside the first check valve, the cooling liquid is prevented from flowing back to the first pump chamber. Therefore, the problem of the backflow of the cooling liquid can be totally solved. Moreover, the heat dissipation efficiency can be greatly enhanced.Type: ApplicationFiled: September 20, 2019Publication date: March 25, 2021Inventor: Wen-Ji Lan
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Patent number: 10921067Abstract: A water-cooling radiator structure with internal partition member includes a water-cooling radiator unit, which includes a first water-receiving plate defining a first inner space and having a water inlet and a water outlet fluid-communicable with the first inner space. A working fluid flows into the first inner space via the water inlet and leaves the first inner space via the water outlet. The first inner space is internally provided with at least one first partition member, which horizontally divides the first inner space into a plurality of independent water chambers, so that the working fluid sequentially flow through the water chambers.Type: GrantFiled: January 11, 2018Date of Patent: February 16, 2021Assignee: Asia Vital Components Co., LTDInventor: Wen-Ji Lan
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Publication number: 20210018229Abstract: A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.Type: ApplicationFiled: July 16, 2019Publication date: January 21, 2021Inventor: Wen-Ji Lan
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Patent number: 10849251Abstract: A liquid transfer module is applied to a liquid cooling system. The liquid transfer module includes a first flow guide body and a second flow guide body removably connected with a liquid reservoir tank and a pump unit. The first and second flow guide bodies are formed with multiple internal flow passages. Some of the flow passages communicate with each other via a check valve and some other flow passages communicate with each other via an opening. The liquid transfer module serves to transfer and guide a working liquid to flow through the liquid reservoir tank and the pump unit.Type: GrantFiled: December 17, 2018Date of Patent: November 24, 2020Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan
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Publication number: 20200196483Abstract: A liquid transfer module is applied to a liquid cooling system. The liquid transfer module includes a first flow guide body and a second flow guide body removably connected with a liquid reservoir tank and a pump unit. The first and second flow guide bodies are formed with multiple internal flow passages. Some of the flow passages communicate with each other via a check valve and some other flow passages communicate with each other via an opening. The liquid transfer module serves to transfer and guide a working liquid to flow through the liquid reservoir tank and the pump unit.Type: ApplicationFiled: December 17, 2018Publication date: June 18, 2020Inventor: Wen-Ji Lan
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Publication number: 20190341337Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.Type: ApplicationFiled: July 16, 2019Publication date: November 7, 2019Inventor: Wen-Ji Lan
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Publication number: 20190327856Abstract: A water-replenishing and gas-removing structure for water cooling device includes a flow-guiding main body having a water-receiving space as well as an inlet, an outlet, a first opening and a second opening, which are communicable with the water-receiving space. The first and the second valve member are located in the water-receiving space corresponding to the first and the second opening, respectively, for opening or closing them. The first and the second connecting member are connected at an end to the first and the second opening, respectively, and at another end to an external water-replenishing and an external gas-removing apparatus, respectively, via a pipe each. With these arrangements, cooling fluid can be replenished into and surplus gas can be removed from a water cooling device without the need of disassembling or reworking the water cooling device.Type: ApplicationFiled: April 23, 2018Publication date: October 24, 2019Inventor: Wen-Ji Lan
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Publication number: 20190326197Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.Type: ApplicationFiled: April 23, 2018Publication date: October 24, 2019Inventor: Wen-Ji Lan
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Patent number: D950685Type: GrantFiled: June 21, 2019Date of Patent: May 3, 2022Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan
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Patent number: D1009813Type: GrantFiled: December 30, 2019Date of Patent: January 2, 2024Assignee: ASIA VITAL COMPONENTS CO., LTD.Inventor: Wen-Ji Lan