Patents by Inventor Wen-Ji Lan

Wen-Ji Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230013442
    Abstract: A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the above arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.
    Type: Application
    Filed: July 16, 2021
    Publication date: January 19, 2023
    Inventor: Wen-Ji Lan
  • Patent number: 11137175
    Abstract: A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: October 5, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Patent number: 11069595
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: July 20, 2021
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 11026346
    Abstract: A water-replenishing and gas-removing structure for water cooling device includes a flow-guiding main body having a water-receiving space as well as an inlet, an outlet, a first opening and a second opening, which are communicable with the water-receiving space. The first and the second valve member are located in the water-receiving space corresponding to the first and the second opening, respectively, for opening or closing them. The first and the second connecting member are connected at an end to the first and the second opening, respectively, and at another end to an external water-replenishing and an external gas-removing apparatus, respectively, via a pipe each. With these arrangements, cooling fluid can be replenished into and surplus gas can be removed from a water cooling device without the need of disassembling or reworking the water cooling device.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: June 1, 2021
    Inventor: Wen-Ji Lan
  • Publication number: 20210088287
    Abstract: A water-cooling pump structure with check valves and a water-cooling module thereof including a first pump unit, a first check valve, a second pump unit, a second check valve, a first connector assembly, a second connector assembly, a pipe body assembly and a heat dissipation unit. The first and second check valves are respectively mounted at the first and second water outlets of the first and second pump units. By means of the arrangement of a first sealing member inside the first check valve, the cooling liquid is prevented from flowing back to the first pump chamber. Therefore, the problem of the backflow of the cooling liquid can be totally solved. Moreover, the heat dissipation efficiency can be greatly enhanced.
    Type: Application
    Filed: September 20, 2019
    Publication date: March 25, 2021
    Inventor: Wen-Ji Lan
  • Patent number: 10921067
    Abstract: A water-cooling radiator structure with internal partition member includes a water-cooling radiator unit, which includes a first water-receiving plate defining a first inner space and having a water inlet and a water outlet fluid-communicable with the first inner space. A working fluid flows into the first inner space via the water inlet and leaves the first inner space via the water outlet. The first inner space is internally provided with at least one first partition member, which horizontally divides the first inner space into a plurality of independent water chambers, so that the working fluid sequentially flow through the water chambers.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: February 16, 2021
    Assignee: Asia Vital Components Co., LTD
    Inventor: Wen-Ji Lan
  • Publication number: 20210018229
    Abstract: A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.
    Type: Application
    Filed: July 16, 2019
    Publication date: January 21, 2021
    Inventor: Wen-Ji Lan
  • Patent number: 10849251
    Abstract: A liquid transfer module is applied to a liquid cooling system. The liquid transfer module includes a first flow guide body and a second flow guide body removably connected with a liquid reservoir tank and a pump unit. The first and second flow guide bodies are formed with multiple internal flow passages. Some of the flow passages communicate with each other via a check valve and some other flow passages communicate with each other via an opening. The liquid transfer module serves to transfer and guide a working liquid to flow through the liquid reservoir tank and the pump unit.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: November 24, 2020
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Publication number: 20200196483
    Abstract: A liquid transfer module is applied to a liquid cooling system. The liquid transfer module includes a first flow guide body and a second flow guide body removably connected with a liquid reservoir tank and a pump unit. The first and second flow guide bodies are formed with multiple internal flow passages. Some of the flow passages communicate with each other via a check valve and some other flow passages communicate with each other via an opening. The liquid transfer module serves to transfer and guide a working liquid to flow through the liquid reservoir tank and the pump unit.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 18, 2020
    Inventor: Wen-Ji Lan
  • Publication number: 20190341337
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190326197
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 24, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190327856
    Abstract: A water-replenishing and gas-removing structure for water cooling device includes a flow-guiding main body having a water-receiving space as well as an inlet, an outlet, a first opening and a second opening, which are communicable with the water-receiving space. The first and the second valve member are located in the water-receiving space corresponding to the first and the second opening, respectively, for opening or closing them. The first and the second connecting member are connected at an end to the first and the second opening, respectively, and at another end to an external water-replenishing and an external gas-removing apparatus, respectively, via a pipe each. With these arrangements, cooling fluid can be replenished into and surplus gas can be removed from a water cooling device without the need of disassembling or reworking the water cooling device.
    Type: Application
    Filed: April 23, 2018
    Publication date: October 24, 2019
    Inventor: Wen-Ji Lan
  • Patent number: 10451355
    Abstract: A heat dissipation element includes a first and a second housing, and a first and a second working fluid. The first housing has a first inner space. At least one pipe is formed on one side of the first housing and has a second inner space. The first and the second inner space are communicable and together define a first chamber. The second housing has a second chamber. A first and a second working fluid is, respectively, provided in the first and the second chamber. One side of the second housing is fixedly connected to one end of the pipe. The first and the second chamber are incommunicable. With these arrangements, the heat dissipation element not only can provide better heat spreading and heat transfer effect, but also can be produced at largely lower manufacturing costs.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 22, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: 10431524
    Abstract: A water cooling module includes a flow-guiding main body and a pump set. The flow-guiding main body includes a first inlet, a first outlet and a flow-guiding passage set. The flow-guiding passage set includes a plurality of flow-guiding passages, and the first inlet and the first outlet are respectively communicable with one of the flow-guiding passages. The pump set includes a first pump having a first water inlet and a first water outlet, and a second pump having a second water inlet and a second water outlet. The first water inlet and the first water outlet are respectively communicable with one of the flow-guiding passages; the second water inlet and the second water outlet are also respectively communicable with one of the flow-guiding passages. The flow-guiding main body replaces rubber pipes to guide working fluid without the problem of oxidized and leaked pipes while providing prolonged service life.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: October 1, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Publication number: 20190215986
    Abstract: A water-cooling radiator assembly includes a liquid-receiving plate unit and a first flow-disturbing unit. The liquid-receiving plate unit includes a first and a second liquid-receiving plate. The first liquid-receiving plate internally defines a first liquid chamber and has at least one liquid inlet provided thereon to communicate with the first liquid chamber, and a working liquid flows into the first liquid chamber via the at least one liquid inlet. The second liquid-receiving plate internally defines a second liquid chamber and has at least one liquid outlet provided thereon to communicate with the second liquid chamber. At least one communicating pipe is communicably connected to between the first and the second liquid chamber; and the first flow-disturbing unit is selectively arranged in one of the first and the second liquid chamber.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190212067
    Abstract: A multi-outlet-inlet laminated liquid-cooling heat dissipation structure includes a top plate, a bottom plate mated with the top plate, a substrate disposed between the top plate and the bottom plate and multiple communication passages. The substrate has an upper face, a lower face and at least one communication unit. The top plate and the upper face together define an upper liquid chamber. The bottom plate and the lower face together define a lower liquid chamber. The at least one communication unit passes through the substrate between the upper and lower faces to communicate with the upper and lower liquid chambers for a working fluid to flow through. Each communication passage has a communication opening in communication with the upper and lower liquid chambers as an inlet or an outlet of the working fluid.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190212076
    Abstract: A multi-outlet-inlet liquid-cooling heat dissipation structure includes a liquid-containing plate body assembly. The liquid-containing plate body assembly has an upper liquid-containing plate body having an upper liquid chamber, a lower liquid-containing plate body having a lower liquid chamber, a first communication tube communicating with the upper and lower liquid chambers for a working fluid to flow between the upper and lower liquid chambers and multiple communication passages. Each communication passage has a communication opening respectively in communication with the upper and lower liquid chambers as an inlet or an outlet of the working fluid.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Publication number: 20190212077
    Abstract: A water-cooling radiator structure with internal partition member includes a water-cooling radiator unit, which includes a first water-receiving plate defining a first inner space and having a water inlet and a water outlet fluid-communicable with the first inner space. A working fluid flows into the first inner space via the water inlet and leaves the first inner space via the water outlet. The first inner space is internally provided with at least one first partition member, which horizontally divides the first inner space into a plurality of independent water chambers, so that the working fluid sequentially flow through the water chambers.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 11, 2019
    Inventor: Wen-Ji Lan
  • Patent number: D950685
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: May 3, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan
  • Patent number: D1009813
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: January 2, 2024
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Wen-Ji Lan