Patents by Inventor Wen-Ji Lan

Wen-Ji Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120086321
    Abstract: A rotatable heat dissipating device includes a heat-transfer element and a heat-dissipation element. The heat-transfer element includes a flat main body, a heat transfer section extended from one face of the main body. The heat-dissipation element includes base having a recess provided on one face oriented toward the main body, a heat radiating section, and a connecting section extended between the base and the radiating section. The main body is rotatably received in and connected to the recess of the base, enabling the rotatable heat dissipating device to flexibly connect to a heat-producing unit in different directions without the need of using any external adaptor. Therefore, the rotatable heat dissipating device provides upgraded heat dissipation efficiency and can avoid thermal resistance due to too many adaptors between different elements.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Inventors: Wen-Ji Lan, Wei-Shan Deng
  • Publication number: 20120086322
    Abstract: An LED bulb heat dissipation structure includes a heat dissipation member and a heat conduction member. The heat dissipation member has a first main body, a heat dissipation section and an electrical conduction section. The heat dissipation section is arranged around the first main body and the electrical conduction section is disposed at one end of the first main body. The heat conduction member has a second main body upright protruding from the other end of the first main body. A heat conduction section is disposed along a periphery of the second main body. Multiple LED modules are disposed on the heat conduction section. The LED bulb heat dissipation structure is able to dissipate heat generated by the LED modules at higher heat dissipation efficiency and enlarge projection angle of the LED modules.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Inventors: Wen-Ji Lan, Xiao-Zhen Zeng
  • Publication number: 20120085765
    Abstract: A waterproof mechanism includes a seat body, a waterproof rubber ring and a board body. The seat body has a first receiving space and a second receiving space in communication therewith. The second receiving space is longer and wider than the first receiving space. A platform is formed at a junction between the first and second receiving spaces. An inclined sidewall extends from the platform to surround and define the second receiving space. The waterproof rubber ring is disposed in the second receiving space in tight abutment with the platform and formed with a perforation in communication with the first receiving space. The waterproof rubber ring has an inner periphery and an outer periphery. The inner periphery is formed with a connection channel for connecting with the board body. The outer periphery is formed with a protrusion section protruding from the outer periphery to the inclined sidewall in abutment therewith.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Inventor: Wen-Ji Lan
  • Publication number: 20110030920
    Abstract: A heat sink structure includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two wall surfaces of the main body. The heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body. The heat pipe has two opposite first and second ends respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and second ends and embedded in the heat dissipating body. With these arrangements, the heat sink structure has reduced weight and material cost while providing good heat dissipating effect.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 10, 2011
    Applicant: ASIA VITAL COMPONENTS (SHEN ZHEN) CO., LTD.
    Inventors: Teng-Zhi Qin, Wen-Ji Lan
  • Patent number: 7782619
    Abstract: A heat sink protective cover includes a main body, on which at least one receiving space is defined for receiving a heat sink therein. The receiving space includes at least one positioning section and a dust-proof section. The positioning section is located at two opposite inner wall surfaces of the receiving space. The dust-proof section includes a raised portion and a recess portion, the raised portion is extended along a periphery of the dust-proof section to limit the recess portion on four sides thereof, and the dust-proof section is located on a bottom of the receiving space. The heat sink is stably hold in place in the receiving space by the positioning section and isolated from dust by the dust-proof section, and can therefore be effectively protected against collision, damage, and contamination while being transported.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: August 24, 2010
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Wen-Ji Lan
  • Publication number: 20100177481
    Abstract: A heat sink protective cover includes a main body, on which at least one receiving space is defined for receiving a heat sink therein. The receiving space includes at least one positioning section and a dust-proof section. The positioning section is located at two opposite inner wall surfaces of the receiving space. The dust-proof section includes a raised portion and a recess portion, the raised portion is extended along a periphery of the dust-proof section to limit the recess portion on four sides thereof, and the dust-proof section is located on a bottom of the receiving space. The heat sink is stably hold in place in the receiving space by the positioning section and isolated from dust by the dust-proof section, and can therefore be effectively protected against collision, damage, and contamination while being transported.
    Type: Application
    Filed: January 15, 2009
    Publication date: July 15, 2010
    Inventor: Wen-Ji Lan
  • Publication number: 20080298012
    Abstract: A holding base for a radiator assembly includes a frame, at least a secure part and at least a threaded part. The frame is attached to a circuit board and provides a space for receiving a heat generating component on the circuit board. The secure part provides an elongated projection rib at two lateral sides of said frame and provides an engaging block at the middle of the projection rib for engaging with the first type radiator assembly. The threaded part is disposed at the frame for being joined to the second type radiator assembly with a threaded fastener.
    Type: Application
    Filed: June 4, 2007
    Publication date: December 4, 2008
    Inventor: WEN-JI LAN
  • Publication number: 20070286722
    Abstract: A method of manufacturing an air duct is provided. First, a plastic material is heated until the plastic material is melted. Next, the molten plastic material is sucked into a mold and then the molten plastic material inside the mold is cooled to form the air duct. Finally, the air duct is removed from the mold. The air duct comprises a housing including passageway for air to flow there-through, a first air inlet/outlet formed on a side thereof, and a joint portion formed on another side thereof corresponding to the first air inlet/outlet to fix to a fan. The joint portion has a second air inlet/outlet. When the fan rotates, airflow is generated, which carries the heat generated by the operation of the devices via the second air inlet/outlet and then exits out via the first air inlet/outlet.
    Type: Application
    Filed: June 12, 2006
    Publication date: December 13, 2007
    Applicant: ASIA VITAL COMPONENTS CO.,LTD.
    Inventor: Wen-Ji Lan